TE Connectivity (TE) will host the following demonstrations at next week's DesignCon 2022 in Santa Clara, California.112G quad small formfactor pluggable double density (QSFP-DD) Over-the-Board (OTB) - TE has developed a new connector that extends the reach of the traditional surface mount technology faceplate connectors. The near-chip socket (NCS) connector is based on existing TE socket technology to provide a dense pin field, superior crosstalk...