Wednesday, March 20, 2024

Intel to receive up to $8.5 billion under CHIPS and Science Act

The U.S. Department of Commerce has proposed up to $8.5 billion in direct funding through the CHIPS and Science Act to advance Intel’s commercial semiconductor projects in Arizona, New Mexico, Ohio and Oregon.

In addition, under a non-binding preliminary memorandum of terms (PMT), Intel would have the option to draw upon federal loans of up to $11 billion. Intel also plans to claim the U.S. Treasury Department’s Investment Tax Credit (ITC), which is expected to be up to 25% of qualified investments of more than $100 billion over five years. 

CHIPS Act proposed funding would support Intel’s investments in Arizona, the Silicon Desert; New Mexico, the Silicon Mesa; Ohio, the Silicon Heartland; and Oregon, the Silicon Forest.

“Today is a defining moment for the U.S. and Intel as we work to power the next great chapter of American semiconductor innovation,” said Intel CEO Pat Gelsinger. “AI is supercharging the digital revolution and everything digital needs semiconductors. CHIPS Act support will help to ensure that Intel and the U.S. stay at the forefront of the AI era as we build a resilient and sustainable semiconductor supply chain to power our nation’s future.”

RANOVUS delivers 6.4Tbps Co-Packaged optics with integrated laser

Ranovus has delivered a 6.4Tbps co-packaged optics solution fo MediaTek’s next generation ASIC design platform.

Ranovus says its Odin CPO 3.0 reduces power consumption, footprint, and cost of the system by 50% compared to existing solutions. The solution enables a 6.4Tbps high-radix optical interconnect for AI/ML SoC and Ethernet applications.

  • Ranovus’ monolithic Electro-Photonic Integrated Circuit (EPIC) is a single chip that includes 100Gbps TIAs, Drivers, Silicon Photonics Modulaters and Photo detectors. 
  • Odin CPO 3.0 includes optical features that enables passive fiber and laser die attach on the EPIC die at scale.
  • Ranovus Odin IP cores are available for development of a new category of Application Specific Optical Engines (ASOE) for high capacity AI/ML workloads.

“The emergence of Generative AI has not only resulted in significant demand for higher memory bandwidth and capacity, but also demand for higher I/O density and speeds.” said Jerry Yu, Senior Vice President at MediaTek. “Integration of electrical and optical I/O is the latest technology that allows MediaTek to deliver the most flexible leading edge data center ASIC solutions.”

“Working together with MediaTek to realize this next-genera`on CPO plaaorm has helped usher in a new era for high-density op`cal interconnect in the AI/ML and Ethernet ecosystem,” said Hojjat Salemi, Chief Business Development Officer at Ranovus. “This plaaorm will play a cri`cal role in accelera`ng data movement in scale up/scale out AI/ML SoCs and Ethernet.”

#OFC24: OpenLight teams with Jabil on silicon photonics manufacturing

OpenLight is working with Jabil to accelerate the silicon photonics manufacturing landscape, eliminating associated supply chain challenges and meeting the volume demands of high-bandwidth components for the broad markets both companies serve.

OpenLight's PASIC technology integrates all the components of silicon photonics devices, both active and passive components, into one chip.

Jabil offers global manufacturing services.

Through this collaboration, OpenLight customers can fast-track the manufacturing and delivery of integrated PICs across a wide variety of applications and markets, including datacom transceivers, automotive LiDAR, AI/ML, HPC, and healthcare.

"We are very pleased to work with such a prominent global leader in high-volume manufacturing and together, we look forward to enabling a holistic path for our customers to take our PASIC wafers to packaged solutions for the markets and applications we serve," said Dr. Adam Carter, CEO of OpenLight. "This will simplify the management of our customers' supply chain, paving the way for scalability as their business grows."

"As we continue to invest and grow our existing capabilities for manufacturing optical solutions for our customers, we are excited to partner with OpenLight and leverage its unique business model to produce PASIC solutions. Combining their expertise with Jabil's high-volume experience in optical packaged solutions, we're poised to deliver exceptional value to our customers," said Matt Crowley, SVP Cloud and Enterprise Infrastructure of Jabil. "At Jabil, we also have the ability to take these PICs and build them into a wide variety of packaged solutions per our customer's requirements."

