OIF advances CEI-224G-Linear project

OIF has launched a new CEI-224G-Linear project built on the approach of CEI-112G-Linear in terms of specification methodology. It will support 224G full linear optical modules for next-gen applications (e.g., Ethernet, Ultra Ethernet Consortium (UEC), Artificial Intelligence/Machine Learning [AI/ML]) with low power, cost/complexity and latency. The TP1/TP1a and TP4/TP4a electrical specifications will enable up to 224G full linear optical modules for Linear Pluggable Optics (LPO), co-packaged optics (CPO) and Near Package Optics (NPO), supporting next-generation application requirements.

“The CEI-224G-Linear project will represent significant progress in our technological capabilities, weaving the precision of CEI-112G-Linear with groundbreaking innovations,” said Mike Li, OIF Board Member and Intel. “By enabling 224G full linear optical modules and leveraging the advanced 224G DSP SERDES architecture and technology, this initiative is poised to redefine the landscapes of Ethernet, UEC and AI/ML applications. As we embrace lower power, cost and latency, this project is a giant step forward in next-generation computing and connectivity driven by AI/ML.”

 

At its Q2 Technical and Market Awareness & Education (MA&E) Committees meeting, held May 7-9 in Athens, Greece, the OIF also launched a Common Electrical I/O (CEI) CEI-224G-Linear project and the publication of two Common Management Interface Specification (CMIS) white papers.

Additionally, the Physical Layer User Group (PLUG) Working Group released a new system vendor requirements document for Energy Efficient Interfaces (EEI).

Common Management Interface Specification (CMIS) White Paper on Management of Smart Optical Modules

• This white paper explores how the DWDM functions, parameters and operational aspects of “smart” optical pluggable modules can be handled more efficiently to address various challenges. It introduces an alternative control paradigm for optical modules that decouples optical layer control from packet layer control and from host software and packet controller software development and outlines the pros and cons of this approach. This paradigm is called “host independent management,” enabling advanced capabilities of smart optical modules via additional management methods. The white paper is available for download here.

CMIS-Based Out-of-Band Messaging for Link Training

• This white paper provides background on link training and a proposed message catalog by which any transmit SerDes can be trained initially (or tuned adaptively while in service) based on the needs of the corresponding receive SerDes, with the help of message exchange.It promotes out-of-band (OOB) messaging via the ubiquitous CMIS management link as a flexible solution for exchanging link training messages. The technical specifications of the messaging facility and the representation of the messages will be defined in a CMIS-LT supplement. Potential CMIS-LT applications could include CEI-112G Very Short Reach (VSR), Extra Short Reach (XSR), XSR+, and Medium Reach (MR), IEEE 802.3 AUI C2M links, Fibre Channel, InfiniBand, Optical Transport Network (OTN), etc. Download the white paper here.

System Vendor Requirements Document for Energy Efficient Interfaces

• In today’s fast-paced technological landscape, where data processing and communication demands for AI continue to soar, pursuing energy-efficient solutions is critical. This requirements document for EEI is a direct result of engaging with end users to understand their needs and expectations. It seeks to prioritize applications and establish fundamental criteria for the next generation of energy-efficient electrical and optical link projects and specifications.

“OIF’s commitment to interoperability standards and tackling technological challenges was evident at the Q2 meeting,” said Nathan Tracy, OIF President, and TE Connectivity. “The high attendance, start of the CEI-224G-Linear project, CMIS white papers, and the vendor requirements document for EEI, alongside David Moor’s insightful presentation on advanced transceiver design, underscore our leadership in promoting industry-wide collaboration and innovation.”

The event was further highlighted by guest speaker David Moor, a representative from ETH Zürich and the FLEX-SCALE consortium. Moor discussed the development of an optical digital-to-analog converter (oDAC) supporting Tbps+ data rates with lower power per bit than conventional modulation methods. According to Moor, this design utilizes currently available electronics and photonic devices and is well suited to support high-capacity transport with improved power efficiency.

