Showing posts with label Toshiba. Show all posts
Showing posts with label Toshiba. Show all posts

Tuesday, February 8, 2022

Toshiba aims for HDDs with 30TB by 2023, 40TB by 2026

Toshiba published the following roadmap for its next-generation Nearline HDDs. 

Toshiba plans to leverage its proprietary recording technologies, FC-MAMR (Flux-Controlled - Microwave-Assisted Magnetic Recording), MAS-MAMR (Microwave Assisted Switching – Microwave-Assisted Magnetic Recording), and Disk Stacking technology to lift Nearline HDD capacities to 30TB by FY2023, and greater capacities beyond.

“Toshiba continues to work closely with the cloud companies to understand their exact capacity and performance requirements, and the ability to utilize our next-generation technologies will be key to meeting our customers’ needs,” said Raghu Gururangan, Toshiba America Electronic Components, Inc. Vice President, Engineering & Product Marketing. “Many years of close collaboration work with our key component suppliers is leading to impactful technology breakthroughs to achieve higher capacities, which ultimately reduces TCO (total cost of ownership) of our Nearline HDDs.”

http://toshiba.semicon-storage.com/us/product/storage-products.html

Sunday, February 6, 2022

Toshiba plans major expansion of power semiconductor fab

Toshiba Electronic Devices & Storage Corporation  will construct a new 300-milimeter wafer fabrication facility for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture. The project will increase Toshiba's power semiconductor production capacity 2.5 times.

Construction will take place in two phases, allowing the pace of investment to be optimized against market trends, with the production start of Phase 1 scheduled for within fiscal 2024.

The new fab will have a quake absorbing structure; enhanced BCP systems, including dual power supply lines; and the latest energy saving manufacturing equipment to reduce environmental burdens. It will also aim to achieve the “RE100” goal of 100% reliance on renewable energy. Product quality and production efficiency will be improved by introducing artificial intelligence and automated wafer transportation systems.



Tuesday, January 11, 2022

Toshiba adds to its line-up of Ethernet Bridge ICs for automotive

Toshiba Electronic Devices & Storage Corporation introduced a new device in its line-up of Ethernet bridge ICs to provide support for 10Gbps communications in automotive information communications systems and industrial equipment. Sample shipments have started and volume production will start in August 2022.

The new bridge IC has Toshiba’s first 2-port 10Gbps Ethernet, and the interface can be selected from USXGMII, XFI, SGMII, and RGMII. The two ports support Ethernet AVB and TSN, which facilitate real-time processing and synchronous processing, respectively. They also support “simplified” SR-IOV (virtual functions). 

Toshiba said its new IC can be used not only for zone architecture but also for various automotive applications such as IVI and telematics, and also in industrial equipment. It is also postioned to be a successor to current TC9560 and TC9562 series products supporting 1Gbps Ethernet.

The new device offers three PCIe Gen 3 switch ports for communications with the host SoC and connection to devices equipped with PCIe interfaces. The PCIe switch part is configured with one 4-lane upstream port for connection with the host SoC and two 1-lane downstream ports for connection to devices with a PCIe interface. Using the 3-port PCIe switch function for connections to such devices can help mitigate PCIe interface shortages.

Wednesday, December 8, 2021

Toshiba launches 18TB NAS hard disk drive

Toshiba Electronic Devices & Storage Corporation began shipping a massive capacity 18TB NAS hard disk drive for home offices and small businesses.

MN09 is a 9-disk helium-sealed conventional magnetic recording (CMR) drive that leverages Toshiba’s new innovative Flux Control Microwave-Assisted Magnetic Recording (FC-MAMR) technology. FC-MAMR™ advances CMR capacity to 18TB and delivers increased density per platter over previous designs. The MN09 is the 3rd generation to use Toshiba’s pioneering 9-disk helium-sealed mechanical design. MN09 is engineered for 24/7 operation and has a workload rating of 180TB/year.

The 7200RPM 18TB NAS drive is designed with a 512MB buffer and delivers a consistent high level of performance with a sustained transfer rate of 268 MiB/s.

MAMR technology is one solution that extends HDD data capacities. The ability of HDD using a new MAMR head to significantly improve the write ability of the Microwave Assisted Switching (MAS) effect has been developed recently. Toshiba will continue to satisfy market demand and to advance CMR drive data densities with MAMR technology.







