Exploring high-density fiber and connector solutions

This free webinar will discuss the rapidly evolving solutions for high-density connectors and fiber technology. Topics include fiber reliability and new fiber types for OBO and high density applications, such as multicore fiber, thin fiber, PMF, BiDi/SWDM MMF, as well as hollow core fiber for low latency applications. The webinar will also discuss connector types (12 and 16 fiber MPO, SEN, SAC, MDC, expanded beam, etc.), connector performance and connector impact on system performance, end-face cleanliness and inspection.

Our guests include Bulent Kose, Principal Optical Engineer, Panduit Laboratories; Yi Sun, Senior R&D Engineer, OFS; and G. Mabud Choudhury, Standards Manager, OFS.

Date: 19-October-2022

Time: 10am. Pacific

https://us02web.zoom.us/webinar/register/WN_7tiXzqcUQnGunpna-LLbbA

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NTIA reports $5.5B in Middle Mile requests, exceeding allocation by 5X

The Department of Commerce’s National Telecommunications and Information Administration (NTIA) received 235 applications requesting $5.5 billion in funding for the Enabling Middle Mile Infrastructure Grant Program.  Applications were due by September 30th.

The Middle Mile grant program under the Biden administrations "Internet for All" initiative allocates $1 billion in funding to projects that connect high-speed Internet networks to each other and reduce the cost of bringing Internet service to communities that lack it. 

"Middle mile infrastructure is the connective tissue that links the networks that serve homes and businesses,” said Assistant Secretary of Commerce for Communications and Information Alan Davidson. 

“NTIA’s Middle Mile Program is a force multiplier for connectivity and will be essential to delivering a cost-efficient Internet for All. The volume of applications we received demonstrates the high demand for increasing middle mile capacity throughout the country.”  

NTIA said it will evaluate the applications and make awards on a rolling basis no earlier than March 2023.

https://www.ntia.doc.gov/press-release/2022/more-235-applications-submitted-biden-harris-administration-s-internet-all-middle

U.S. kicks off $45B “Internet for All” Initiative 

Monday, May 16, 2022    

U.S. Commerce Secretary Gina M. Raimondo kicked off the Internet for All initiative, which will invest $45 billion under the Bipartisan Infrastructure Law signed by President Biden earlier this year.The goal of the Internet for All initiative is to provide affordable, reliable, high-speed internet for everyone in America by the end of the decade. The initiative will be administered and implemented by the U.S. Department of Commerce’s National Telecommunications...

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Summary of new U.S. multilateral controls on advanced semiconductors

 The U.S. Department of Commerce’s Bureau of Industry and Security (BIS) announced a set of updates to its export controls aimed at restricting the People's Republic of China’s ability to obtain advanced computing chips, develop and maintain supercomputers, and manufacture advanced semiconductors. 

Specifically, the updated rule:

1. Adds certain advanced and high-performance computing chips and computer commodities that contain such chips to the Commerce Control List (CCL);
2. Adds new license requirements for items destined for a supercomputer or semiconductor development or production end use in the PRC;
3. Expands the scope of the Export Administration Regulations (EAR) over certain foreign-produced advanced computing items and foreign produced items for supercomputer end uses;
4. Expands the scope of foreign-produced items subject to license requirements to twenty-eight existing entities on the Entity List that are located in the PRC;
5. Adds certain semiconductor manufacturing equipment and related items to the CCL;
6. Adds new license requirements for items destined to a semiconductor fabrication “facility” in the PRC that fabricates ICs meeting specified. Licenses for facilities owned by PRC entities will face a “presumption of denial,” and facilities owned by multinationals will be decided on a case-by-case basis. The relevant thresholds are as follows:  Logic chips with non-planar transistor architectures (I.e., FinFET or GAAFET) of 16nm or 14nm, or below;  DRAM memory chips of 18nm half-pitch or less; NAND flash memory chips with 128 layers or more.
7. Restricts the ability of U.S. persons to support the development, or production, of ICs at certain PRC-located semiconductor fabrication “facilities” without a license;
8. Adds new license requirements to export items to develop or produce semiconductor manufacturing equipment and related items; and
9. Establishes a Temporary General License (TGL) to minimize the short-term impact on the semiconductor supply chain by allowing specific, limited manufacturing activities related to items destined for use outside the PRC.

“As I told Congress in July, my north star at BIS is to ensure that we are appropriately doing everything in our power to protect our national security and prevent sensitive technologies with military applications from being acquired by the People’s Republic of China’s military, intelligence, and security services,” said Under Secretary of Commerce for Industry and Security Alan Estevez. “The threat environment is always changing, and we are updating our policies today to make sure we’re addressing the challenges posed by the PRC while we continue our outreach and coordination with allies and partners.”

“The PRC has poured resources into developing supercomputing capabilities and seeks to become a world leader in artificial intelligence by 2030. It is using these capabilities to monitor, track, and surveil their own citizens, and fuel its military modernization,” said Assistant Secretary of Commerce for Export Administration Thea D. Rozman Kendler. “Our actions will protect U.S. national security and foreign policy interests while also sending a clear message that U.S. technological leadership is about values as well as innovation.”

https://www.bis.doc.gov/index.php/documents/about-bis/newsroom/press-releases/3158-2022-10-07-bis-press-release-advanced-computing-and-semiconductor-manufacturing-controls-final/file

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Nokia to lead 2nd phase of Europe's 6G initiative

Nokia will lead the Hexa-X-II project, the second phase of the European 6G flagship initiative.

