Intel announces glass substrates for next-generation advanced packaging

Intel announced glass substrates for next-generation advanced packaging The new material offers ultra-low flatness and better thermal and mechanical stability, resulting in much higher interconnect density in a substrate.Compared to organic substrates in use today, Intel's glass substrates possess superior mechanical, physical and optical properties that allow for more transistors to be connected in a package, providing better scaling and enabling...

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Intel broadens FPGA portfolio

Intel expanded its Agilex FPGA portfolio and broadened its Programmable Solutions Group (PSG) offerings to handle the increased demand for customized workloads, including enhanced AI capabilities, and to provide lower total cost of ownership (TCO) and more complete solutions.Intel is also officially releasing Open FPGA Stack (OFS) to open source, the first production adapter based on Intel’s F2000X infrastructure processing unit (IPU) platform and...

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AMD releases Siena CPUs for intelligent edge, data centers

AMD announced the availability of its EPYC 8004 Series processors featuring the "Zen 4c" core, which is optimized for energy efficiency and performance in space-constrained environments from the intelligent edge to the data center.Cited benefits for the AMD EPYC 8004 Series processors:* High performance per watt: The AMD EPYC 8004 Series processors deliver up to 2x better SPECpower performance per system watt advantage compared to the competition's...

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Thunderbolt 5 delivers 80 Gbps bi-directionally

Intel announced Thunderbolt 5, promising 80 Gbps of bi-directional bandwidth, and with Bandwidth Boost up to 120 Gbps for displays. Thunderbolt 5,  will provide up to three times more bandwidth than the best existing connectivity solution, is based on industry standards – including USB4 V2 – and will be broadly compatible with previous versions of Thunderbolt and USB.  Thunderbolt 5 builds upon Thunderbolt 4 in several ways, including:Two...

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indie Semi acquires EXALOS for optical

indie Semiconductor has acquired privately held EXALOS AG, a Swiss photonics company, specializing in the design of high-performance optical semiconductors. indie paid approximately $45 million to EXALOS equity holders comprised of 6.6 million indie Class A common shares. In addition, if certain revenue-based performance targets are exceeded over a 24-month post-closing period, there is an opportunity for such holders to earn up to $20 million more...

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