Thursday, October 21, 2021

Toshiba shrinks quantum key distribution onto a chip

 Researchers at Toshiba Europe have developed the world’s first chip-based quantum key distribution (QKD) system, potentially paving the way for much more secure networks.

QKD systems typically comprise a complex fibre-optic circuit, integrating discrete components, such as lasers, electro-optic modulators, beam-splitters and fibre couplers. This project aimed to develop a QKD system on a single chip. Random bits for preparing and measuring the qubits are produced in quantum random number generator (QRNG) chips and converted in real-time into high-speed modulation patterns for the chip-based QKD transmitter (QTx) and receiver (QRx) using field-programmable gate arrays (FPGAs). Photons are detected using fast-gated single photon detectors. Sifting, photon statistics evaluation, time synchronisation and phase stabilisation are done via a 10 Gbps optical link between the FPGA cores, enabling autonomous operation over extended periods of time. As part of the demonstration, the chip QKD system was interfaced with a commercial encryptor, allowing secure data transfer with a bit rate up to 100 Gbps.

To promote integration into conventional communication infrastructures, the QKD units are assembled in compact 1U rackmount cases. The QRx and QTx chips are packaged into C-form-factor-pluggable-2 (CFP2) modules, a widespread form-factor in coherent optical communications, to ensure forward compatibility of the system with successive QKD chip generations, making it easily upgradeable. Off-the-shelf 10 Gbps small-form-factor pluggable (SFP) modules are used for the public communication channels.


Taofiq Paraiso, lead author of the Nature Photonics paper describing the chip-scale QKD system, says: “We are witnessing with photonic integrated circuits a similar revolution to that which occurred with electronic circuits. PICs are continuously serving more and more diverse applications. Of course, the requirements for quantum PICs are more stringent than for conventional applications, but this work shows that a fully deployable chip-based QKD system is now attainable, marking the end of an important challenge for quantum technologies. This opens a wide-range of perspectives for the deployment of compact, plug-and-play quantum devices that will certainly strongly impact our society.”

Andrew Shields, Head of Quantum Technology at Toshiba Europe, remarked, “Photonic integration will allow us to manufacture quantum security devices in volume in a highly repeatable fashion. It will enable the production of quantum products in a smaller form factor, and subsequently allow the roll out of QKD into a larger fraction of the telecom and datacom network.”

Taro Shimada, Corporate Senior Vice President and Chief Digital Officer of Toshiba Corporation comments, “Toshiba has invested in quantum technology R&D in the UK for over two decades. This latest advancement is highly significant, as it will allow us to manufacture and deliver QKD in much larger quantities. It is an important milestone towards our vision of building a platform for quantum-safe communications based upon ubiquitous quantum security devices.”

http://www.quantum.toshiba.co.uk

BT and Toshiba to build quantum-secured metro network across London

BT and Toshiba are to build a quantum-secured metro network linking sites in London’s Docklands, the City and the M4 Corridor.  The two companies’ initial focus will be to provide trials for enterprise customers who are carrying sensitive traffic (such as database backups) between sites, and to explore potential future offerings such as encrypted links and “quantum keys-as-a-service."  A timeline has not been disclosed.

BT will provide data services secured using Quantum Key Distribution (QKD) and Post-Quantum Cryptography (PQC) over Openreach’s Optical Spectrum Access Filter Connect (OSA FC) solution for private fibre networks. The QKD links will be provided using a quantum network that includes both core and access components, and will be integrated into BT’s existing network management operations. 

Toshiba will provide quantum key distribution hardware and key management software. The company launched commercial products for QKD, manufactured at its Cambridge site, in the latter half of 2020. Toshiba says it has achieved the highest key rates (1,000’s of keys per second) and longest range of any commercially available fibre QKD system.

While BT and Toshiba have previously installed a point-to-point quantum-secure link between two commercial sites, deploying a full quantum-secured metro network environment with multiple endpoints requires new approaches to integration and management. 

Building on the BT and Toshiba point-to-point solution for the Bristol-based NCC (National Composites Centre) and Centre for Modelling and Simulation (CFMS), this new network will extend the solution to serve multiple customers across the London metropolitan area.  