This new phase, which aims to start work on 1 January 2023, with a planned duration of two and a half years,  will expand the Hexa-X partner list to 44 organizations that are tasked with creating the pre-standardized platform and system view that will form the basis for many inputs into future 6G standardization.

As part of the announcement, Ericsson takes the role as technical manager for Hexa-X-II. Orange, TIM SpA, TU Dresden, University of Oulu, IMEC and Atos will help coordinate various work packages such as radio evolution and innovation, future devices and flexible infrastructure, smart network management and values, and requirements and ecosystem.

The Hexa-X-II project has been awarded funding from the European Commission as part of the first call of the Smart Network and Services Joint Undertaking (SNS-JU). This is the next significant step toward bringing together key industry stakeholders in Europe. The goal of both Hexa-X and Hexa-X-II is to establish Europe as leader in 6G.

Hexa-X-II represents the full value chain for future connectivity solutions. Its members range from network vendors and communication service providers to verticals and technology providers, as well as the most prominent European communications research institutes.   

Peter Vetter, President of Nokia’s Bell Labs Core Research, said: “Nokia is honored to lead in this pioneering project. In the 6G era, the digital, physical and human worlds will become far more integrated. Our goals must reflect this level of integration and inter-dependency. As billions more people and devices get connected, urbanization intensifies, and we strive to manage the limitations on energy and materials, the role of networks and 6G will only deepen. It is essential that we keep the larger context in mind as we imagine the new network.”

The Hexa-X-II consortium will strive to overcome the following societal challenges:

• Sustainability: Hexa-X-II will research technologies that contribute to a zero-carbon footprint and limit energy and material consumption.
• Inclusion: Hexa-X-II aims to provide connectivity to people in developing countries as well as to the under-privileged members of developed societies.
• Trustworthiness: Hexa-X-II will ensure data transparency, security and privacy, and network robustness.

https://hexa-x.eu/

Nokia to lead German 6G-ANNA Lighthouse project

Monday, July 11, 2022  6G, Germany, Nokia  

Nokia has been selected to lead 6G-ANNA, a German national-funded 6G lighthouse project.Nokia will collaborate with the 29 partners in 6G-ANNA to lead and drive 6G research and standardization. In particular, Nokia will work closely with the consortium, which includes partners from industry, subject matter experts, start-ups, research institutes and distinguished universities in Germany.Within 6G-ANNA, Nokia will focus on designing an end-to-end...

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Nokia collaborates with DOCOMO on 6G

Monday, June 06, 2022  6G, Nokia  

Nokia announced a partnership with DOCOMO and NTT to jointly define and develop key technologies towards 6G. The collaboration will focus on two proof-of-concepts for emerging 6G technologies: an AI native air interface and sub-THz radio access. These aim to demonstrate a performance gain with an AI based 6G air interface compared to a conventional air interface, and to show that high-data rate beamformed access can be achieved in a high frequency...

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American Tower and Airtel Africa target renewal power for mobile sites

American Tower Corporation, which operates more than 23,000 sites across Burkina Faso, Ghana, Kenya, Niger, Nigeria, South Africa and Uganda, entered into a multi-year, multi-product agreement with Airtel Africa plc. 

The partners will collaborate on new site and product development capabilities. Through their combined efforts, the companies expect to substantially increase connectivity on the continent, extend digital inclusion to underserved communities and advance their mutual greenhouse gas (GHG) emissions reduction objectives.

All new site development under the agreement will comply with ATC Africa’s new green site specifications, which is expected to substantially reduce reliance on fossil fuels, reducing exposure to fuel price volatility for both ATC Africa and Airtel Africa. The parties have also committed to continue working together to convert existing telecommunications sites to ATC Africa’s green site specifications over time.

In addition, Airtel Africa and ATC Africa will partner to provide training around information and communications technology skills to underserved communities as part of their respective kiosks and Digital Communities programs. Under this partnership, it is expected that more than 200 Digital Communities will be deployed in these markets in the coming years.

“Over the last several years, ATC Africa has made forward-thinking investments to ensure we achieve tangible reductions in our on-site fossil fuel consumption in Africa,” Marek Busfy, SVP and CEO of ATC Africa stated.

To date, ATC Africa has invested approximately $300 million in energy efficiency improvements, renewable energy deployments and energy storage solutions to decrease on-site reliance on fossil fuels. The company has also earmarked additional investments to fund the implementation of future energy efficiencies.

“As we selectively extend the platform services we offer, we are demonstrating our commitment to introduce new and renewable sources of energy to power our sites, which protects the industry, our customers and consumers from ongoing and future volatility in fuel prices. Airtel Africa’s environmental goals are aligned with ours and, as we expand digital reach on the African continent, we remain committed to reducing GHG emissions in tandem with our growth.” 

https://www.americantower.com/investor-relations/press-releases/

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