
Intel celebrated the opening of Fab 9 in Rio Rancho, New Mexico. Fab 9 is set to play a pivotal role in driving Intel's ongoing advancements in advanced packaging technologies. With the semiconductor industry transitioning into the heterogeneous era that embraces multiple "chiplets" within a single package, cutting-edge packaging technologies like Foveros and EMIB (embedded multi-die interconnect bridge) offer a swifter and more cost-effective...