Howard Watson, CTO of BT, said: “BT and Toshiba have established a global lead in the development of quantum-secure networks. We’re excited to be taking this collaboration to the next level by building the world’s first commercially operational quantum-secured metro network in London. Secure, robust and trusted data transfer is increasingly crucial to our customers across the globe, so we’re proud of the role our Quantum R&D programme is playing in making the world’s networks safer as we enter the dawn of a new age of quantum computing.”

Taro Shimada, Corporate Senior Vice President and Chief Digital Officer at Toshiba Corporation, said: “Our partnership with BT will allow us to offer organisations quantum-secured network services which protect their data from retrospective attacks with a quantum computer. We are delighted to work with BT, with its long heritage of delivering secure, trusted networks. This network paves the way for commercial QKD services in the UK and eventually beyond.”


ADVA FSP 3000 powers UK’s first quantum network

ADVA's FSP 3000 platform is powering a metro transport system in the city of Cambridge that is being used for the UK's first quantum network. The project, which is conducted by the UK National Quantum Technologies Programme, super-encrypts data using quantum key distribution (QKD) for complete and long-term cryptographic data security. ADVA said the openness of its ADVA FSP 3000 platform, which can accept keys from third-party systems utilizing...

Toshiba Research, BT and ADVA Test ‘Quantum Leap’ Encryption

Toshiba Research Europe, BT, ADVA Optical Networking and the National Physical Laboratory (NPL), the UK’s National Measurement Institute, have tested Quantum Key Distribution (QKD) technology over a live fibre network. BT said the idea behind the trial is to leverage the principles of quantum mechanics in transmitting encryption key information. Any attempt to intercept the key can be identified, as it introduces anomalies which can be detected....

Thursday, October 7, 2021

BT and Toshiba to build quantum-secured metro network across London

BT and Toshiba are to build a quantum-secured metro network linking sites in London’s Docklands, the City and the M4 Corridor.  The two companies’ initial focus will be to provide trials for enterprise customers who are carrying sensitive traffic (such as database backups) between sites, and to explore potential future offerings such as encrypted links and “quantum keys-as-a-service."  A timeline has not been disclosed.

BT will provide data services secured using Quantum Key Distribution (QKD) and Post-Quantum Cryptography (PQC) over Openreach’s Optical Spectrum Access Filter Connect (OSA FC) solution for private fibre networks. The QKD links will be provided using a quantum network that includes both core and access components, and will be integrated into BT’s existing network management operations. 

Toshiba will provide quantum key distribution hardware and key management software. The company launched commercial products for QKD, manufactured at its Cambridge site, in the latter half of 2020. Toshiba says it has achieved the highest key rates (1,000’s of keys per second) and longest range of any commercially available fibre QKD system.

While BT and Toshiba have previously installed a point-to-point quantum-secure link between two commercial sites, deploying a full quantum-secured metro network environment with multiple endpoints requires new approaches to integration and management. 

Building on the BT and Toshiba point-to-point solution for the Bristol-based NCC (National Composites Centre) and Centre for Modelling and Simulation (CFMS), this new network will extend the solution to serve multiple customers across the London metropolitan area.  

Howard Watson, CTO of BT, said: “BT and Toshiba have established a global lead in the development of quantum-secure networks. We’re excited to be taking this collaboration to the next level by building the world’s first commercially operational quantum-secured metro network in London. Secure, robust and trusted data transfer is increasingly crucial to our customers across the globe, so we’re proud of the role our Quantum R&D programme is playing in making the world’s networks safer as we enter the dawn of a new age of quantum computing.”

Taro Shimada, Corporate Senior Vice President and Chief Digital Officer at Toshiba Corporation, said: “Our partnership with BT will allow us to offer organisations quantum-secured network services which protect their data from retrospective attacks with a quantum computer. We are delighted to work with BT, with its long heritage of delivering secure, trusted networks. This network paves the way for commercial QKD services in the UK and eventually beyond.”


ADVA FSP 3000 powers UK’s first quantum network

ADVA's FSP 3000 platform is powering a metro transport system in the city of Cambridge that is being used for the UK's first quantum network. The project, which is conducted by the UK National Quantum Technologies Programme, super-encrypts data using quantum key distribution (QKD) for complete and long-term cryptographic data security. ADVA said the openness of its ADVA FSP 3000 platform, which can accept keys from third-party systems utilizing...

