AWS PrivateLink now extends to 3rd party SaaS apps

Earlier this month, Amazon Web Services introduced the ability for customers to access AWS services over AWS PrivateLink. Now AWS is extending PrivateLink to let users access third-party SaaS applications from their Virtual Private Cloud (VPC) without exposing their VPC to the public Internet. Traffic stays within the AWS network, reducing threat vectors such as “brute force” and distributed-denial-of-service (DDoS) attacks. Services supported on...

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AWS launches its own security service with Amazon GuardDuty

Amazon Web Services (AWS) introduced a fully managed intelligent threat detection service for protecting their AWS accounts and workloads by continuously monitoring account activity for malicious or unauthorized behavior. Amazon GuardDuty continuously applies machine learning to identify any events that fall outside the normal patterns. AWS said it is using both proprietary, AWS-developed threat intelligence sources and industry-leading third-party...

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Turner picks AWS to reengineer digital content distribution

Turner, which is the  Time Warner global entertainment, sports, and news company, has selected AWS as its preferred cloud provider. Turner's properties include TBS, TNT, Cartoon Network, Adult Swim, CNN, NCAA, and NBA. Turner is reengineering its end-to-end media supply chain on AWS.  The company is looking for a more secure, cost effective, and elastic way to distribute digital content to its customers. The effort includes moving decades...

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Google plans cloud data center in Hong Kong

Google Cloud Platform will open a new data center region in Hong Kong in 2018. The GCP Hong Kong region is being designed for high availability, launching with three zones to protect against service disruptions. Hong Kong will be the sixth GCP region in Asia Pacific, joining the recently launched Mumbai, Sydney, and Singapore regions, as well as Taiwan and Tokyo. Google says it has other Asia Pacific investments in the wor...

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Samsung begins 10nm FinFET Process Production

Samsung Electronics Co. announced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology. The new 10LPP (Low Power Plus)process technology boasts up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early). Samsung also announced that its newest manufacturing line, S3, located in Hwaseong,...

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Western Digital backs RISC-V

Western Digital pledged its support for the RISC-V, an open and scalable compute architecture. The company plans to transition future core, processor, and controller development to the RISC-V architecture. Western Digital currently consumes over one billion processor cores on an annual basis across its product portfolio. The transition will occur gradually and once completely transitioned, Western Digital expects to be shipping two billion RISC-V...

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Toshiba samples 64-Layer, 3D Flash Memory

Toshiba Memory Corporation started sampling Universal Flash Storage (UFS) devices based on 64-layer, BiCS FLASH 3D flash memory. Four capacities are offered 32GB, 64GB, 128GB and 256GB. Target applications include mobile devices such as smartphones and tablets, and augmented and virtual reality systems. The devices boast a theoretical interface speed of up to 5.8Gbps per lane (x2 lanes = 11.6Gbps) while also suppressing any increase in power consumption....

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