NVIDIA positions Spectrum-X Networking for generative AI

NVIDIA introduced its Spectrum-X Networking Platform for Ethernet-based AI clouds.

The Spectrum-X solution consists of the company's existing 51 Tbps NVIDIA Spectrum-4 Ethernet switch and the NVIDIA BlueField-3 DPU, along with acceleration software and software development kits (SDKs).

Advanced RoCE extensions work across the Spectrum-4 switches, BlueField-3 DPUs and NVIDIA LinkX optics to create an end-to-end 400GbE network that is optimized for AI clouds. The Spectrum-4 Ethernet switch supports smart-leaf, spine, and super-spine designs. It offers 64 ports of 800GbE in a dense 2U form factor, and up to 256 200Gbs ports can be connected by a single switch, or 16,000 ports in a two-tier leaf-spine topology.

The software stack includes  Cumulus Linux, pure SONiC and NetQ — which together enable the networking platform’s extreme performance. The BlueField DPUs are powered by NVIDIA DOCA™ software framework.

The Spectrum-X solution set also includes a  selection of direct attach copper cables (DACs), active copper cables (ACCs), active optical cables (AOCs), and optics needed to connect OSFP and QSFP-based fabrics.

“Transformative technologies such as generative AI are forcing every enterprise to push the boundaries of data center performance in pursuit of competitive advantage,” said Gilad Shainer, senior vice president of networking at NVIDIA. “NVIDIA Spectrum-X is a new class of Ethernet networking that removes barriers for next-generation AI workloads that have the potential to transform entire industries.”

https://nvidianews.nvidia.com/news/nvidia-launches-accelerated-ethernet-platform-for-hyperscale-generative-ai

Read More

MediaTek’s auto chip integrates NVIDIA GPU chip via coherent interconnect

MediaTek will develop automotive SoCs and integrate the NVIDIA GPU chiplet, featuring NVIDIA AI and graphics intellectual property, into the design architecture. The chiplets are connected by an ultra-fast and coherent chiplet interconnect technology.

In addition, MediaTek will run the NVIDIA DRIVE OS, DRIVE IX, CUDA and TensorRT software technologies on these new automotive SoCs to enable connected infotainment and in-cabin convenience and safety functions. 

“AI and accelerated computing are fueling the transformation of the entire auto industry,” said JensenHuang, NVIDIA’s founder and CEO. “The combination of MediaTek’s industry-leading system-on-chip plus NVIDIA’s GPU and AI software technologies will enable new user experiences, enhanced safety and new connected services for all vehicle segments, from luxury to entry-level.”

https://blogs.nvidia.com/blog/2023/05/28/mediatek-intelligent-cabin-solutions/

Read More

Arm intros its next CPU + GPU platform for mobile computing

Arm introduced its Total Compute Solutions 2023 (TCS23) platform for mobile computing.

TCS23 is designed and optimized for specific workloads that need to run seamlessly together as a complete system. This includes a new Arm Immortalis GPU based on the company’s 5th Generation GPU architecture, a new cluster of Armv9 CPUs for next-gen artificial intelligence (AI) workloads, and new enhancements to deliver more accessible software for the millions of Arm developers. 


A vital part of the high-performance cluster for smartphones is the new Arm Cortex-X4, which is the fastest CPU that Arm has ever built, bringing 15 percent more performance compared to the Cortex-X3. Meanwhile, the new power efficient microarchitecture consumes 40 percent less power than Cortex-X3 on the same process. 

https://www.arm.com/company/news/2023/05/new-arm-total-compute-solutions-enable-mobile-future-built-on-arm

Read More

Cadence and Arm target faster path to tapeout

Cadence Design Systems, in  collaboration with Arm , is targeting a faster path to tapeout through use of Cadence digital and verification tools and the new Arm Total Compute Solutions 2023 (TCS23), which includes the Arm Cortex-X4, Arm Cortex-A720 and Cortex-A520 CPUs and Immortalis-G720, Mali-G720 and Mali-G620 GPUs.

Through this latest collaboration, Cadence delivered comprehensive RTL-to-GDS digital flow Rapid Adoption Kits (RAKs) for 3nm and 5nm nodes to help customers achieve power and performance goals using the new Arm TCS23. 

Cadence said its Cerebrus tool provided Arm with AI-driven design optimization capabilities that resulted in 50% better timing (TNS), a 10% reduction in cell area and 27% improved leakage power on the Cortex-X4 CPU, empowering Arm to achieve power, performance and area (PPA) targets faster.

“With the delivery of Arm TCS23, we’re unlocking the creative potential for customers around the world who demand high performance and efficient compute for next-generation mobile experiences,” said Chris Bergey, senior vice president and general manager, Client Line of Business at Arm. “Through our ongoing collaboration with Cadence, we successfully leveraged the Cadence digital and verification flows to get our latest generation of CPUs and GPUs into our customers’ hands faster and accelerate time to market.”

“Arm is known for building foundational computing platforms that address performance and efficient compute requirements, and the new Arm TCS23 is aimed at empowering designers to create the world’s most advanced mobile designs that provide the best user experience,” said Dr. Chin-Chi Teng, senior vice president and general manager, Digital & Signoff Group at Cadence. “By collaborating with Arm on the development of TCS23 and by delivering innovative digital and verification flows, we’re jointly leading our customers to improve overall productivity and achieve faster time to tapeout.”

https://www.cadence.com/go/armsoltcs23

Read More

Dell'Oro: Improving component supply drives growth in optical transport equipment

Optical Transport equipment revenue grew 8 percent year-over-year in 1Q 2023, according to a new report from Dell’Oro Group.

"For a second consecutive quarter, the Optical Transport equipment market growth exceeded our expectations," said Jimmy Yu, Vice President at Dell'Oro Group. "Equipment manufacturers are benefiting from the record level of backlog built-up over the past two years due to a lack of component supply. As these shortages moderate and lead times shrink, vendors are in a position to deliver long-awaited DWDM systems to their customers. This was the first time in two years that we did not hear a single vendor mention component shortage as a reason for lower than expected revenue in the quarter," added Yu.

Additional highlights from the 1Q 2023 Optical Transport Quarterly Report:

• The largest global suppliers in the trailing four quarter period were Huawei, Ciena, Nokia, ZTE, and Infinera. Among these vendors, Nokia and Infinera outperformed. For the trailing four quarter period, Nokia's optical revenue grew 13 percent and Infinera's grew 20 percent.
• China market slightly contracted in the quarter. If we exclude China from the worldwide figures, the optical market grew at a much higher rate of 12 percent year-over-year.
• Internet content provider (ICP) spending on WDM equipment increased year-over-year in the quarter, continuing the rebound in purchasing that started in 4Q 2022 after an unexpected drop in the third quarter. 

https://www.delloro.com

Read More

Ofcom greenlights discounted wholesale fibre pricing from Openreach

Ofcom, the UK telecoms market regulator, will allow Openreach to offer discounted wholesale pricing for its full-fibre service.

The new pricing scheme, know as the Equinox 2 plan, gives lower prices to retail providers – such as BT, Sky, TalkTalk and Vodafone – if they agree to use mainly Openreach’s full-fibre products for new orders instead of its legacy copper products.

https://www.ofcom.org.uk/news-centre/2023/decision-on-openreach-equinox-2-pricing-offer

Read More