Toshiba Research, BT and ADVA Test ‘Quantum Leap’ Encryption

Toshiba Research Europe, BT, ADVA Optical Networking and the National Physical Laboratory (NPL), the UK’s National Measurement Institute, have tested Quantum Key Distribution (QKD) technology over a live fibre network. BT said the idea behind the trial is to leverage the principles of quantum mechanics in transmitting encryption key information. Any attempt to intercept the key can be identified, as it introduces anomalies which can be detected....


Wednesday, February 17, 2021

Toshiba intros 18TB HDDs

Toshiba Electronic Devices & Storage announced its 18TB MG09 Series HDD with a new energy-assisted magnetic recording technology. 

The new drives feature Toshiba’s third-generation, 9-disk helium-sealed design and Toshiba’s  Flux Control – Microwave Assisted Magnetic Recording (FC-MAMR) technology, to advance Conventional Magnetic Recording (CMR) density to 2TB per disk, achieving a total capacity of 18TB.

Sample shipments of 18TB MG09 Series HDD to customers are expected to start sequentially at the end of March 2021.

“Toshiba’s new 18TB MG09 Series delivers new levels of storage density and power efficiency to our cost-conscious cloud-scale and storage solutions customers. Our HDD technology is able to achieve our customers’ critical TCO objectives at a cost of pennies per GB,” said Shuji Takaoka, General Manager of the Storage Products Sales & Marketing Division at Toshiba Electronic Devices & Storage Corporation. “Our 3rd generation 9-disk helium-sealed design provides a field-tested foundation for achieving a massive 18TB capacity. The addition of Toshiba’s innovative FC-MAMR technology advances CMR capacity to 18TB, delivering compatibility with the widest range of applications and operating environments.”


Tuesday, August 6, 2019

Toshiba's PCIe 4.0 SSD boasts 6.4GB/s read time, up to 30TB capacity

At this week's Flash Memory Summit in Santa Clara, California, Toshiba Memory is showcasing the industry’s fastest-class PCIe 4.0 NVMe SSDs for enterprise applications.

The drives achieve a sequential read performance of over 6.4GB/s. The CM6 Series SSDs support dual-port PCIe Gen4 x4 lanes and are NVMe 1.4 compliant. The family of enterprise NVMe SSDs will be available in a 2.5-inch form factor with capacity points from 800GB to 30TB, and 1 or 3 drive writes per day endurance options.

Monday, August 5, 2019

Toshiba intros highest-performing NAND

Toshiba Memory America launched of a new Storage Class Memory (SCM) called "XL-FLASH" that is based on its BiCS FLASH 3D flash memory and sits between DRAM and NAND flash.

The new XL-FLASH is designed for low latency and high performance in data center and enterprise storage. Sample shipments will start in September, with mass production expected to begin in 2020. XL-FLASH will initially be deployed in an SSD format but could be expanded to memory channel attached devices that sit on the DRAM bus, such as future industry standard non-volatile dual in-line memory modules (NVDIMMs).

Key Features

  • 128 gigabit (Gb) die (in a 2-die, 4-die, 8-die package)
  • 4KB page size for more efficient operating system reads and writes
  • 16-plane architecture for more efficient parallelism
  • Fast page read and program times. XL-FLASH provides a low read latency of less than 5 microseconds, approximately 10 times faster than existing TLC2



Thursday, February 21, 2019

Toshiba develops bridge chip using PAM 4 to boost SSD speed and capacity

Toshiba Memory has developed a bridge chip for connecting flash memory chips into faster and higher capacity SSDs.

In SSDs, multiple flash memory chips are connected to a controller that manages their operation. As more flash memory chips are connected to a controller interface, operating speed degrades, so there are limits to the number of chips that can be connected. In order to increase capacity, it is necessary to increase the number of interfaces, but that results in an enormous number of high-speed signal lines connected to the controller, making it more difficult to implement the wiring on the SSD board.

Toshiba said it has overcome this problem with the development of a bridge chip that connects the controller and flash memory chips (Fig. 1), three novel techniques: a daisy chain connection including the controller and bridge chips in a ring shape; a serial communication using PAM 4; and a jitter improvement technique for eliminating a PLL circuit in the bridge chips. By using these techniques overhead of the bridge chips is reduced, and it is possible to operate a large number of flash memory chips at high speed with only a few high-speed signal lines.