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Cignal AI: 400 and 800GbE module shipments jump more than 25% QoQ

Hyperscale network operator demand drove purchases of 400GbE and 800GbE datacom and 400ZR telecom optical modules to record levels, according to the latest Optical Components Report from research firm Cignal AI. Well over 3 million high-speed datacom modules were shipped this quarter in support of AI cluster interconnect and traditional computing applications.

“800GbE vendor shipments have yet to match demand, though nearly as many 800GbE modules shipped in 1Q24 as in all of 2023,” said Scott Wilkinson, Lead Analyst at Cignal AI. “While some vendors have reported that lead times are coming down, the demand for 400GbE and 800GbE modules remains exceptionally strong and we anticipate that datacom segment revenue will double in 2024.”

Additional 1Q24 Optical Component Report Findings:

Spending on Datacom optical components was up more than 90% YoY as AI applications of 400GbE and 800GbE optical modules for AI applications drove demand to record levels.

Combined unit shipments of 400GbE and 800GbE Datacom modules across all SR/DR/FR/LR specifications jumped over 25% QoQ. Innolight led all vendors in shipments of Datacom modules.

Telecom optical module shipment growth was concentrated in 400G coherent pluggables, which were up more than 35% YoY. Marvell and Acacia experienced strong shipment growth.

Outside of pluggable coherent, shipments of Telecom components declined YoY, with segment revenue dropping -26% YoY.

The coherent module market size declined to under $5 billion in 2023 but it will grow in 2024 and is expected to approach $10 billion in 2028.

https://cignal.ai/

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Alphawave Semi tapes out multi-protocol I/O connectivity chiplet

Alphawave Semi has announced the successful tape-out of the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet, utilizing TSMC’s 7nm process. The chiplet combines Alphawave Semi’s customizable connectivity IP, custom silicon, and advanced packaging capabilities. The 7nm multi-standard I/O chiplet boasts a comprehensive IP portfolio compliant with Ethernet, PCIe, CXL, and UCIe (Universal Chiplet Interconnect Express) Revision 1.1 standards.

The new chiplet delivers total bandwidth of up to 1.6 Tbps, supporting up to 16 lanes of multi-standard PHY with silicon-proven PCIe 6.0, CXL 3.x, and 800G Ethernet in various mixed operating modes. This development also lays the groundwork for a robust and open chiplet ecosystem, crucial for accelerating connectivity in high-performance AI systems through UCIe as a die-to-die connectivity subsystem. Alphawave Semi recently showcased an industry-first live demo of its 24 Gbps UCIe silicon platform at the Chiplet Summit 2024 in Santa Clara, CA.

Key Points:

Industry First: Successful tape-out of the first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process.

Advanced Capabilities: Integrates flexible and customizable connectivity IP, custom silicon, and advanced packaging.

High Bandwidth: Delivers up to 1.6 Tbps total bandwidth, supporting 16 lanes of multi-standard PHY.

Standards Compliance: Compliant with Ethernet, PCIe, CXL, and UCIe Revision 1.1 standards.

AI System Connectivity: Enhances connectivity for high-performance AI systems using UCIe as a die-to-die connectivity subsystem.

Live Demo: Showcased a 24 Gbps UCIe silicon platform at Chiplet Summit 2024.

Customer Benefits: Offers flexibility and scalability for hyperscalers and datacenter infrastructure through mix-and-match high-performance custom SoCs.

Collaboration with TSMC: Demonstrates the use of TSMC’s 3DFabric™ ecosystem to integrate advanced interfaces.

https://awavesemi.com/press-release/alphawave-semi-tapes-out-industry-first-multi-protocol-i-o-connectivity-chiplet-for-high-performance-compute-and-ai-infrastructure/

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O-RAN ALLIANCE Global PlugFest Spring 2024

 The O-RAN ALLIANCE (O-RAN) hosted its eighth PlugFest highlighting achievements in five themes:

O-RAN Energy Consumption, Efficiency and Savings Testing:

• Participating labs successfully tested O-RAN energy saving use cases in different network conditions, helping to optimize RAN Total Cost of Ownership (TCO) and overall sustainability of mobile network operations.