HyperLight expands electro-optical modulator line

 HyperLight is expanding its line of integrated electro-optical modulators (EOMs).

  • Last year, HyperLight introduced the industry’s first 110 GHz Intensity Modulator which is connectorized with a W-type (1.0 mm) RF connector and standard single-mode-fiber connectors. It is currently deployed in key sectors including test and measurement, R&D, and radio-over-fiber.
  • HyperLight is adding a new low half-wave-voltage (Vπ) 65 GHz Intensity Modulator to its modulator line-up. It features a record-low Vπ of 1.4 V and utilizes a V-type (1.85 mm) RF connector. By combining breakthrough Vπ with industry-competitive pricing and wavelength coverage across O, C, and L bands, this modulator provides a compelling alternative to traditional solutions at this frequency range.
  • Concurrently, HyperLight is unveiling the 20 GHz Ultra Low Vπ Intensity Modulator, achieving a groundbreaking Vπ of < 1V while maintaining low insertion loss. This level of performance, previously unattainable in the commercial market, is set to redefine the landscape for radio-over-fiber applications, notably within aerospace and defense, as well as in the advancement of 5G/6G technologies. By significantly reducing the noise figure in the radio-over-fiber link, HyperLight’s sub-Volt Vπ EOMs promise to be transformative.                                                                                                                        

 HyperLight's modulators are based on proprietary high-bandwidth and low-voltage thin film lithium niobate (TFLN) PIC technology. With nearly a decade of leadership and innovation in TFLN technology development, the HyperLight team has perfected the designs and manufacturing processes that enable unprecedented performance levels in its product offerings.


“HyperLight's cutting-edge TFLN technology and 110GHz EOM have enabled Thorlabs to bring to market the MX110 line of high-bandwidth transmitter products that meet the ever-advancing needs of leading communications R&D customers,” says Janis Valdmanis, General Manager of the Ultrafast Optoelectronics group at Thorlabs. “HyperLight was the first company to produce commercial-grade packaged modulators that successfully exceeded the 110GHz bandwidth requirement and is now showing the potential to go to even lower drive voltages.”

“HyperLight is committed to bringing to market best-in-class EOMs integrated at scale, addressing the growing need for a high performing, fundamental electro-optic building block across multiple industries including datacom, telecom, test and measurement, and radio-over-fiber,” says Mian Zhang, CEO of HyperLight. “These two new products are examples of the transformative capabilities that our team is excited to bring to the world.”


Keysight validates non-terrestrial networks (NTNs)

Keysight Technologies and Capgemini successfully validated non-terrestrial network (NTN) test scenarios. 

This validation, which adheres to 3GPP Release 17 standards, was carried out using Capgemini's 5G New Radio (NR) central and distributed unit framework equipped with NTN functionality, alongside Keysight's UeSIM UE Emulation RAN and Propsim Channel Emulator solutions. These tools emulate real network traffic and satellite conditions, respectively, facilitating end-to-end performance testing. The collaboration underscores the potential of 5G RAN gNodeB base stations in satellite-based communications, enhancing connectivity in remote areas and fostering innovation in IoT and connected vehicles.

The validation underscores enhancements in radio access network functionalities as outlined in 3GPP Release 17 standards, highlighting the critical role of gNodeB base stations in satellite communications for extended 5G coverage and reliability.

Capgemini utilized Keysight’s UeSIM and Propsim solutions for validating its 5G NR gNodeB features, effectively emulating NTN enabled devices and satellite conditions to address the complexities of introducing 5G NR gNodeB NTN features.

A live demonstration showcasing Capgemini’s 5G NR NTN CU/DU framework's capabilities occurred at Mobile World Congress 2024, with a repeat demonstration scheduled for Satellite 2024, emphasizing the practical application and real-world testing of these innovations.

Rajat Kapoor from Capgemini highlighted the software framework's role in facilitating the implementation of satellite-based communication systems, while Peng Cao of Keysight emphasized the acceleration of NTN system development and deployment through their Sky-to-Lab NTN portfolio.