The ring-shape configuration of the bridge chips and the controller reduces the number of transceivers required in the bridge chip from two pairs to one pair, it achieves chip area reduction of the bridge chip. In addition, adopting PAM 4 serial communication between the controller and the daisy-chained bridge chips lowers the operating speed in the bridge chips’ circuits and relaxes their required performance.

The prototype bridge chips were fabricated with 28nm CMOS process, and results were evaluated by connecting four bridge chips and a controller in ring-shape daisy chain.

Monday, January 21, 2019

Toshiba expands line of automotive Ethernet ICs

Toshiba Electronic Devices & Storage expanded its lineup of automotive Ethernet bridge portfolio with new “TC9562 series” ICs. Sample shipments will start in February, and volume production will start in October.

The Ethernet AVB specification offers real-time reliable data transmission and is increasingly used in vehicles. Toshiba currently offers the TC9560 series of Gigabit Ethernet (10/100/1000Mbps) solutions compliant with IEEE 802.1AS[3] and IEEE 802.1Qav.

https://toshiba.semicon-storage.com/ap-en/product/automotive/interface-bridge.html

Monday, January 7, 2019

Toshiba announces 16TB HDDs for cloud data centers

Toshiba Electronic Devices & Storage introduced a 16TB Conventional Magnetic Recording (CMR) HDD -- a new industry record, according to the company, and 14% more capacity than prior 14TB models. The drive is optimized for mixed random and sequential read and write workloads in both cloud and traditional data center environments.

The MG08 Series is Toshiba’s second-generation helium-sealed HDD family, and eighth-generation Enterprise Capacity HDD family. It uses a 9-disk helium design and features 7,200rpm performance, a 550TB per year workload rating, a 2.5 million-hour MTTF, a 512Mib cache buffer, and a choice of SATA and SAS interfaces—all in an industry-standard, 3.5-inch form factor.

“Toshiba’s new 16TB MG08 Series delivers new levels of storage capacity and density while delivering improved power efficiency for our cloud-scale and storage solutions customers. Only high-density HDD technology can achieve our customers’ critical TCO objectives at a cost of pennies per GB”

Friday, December 7, 2018

Toshiba adds 12TB and 14TB drives for NAS

Toshiba America Electronic Components introduced 12TB and 14TB models to both its N300 NAS Hard Drive and X300 Performance Hard Drive series.

Both are 3.5-inch mechancial drives employing a helium-sealed design. They operate at 7,200rpm and come with an ultra-high 256MB data buffer. Toshiba said both the N300 NAS and X300 models use its advanced Stable Platter Technology to minimize vibrations by stabilizing the motor shaft at both ends for improved tracking accuracy and maximum performance during read and write operations.

The N300 NAS models include rotational vibration (RV) sensors and are made to deliver sustained data transfer speeds up to 260MB/s for 14TB or up to 253MB/s for 12TB. With support for up to 8HDD multi-RAID systems, the new N300 models are highly scalable to the users’ NAS configurations as their data storage needs evolve and large amounts of data need to be efficiently stored and accessed daily.

Tuesday, November 6, 2018

Toshiba Memory targets deep learning processing

Toshiba Memory Corporation has developed a high-speed and high-energy-efficiency algorithm and hardware architecture for deep learning processing with less degradations of recognition accuracy. The company is developing a new processor for deep learning implemented on an FPGA.

In addition, Toshiba Memory is working on a new hardware architecture, called bit-parallel method, which is suitable for MAC operations with different bit precision. This method divides each various bit precision into a bit one by one and can execute 1-bit operation in numerous MAC units in parallel. It significantly improves utilization efficiency of the MAC units in the processor compared to conventional MAC architectures that execute in series.

Tuesday, August 7, 2018

Toshiba develops Ethernet-Attached Native NVMe-oF SSD

Toshiba Memory introduced an native NVMe over Fabrics (NVMe-oF) SSD for direct Ethernet access based on the NVMe-oF Specification Version 1.0.

Toshiba Memory's new SSD is powered by the Marvell 88SN2400 NVMe-oF SSD converter controller, enabling dual-port 25Gbps Ethernet connectivity of high-performance U.2 NVMe SSDs. This makes it suitable for cloud data centers and enterprise data centers.

