Tuesday, September 6, 2022

CHIPS for America strategy released

The U.S. Department of Commerce released its strategy for implementing the $50 billion CHIPS Act of 2022 program, which was signed by President Biden last month.  Here are the highlights,

The CHIPS Act of 2022 program has four primary goals :

  • Establish and expand domestic production of leading edge semiconductors in the US, of which the US currently makes 0% of the world’s supply
  • Build a sufficient and stable supply of mature node semiconductors
  • Invest in R&D to ensure the next generation semiconductor technology is developed and produced in the US.
  • Create tens of thousands of good-paying manufacturing jobs and more than hundred thousand construction jobs. This effort will ensure the pipeline for these jobs expands to include people who have historically not had a chance to participate in this industry, including women, people of color, veterans and people who live in rural areas

The program supports three distinct initiatives:

  • Large scale investments in leading edge manufacturing: The CHIPS incentives program will target approximately three quarters of the incentives funding, around $28 billion, to establish domestic production of leading-edge logic and memory chips that require the most sophisticated manufacturing processes available today. Those amounts may be available for grants or cooperative agreements, or to subsidize loans or loan guarantees. The Department is still assessing the impact of the newly enacted advanced manufacturing facility investment tax credit on capital expenditures, which will generate significant additional project investment from participants and will reduce the required share of CHIPS incentives funding allocated for leading edge projects. The Department will seek proposals for the construction or expansion of manufacturing facilities to fabricate, package, assemble and test these critical components, particularly focusing on projects that involve multiple high-cost production lines and associated supplier ecosystems.
  • New manufacturing capacity for mature and current-generation chips, new and specialty technologies, and for semiconductor industry suppliers: The CHIPS incentives program will increase domestic production of semiconductors across a range of nodes including chips used in defense and in critical commercial sectors such as automobiles, information and communications technology, and medical devices. This initiative is broad and flexible, encouraging industry participants to craft creative proposals. For this initiative, the Department expects dozens of awards with the total value expected to be at least a quarter of the available CHIPS incentives funding, or approximately $10 billion. Those amounts may be available for grants or cooperative agreements, or to subsidize loans or loan guarantees.

  • Initiatives to strengthen US leadership in R&D: The CHIPS R&D program will invest $11 billion in a National Semiconductor Technology Center, a National Advanced Packaging Manufacturing Program, up to three new Manufacturing USA Institutes, and in NIST metrology research and development programs. This constellation of programs is intended to create a dynamic new network of innovation for the semiconductor ecosystem in the United States. Executing this vision will require collaboration with academia, industry, and allied countries, and will require sustained investment over many years.

Funding documents, which will provide specific application guidance for the CHIPS for America program, will be released by early February 2023.

“Rebuilding America’s leadership in the semiconductor industry is a down payment on our future as a global leader,” said U.S. Secretary of Commerce Gina Raimondo. “CHIPS for America, will ensure continued US leadership in the industries that underpin our national security and economic competitiveness. Under President Biden’s leadership, we are once again making things in America, revitalizing our manufacturing industry after decades of disinvestment and making the investments we need to lead the world in technology and innovation.”

https://www.commerce.gov/news/press-releases/2022/09/biden-administration-releases-implementation-strategy-50-billion-chips

An 18-page strategy document is published here: https://www.nist.gov/system/files/documents/2022/09/06/CHIPS_Strategic_Plan_Sept_6_2022.pdf

CHIPS and Science Act funding processes get underway

 President Biden signed an Executive Order to implement the semiconductor funding in the bipartisan CHIPS and Science Act of 2022.The order establishes an interagency CHIPS Implementation Steering Council, which will be  co-chaired by National Economic Director Brian Deese, National Security Advisor Jake Sullivan, and the Acting Director of the Office of Science and Technology Policy, Alondra Nelson. The order also  establishes...

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Broadcom's new Trident 4C offers 2.8 Tbps flow anomaly detection

Broadcom announced shipment of its Trident 4C Ethernet switch ASIC, a 12.8 terabits/second security switch capable of analyzing all traffic at line rate. 

Broadcom said its new switching ASIC is able to inspect 100 percent of the traffic, even at the extreme bandwidths found in network cores. Trident 4C integrates a purpose-built analytics engine capable of 170 billion operations per second with the ability to detect suspicious flow anomalies at line rate. This engine, enabled by default, has no impact on switch operation or performance.

  • “Sampling-based approaches to security are inherently flawed. We decided to eliminate the tradeoff between security and performance,” said Ram Velaga, senior vice president and general manager, Core Switching Group, Broadcom. “Trident 4C is a natural extension of our innovative portfolio. We started with Layer-2 switching, progressed to Layer-3 routing, and now are adding Layer 4-7 security as we climb the network OSI stack.”