Demonstrate consistent and repeatable open fronthaul testing in multiple labs:

• Several PlugFest hosts partnered to prove the ability to achieve consistent testing results in independent labs, ensuring testing reliability across labs and regions and supporting certification of O-RAN based products.

Open Fronthaul Transport Testing with multiple O-RUs:

• Building on previous O-RAN PlugFests, hosts and participants of the Spring 2024 PlugFest successfully extended the number of multi-vendor interoperable configurations in different setups and conditions, broadening the offer of O-RAN solutions for mobile operators.

O-RAN System Testing with Layer 1 Acceleration:

• The PlugFest verified readiness to automatically deploy and configure Layer 1 accelerators to allow their efficient testing in different network configurations.

O-RAN E2E Deployment Templates, DevOps, and Test Automation:

• Focusing on increasing efficiency of O-RAN network deployments, PlugFest participants demonstrated automation of testing in different areas including testbed setup, security testing, rApps/xApps and RIC testing, utilizing CI/CD processes, and application of the same automation in different labs.

O-RAN Global PlugFest Spring 2024, co-hosted by 20 operators, OTICs, and academic and research institutions, was conducted from February to May 2024 in 18 labs across Asia, Europe, and North America. The PlugFest had 86 participating companies or institutions, some of which participated in more than one venue.

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Deutsche Telekom offers 5G mmWave for industrial customers

Following successful trials, Deutsche Telekom has now commercially launched private 5G using the  26 gigahertz (GHz) band. In a landmark trial at Berlin's Werner-von-Siemens Centre for Industry and Science, autonomous machines and robots at Ger4tech Mechatronik Center were networked using a 5G router supporting both the 3.7 GHz industrial spectrum and mmWave spectrum. The trial showcased mmWave’s low latency of three to four milliseconds RTT and impressive data rates exceeding 4 Gbps download and 2 Gbps upload, underlining its potential for data-intensive manufacturing applications. This advancement is powered by Telit Cinterion, a global IoT solutions provider.

DT says the commercial rollout of 5G mmWave allows industries to leverage this technology for various applications, especially in AI-driven data analysis. Machines can upload vast amounts of data to the cloud, enhancing operations within 5G campus networks. Characterized by short-range coverage but high bandwidth and speeds, 5G mmWave is poised to revolutionize wireless communication and imaging, particularly in autonomous vehicles and the manufacturing sector. The 26 GHz spectrum, allocated exclusively by Germany's Federal Network Agency, is currently designated for local applications, highlighting its specialized use.

Key Points:

• First Trial and Commercial Offering: Deutsche Telekom successfully trialed and launched 5G mmWave at 26 GHz for industrial customers.
• High Performance: Achieved low latency (3-4 ms RTT) and high data rates (4 Gbps download, 2 Gbps upload) in trials.
• Enabled by the global IoT solutions provider, Telit Cinterion.
• Industrial Applications: Ideal for AI data analysis, autonomous vehicles, and data-intensive manufacturing applications.

https://www.telekom.com/en/media/media-information/archive/5g-mmwave-for-industrial-customers-in-germany-1068180

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T-Mobile wins 10-Year, $2.67 billion contract with U.S. Navy

The U.S. Department of the Navy selected T-Mobile as part of the $2.67 billion Spiral 4 contract. This new contract will give all Department of Defense agencies the ability to place orders for wireless services and equipment from T-Mobile for the next ten years.

The multiple-award contract includes voice, data, fixed wireless solutions, Internet of Things and mobility management solutions. It will help ensure robust and reliable connectivity for government activities — from mission critical communications to network solutions that serve military personnel and federal civilian agencies.