At this week's Flash Memory Summit in Santa Clara, California, Toshiba Memory is showing an Ethernet JBOF prototype chassis that was developed and built by Aupera Technologies. The JBOF is powered by 1+1 redundant 100Gbit Ethernet switch units with dual 6x100 Gbit Ethernet uplinks, which enables 16M IOPS system performance (4KB Random Read), the fastest ever seen in the industry[2].

Monday, July 23, 2018

Toshiba ships NVMe SSDs based on 3D Flash

Toshiba Memory Corporation launched its first NVM Express SSDs utilizing 96-layer, fourth generation, 3D BiCS FLASH memory technology.

The new XG6 series client SSDs features a PCI Express (PCIe) Gen3 x 4Lane and NVM Express (NVMeTM) 1.3a interface. The XG6 series delivers sequential write performance of up to 2960 MB/s in client SSDs. Sequential read performance is up to 3180 MB/s, up to 355,000 random read and 365,000 random write IOPS. The power consumption is maximum 4.7W in active mode and 3mW during stand-by in the lowest power mode, which makes it suitable for power-sensitive mobile PCs.

The new SSDs will be available in three capacities, 256GB, 512GB and 1024GB, all on a single-sided M.2 2280-S2 form factor.

Thursday, July 19, 2018

Toshiba and Western Digital announce 96-layer BiCS FLASH memory

Toshiba announced 96-layer BiCS FLASH, its proprietary 3D flash memory, with 4-bit-per-cell (quad level cell, QLC) technology that boosts single-chip memory capacity to the highest level yet achieved. The advancement pushes the bit count for data per memory cell from three to four, thus significantly expanding capacity. The new product achieves the industry's maximum capacity of 1.33 terabits for a single chip which was jointly developed with Western Digital Corporation.
A capacity of 2.66 terabytes can be achieved with a 16-chip stacked architecture in one package.

Toshiba Memory will begin sampling to SSD and SSD controller manufacturers from the beginning of September, and expects to start mass production in 2019.


Separately, Western Digital announced its second-generation, four-bits-per-cell architecture for 3D NAND using 96-layer BiCS4 technology. BiCS4 was developed at the joint venture flash manufacturing facility in Yokkaichi, Japan in partnership with Toshiba Memory Corporation. Consumer products marketed under the SanDisk brand are expected to begin shippint this year. Western Digital expects to deploy BiCS4 in a wide variety of applications from retail to enterprise SSDs.

Tuesday, July 10, 2018

Toshiba debuts 14TB HDD for data centers

Toshiba Electronic Devices & Storage Corp. announced 14TB and 12TB HDD SATA models for data center storage.

The MG07ACA Series features both 14TB 9-disk and 12TB 8-disk models. The helium-sealed 3.5-inch mechanical design realizes better storage density and a lower HDD operating power profile, achieving a 40% increase in maximum capacity and 50% better power efficiency (W/GB) over 10TB HDD models.

The drives have been qualified for installation on select Supermicro storage servers.

“As we continue to develop solutions to meet the growing capacity needs of enterprise and cloud data center customers, Toshiba is pleased to be working with Supermicro on solutions utilizing our new MG07ACA Series helium-sealed HDD,” said Shuji Takaoka, General Manager of Storage Products Sales & Marketing Division at Toshiba Electronic Devices & Storage Corporation. “Toshiba’s innovative, power-efficient 9-disk design delivers the highest capacity available in the market today using conventional magnetic recording, and matches up well with Supermicro’s highly-regarded lineup of server and storage solutions.”

Tuesday, June 19, 2018

Toshiba launches lower cost SAS SSDs for servers

Toshiba introduced a new category of SAS SSDs to replace SATA SSDs in servers.

The RM5 12Gbit/s value SAS (vSAS) series feature Toshiba's BiCS FLASH TLC (3-bit-per-cell) 3D flash memory and will initially be available in capacities up to 7.68TB in a 2.5” form factor.

Toshiba said the new drives offer capacity, performance, reliability, manageability and data security advantages – at a price that obsoletes SATA SSDs.

Tuesday, May 29, 2018

Toshiba debuts portable SSDs based on 64-layer 3D Flash

Toshiba Memory America introduced its XS700 Series of portable solid state drives (SSDs) offering capacity of up to 240GB.

The new drives use Toshiba's in-house 3D flash memory, 64-layer BiCS FLASH technology. The XS700 includes USB 3.1 Gen 2 support, and features the latest USB Type-CTM connector.