Trident 4C highlights

  • Connection-aware monitoring of 500k+ active flows at 5.4 billion packets/second
  • 170 billion ALU operations per second for advanced connection fingerprinting
  • 4M state flow metrics counters set by a programmable arithmetic engine
  • 1M exact-match policy ACLs
  • Suitable for fixed-configuration and chassis-based designs
  • SONiC and SAI readiness for rapid integration into high-capacity networks

https://www.broadcom.com/company/news/product-releases/60491

Broadcom advances its co-packaged optics network switch

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Keysight implements Credo's retimer/gearbox for 800G test

Keysight has selected Credo's retimer/gearbox devices for its Layer 1-3 800GE network device and Ethernet protocol test solutions for network infrastructure. 

Keysight provides 800GE Layer 1-3 test coverage with an extensive set of use cases and break-out Ethernet port speeds from 800GE to 100GE, while leading the industry with the highest port density per rackmount unit in test solutions.

Credo said its devices were for two strategic test capabilities: First,  the chip-to-module, high performance SERDES with 112 Gb/s electrical lanes with PAM4 signaling for 1x800GE and related slower port speed support. Most importantly, the ability to provide auto negotiation and link training (AN/LT) – which are needed for support of passive and active direct attached copper (DAC) cabling required for switch and server interconnections within equipment racks that are deployed in high volume within data centers.

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Keysight expands 800G test solutions with multimode interfaces

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Credo intros Black Hawk PAM4 retimer and gearbox DSP

Credo introduced its Black Hawk (CRT55321), a PAM4 retimer and gearbox for providing guaranteed, end-to-end signal integrity in backplane, front panel and copper applications. The new device, which leverages the company’s unique PAM4 DSP architecture, is a 32-lane device that supports 16 lanes on the host side and 16 lanes on the line side. The extended reach performance provides robust signal integrity for PAM4 across the most difficult channels,...

T-Systems migrates Continental's SAP to private cloud

Continental, which operates one of the largest SAP installations in Germany, is working with T-Systems to migrate to a private cloud.

Under the project, T-Systems is transferring more than 450 SAP systems from Continental AG to the private cloud in Frankfurt am Main. There, the IT service provider will support the SAP operating system until at least the end of 2027. The contract covers all services related to operation, from consulting to the hotline. 

"We are pleased to continue working with T-Systems," said Christian Eigler, Group CIO at Continental. "The decisive factors for us were the reliability of the applications, the flexibility of the solutions and, above all: end-to-end service – one SAP, one contact person. For all trades from consulting, migration and transformation, operation to the German-speaking hotline."

Adel Al-Saleh, member of the Deutsche Telekom Board of Management and CEO of T-Systems, said, "Cloud services developed in Germany are one of our most important growth areas for the European industry. The benefits are lower costs, more flexibility and better resilience for companies. The automotive industry benefits from this to a particular extent because it uses cloud applications to standardize its own processes and those of many suppliers." 

https://www.telekom.com/en/media/media-information/archive/t-systems-brings-continentals-sap-to-the-private-cloud-1013820

BT lands contract win with ScottishPower

BT has been awarded a multi-million pound contract by ScottishPower to strengthen the connectivity throughout their network of windfarms and offices.

Under the contract, BT will provide integrated and bespoke telecommunications services to approximately 100 locations across the UK, France, and Germany.

BT said its connectivity will aid ScottishPower’s operational technology on its windfarms allowing controllers to monitor areas like turbine temperature, operating efficiency and the amount of electricity being produced by the site, helping manage the windfarm and the assets on it more efficiently. The company’s ambitious growth plans include expansion of its existing onshore wind portfolio, investment in new, large-scale solar projects and innovative battery storage systems.

BT Group buys 100% of its energy from renewable resources including Scottish wind farms. It also plans to accelerate responsible, inclusive and sustainable growth over the next decade as part of its Manifesto to achieve net zero carbon emissions from its operations by 2030.

Allan Ferguson, UK Director of Infrastructure, Operations and Communications at ScottishPower, said: “ScottishPower is at the forefront of the delivery of the UK’s Net Zero targets and the transition to a more sustainable future. As we grow our renewable energy generation, investing in more windfarms, battery storage and green hydrogen production facilities, IT needs to ensure it supports the business growth and BT is helping us achieve that by helping to future-proof the IT network. I look forward to working with BT in delivering this strategic award.”

https://newsroom.bt.com/bt-announces-multi-million-pound-contract-win-with-scottishpower/