T-Mobile also introduced Government Internet, a 5G fixed wireless solution that can function as the main internet connection or as unlimited backup, enhancing reliability and support for critical communications. T-Mobile and 3rd Eye Technologies are making it easier for government agencies to stay compliant with federal message archiving laws with a ready-to-use solution that securely captures and stores SMS and MMS message logs. And in the future, government agencies could leverage T-Mobile’s partnership with SpaceX, which aims to merge T-Mobile's network with Starlink’s satellite capabilities with the goal to provide groundbreaking, near-universal connectivity.

"The Spiral 4 contract award is a testament to T-Mobile’s leading 5G network and to our focus on building solutions that meet the critical needs of our government customers,” said David Bezzant, Vice President of Sales, T-Mobile for Government. “With a cutting-edge product portfolio, a proven track record and a clear vision for the future, we’re ready to take government innovation to the next level. It's an honor to serve those who serve this Nation.”

https://www.t-mobile.com/business/government

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RENATER picks Nokia for data center deployments in Paris

RENATER, the National Research and Education Network in France responsible for deploying and managing national, as well as some regional, network infrastructure for research and education, selected the full Nokia Data Center Fabric solution for its two data centers in Paris. IMS Networks, a leading French network and cybersecurity managed services provider, is supporting the deployment. 

The deployment in in RENATER’s two data centers will include 7220 IXRs for leaf, spine and border leaf routers powered by Nokia that run on an open, extensible and resilient SR Linux Network Operating System (NOS).

Boris Dintrans, Managing Director at RENATER, said: "We are excited to embark on this journey with Nokia, a company whose name is synonymous with innovation, reliability, and what is increasingly important for our long-term strategy, European digital sovereignty. This new Nokia Data Center Fabric infrastructure will not only support RENATER’s capacity growth but will also allow for the development of new services for our members and users, particularly those operating in AI that require state-of-the-art networks, both inside and outside of data centers for data feeding.”

Sacha Hilic, Chief Executing Officer at IMS Networks, said: “With this new Data Center Fabric project, we are bringing all our technical network expertise to the challenges of resilience and performance of RENATER's critical infrastructures. This underlines our commitment to excellence and our vision of a more connected, secure and innovative digital future.”

Matthieu Bourguignon, Senior Vice President and head of Europe for Network Infrastructure business at Nokia, said: “We are honored to help support RENATER’s transition towards the burgeoning field of AI and the promise it holds for educators and students, across France. Nokia is delighted to partner with IMS Networks with our Data Center Fabric solution, which is a key pillar of the evolution of Network Infrastructure and Data Center markets, dedicated to research, education, and connected territories.”

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Nokia announces 2 management changes

 Nokia appointed Lorna Gibb as Chief People Officer and member of the Group Leadership Team. Prior to this role she served as Vice President, Labor and Employment, being a member of Nokia’s People and Legal & Compliance Leadership Teams. Lorna has over 20 years of experience working in people leadership roles for large scale global businesses in various industries and geographies. Before joining Nokia, she held roles as Global People Director for Skyscanner and People Partner/Director for EasyJet, where she spearheaded cross border organizational and cultural transformation. Lorna will be based in Finland and reports to Nokia’s President and Chief Executive Officer, Pekka Lundmark.

In addition, Ricky Corker, who has served as Nokia’s Chief Customer Experience Officer since 2021, will step down and leave the company on June 28, 2024. Ricky’s departure follows Nokia’s decision to empower its business groups with increased operational autonomy and move into a streamlined operating model, where the Customer Experience organization has been embedded into the business groups from the start of 2024. This change will enable the business groups to better seize growth opportunities with existing and new customers, and diversify faster into enterprise, webscale and government sectors.

“Ricky has been a valued member of Nokia’s leadership team and the Nokia community. He has been with Nokia for over 30 years and held several management positions within the company. I want to thank Ricky for all his contributions to Nokia, not least for helping to drive Nokia’s transformation and building trust with our customers throughout the years. I wish him all the best with his future endeavors,” said Pekka Lundmark.

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