IBM announced significant advances in its path to integrate electrical and optical devices on the same piece of silicon. The new CMOS Integrated Silicon Nanophotonics, which is the result of a decade of development at IBM's global Research laboratories, promises over 10X improvement in integration density than is feasible with current manufacturing techniques.
IBM said it anticipates that Silicon Nanophotonics will dramatically increase the speed and performance between chips. In addition to combining electrical and optical devices on a single chip, the new IBM technology can be produced on the front-end of a standard CMOS manufacturing line. Transistors can share the same silicon layer with silicon nanophotonics devices. To make this approach possible, IBM researchers have developed a suite of integrated ultra-compact active and passive silicon nanophotonics devices that are all scaled down to the diffraction limit -- the smallest size that dielectric optics can afford. This makes possible the integration of modulators, germanium photodetectors and ultra-compact wavelength-division multiplexers with high-performance analog and digital CMOS circuitry.
"The development of the Silicon Nanophotonics technology brings the vision of on-chip optical interconnections much closer to reality," said Dr. T.C. Chen, vice president, Science and Technology, IBM Research. "With optical communications embedded into the processor chips, the prospect of building power-efficient computer systems with performance at the Exaflop level is one step closer to reality."
"Our CMOS Integrated Nanophotonics breakthrough promises unprecedented increases in silicon chip function and performance via ubiquitous low-power optical communications between racks, modules, chips or even within a single chip itself," said Dr. Yurii A. Vlasov, Manager of the Silicon Nanophotonics Department at IBM Research. "The next step in this advancement is to establishing manufacturability of this process in a commercial foundry using IBM deeply scaled CMOS processes."
IBM has been pursuing an ambitious Exascale computing program, which is aimed at developing a supercomputer that can perform one million trillion calculations—or an Exaflop—in a single second. This development is seen as a milestone along this path.
http://www.research.ibm.com/photonics
IBM said it anticipates that Silicon Nanophotonics will dramatically increase the speed and performance between chips. In addition to combining electrical and optical devices on a single chip, the new IBM technology can be produced on the front-end of a standard CMOS manufacturing line. Transistors can share the same silicon layer with silicon nanophotonics devices. To make this approach possible, IBM researchers have developed a suite of integrated ultra-compact active and passive silicon nanophotonics devices that are all scaled down to the diffraction limit -- the smallest size that dielectric optics can afford. This makes possible the integration of modulators, germanium photodetectors and ultra-compact wavelength-division multiplexers with high-performance analog and digital CMOS circuitry.
"The development of the Silicon Nanophotonics technology brings the vision of on-chip optical interconnections much closer to reality," said Dr. T.C. Chen, vice president, Science and Technology, IBM Research. "With optical communications embedded into the processor chips, the prospect of building power-efficient computer systems with performance at the Exaflop level is one step closer to reality."
"Our CMOS Integrated Nanophotonics breakthrough promises unprecedented increases in silicon chip function and performance via ubiquitous low-power optical communications between racks, modules, chips or even within a single chip itself," said Dr. Yurii A. Vlasov, Manager of the Silicon Nanophotonics Department at IBM Research. "The next step in this advancement is to establishing manufacturability of this process in a commercial foundry using IBM deeply scaled CMOS processes."
IBM has been pursuing an ambitious Exascale computing program, which is aimed at developing a supercomputer that can perform one million trillion calculations—or an Exaflop—in a single second. This development is seen as a milestone along this path.
http://www.research.ibm.com/photonics
- In March 2010, IBM announced a Germanium Avalanche Photodetector working at 40 Gbps with CMOS compatible voltages as low as 1.5V. This was the last piece of the puzzle that completes the prior development of the “nanophotonics toolbox�? of devices necessary to build the on-chip interconnects.
- In March 2008, IBM scientists announced the world’s tiniest nanophotonic switch for "directing traffic" in on-chip optical communications, ensuring that optical messages can be efficiently routed.
- December 2007, IBM scientists announced the development of an ultra-compact silicon electro-optic modulator, which converts electrical signals into the light pulses, a prerequisite for enabling on-chip optical communications.
- December 2006, IBM scientists demonstrated silicon nanophotonic delay line that was used to buffer over a byte of information encoded in optical pulses - a requirement for building optical buffers for on-chip optical communications.
launched its LTE service in the San Francisco Bay Area, offering plans starting at $55 per month including taxes and regulatory fees. Initially, METROPCS is providing Samsung Craft LTE handset with unlimited talk, text and enhanced entertainment and web browsing features.
as part of a network infrastructure upgrade to support its high throughput computing (HTC) requirements and a data environment that exceeds 15 petabytes (15 million gigabytes) per year.
The LTE network in Finland will use two frequencies: 1.8 GHz and 2.6 GHz. In the first phase, only modems for the 2.6 GHz band will be available, although the carrier expects multiple modems operating in both frequencies by spring 2011.
which is initially focusing on offering cloud-managed networking solutions for small and medium-sized businesses. Walden Venture Capital and Javelin Venture Partners are joining PARC as investors in the company.
