Juniper's Mist focuses on the AI-Driven Self-Driving Network

by James E. Carroll

Mist Systems, which is now a division of Juniper Networks, is upgrading its AI engine and microservices cloud to streamline IT operations, simplify troubleshooting across wired/wireless domains and deliver optimized experiences to network users. The goal is to deliver the first "AI-Driven Self-Driving Network" for the enterprise.

There are 2 components:

• Wired Assurance Service, which brings automated operations and service levels to Juniper enterprise access switching customers via the Mist cloud. A new cloud subscription service for Wired Assurance brings data from Junos switch telemetry into the Mist microservices cloud and AI engine.
• Marvis Actions, a framework for self-driving networks, converts AI-driven insight into actionable tasks for proactive and streamlined IT operations. Marvis AI-driven Virtual Network Assistant, which has been expanded to cover both wired and wireless networks, enables IT administrators to ask natural language queries and get detailed answers for troubleshooting and insight. A new Marvis Actions dashboard identifies the root cause of issues across various IT domains (WLAN, LAN, WAN and security) and automatically resolves them when possible. Marvis also delivers wired visibility for third party switches, proactively identifying issues, such as inactive/missing VLANs, firmware compliance, PoE budget constraints and insight into wireless users’ issues caused by wired problems.

What's happening with 400G?

Thursday, November 14, 2019  400G, Juniper  

It's happening, but maybe not quite yet except for the hyperscale clouds. Bikash Koley, CTO of Juniper Networks, provides a quick update on 400G, including a mention of the upcoming in-house silicon photonics.

Juniper to acquire Mist for cloud managed, enterprise Wi-Fi

Monday, March 04, 2019  Juniper, Mergers And Acquisitions  

by James E. Carroll

Juniper Networks agreed to acquire Mist Systems, a start-up offering a cloud-managed, enterprise wireless platform, for $405 million in cash and equity awards.
Mist, which is based in Cupertino, California, has developed an AI-driven wireless platform for making Wi-Fi more predictable, reliable and measurable. Mist has also developed an AI-driven virtual assistant, Marvis, to simplify wireless troubleshooting and provide unprecedented insight into client and network behavior. In addition, Mist uses patented virtual Bluetooth LE technology in conjunction with Wi-Fi and IoT to deliver scalable and cost-effective location-based wireless services to customers, such as indoor wayfinding, proximity notifications, traffic analytics and asset tracking. All operations are managed via Mist’s modern cloud microservices architecture.

Mist’s Wireless LAN (WLAN) platform will be combined with Juniper’s wired LAN, SD-WAN and security solutions. Juniper said the deal also enables it to extend cloud-based management and end-to-end AI-driven visibility across the end-to-end enterprise network (from access to the WAN) to offer an industry-leading, software-defined and highly differentiated solution for simplifying operations, improving user experience and lowering total cost of ownership (TCO).

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Telefónica leads first TIP Disaggregated Cell Site Gateway deployment

Telefónica is undertaking the first large-scale commercial deployment of Disaggregated Cell Site Gateways (DCSG) technology developed by Telecom Infra Project (TIP). Infinera, and Edgecore Networks are suppliers for the project.

Initially part of a recently announced nationwide open mobile transport deployment by Telefónica in Germany, the DCSG solution is a white-box cell site gateway device based on an open and disaggregated architecture for existing 3G, 4G, and future 5G mobile infrastructures.

“We are excited to mark the industry’s first adoption of DCSG technology in a large-scale live deployment,” said Víctor López, Network Architect at Telefónica and co-chair of the Open Optical Packet Transport group at TIP. “Active collaboration between leading global service providers and systems suppliers in TIP’s open community has been critical to advancing carrier-class DCSG implementations that are beginning to deliver real-world value.”

“Telefónica is committed to an open networking strategy as a lever for our network transformation,” said Javier Gavilán, Director of Core, Network Platforms and Transport and IT at Global CTIO, Telefónica.

The installation leverages the Infinera DRX-30 and Edgecore AS7315-27X-DCSG hardware platforms.

Infinera said its Converged Network Operating System (CNOS), when combined with Infinera or Edgecore Networks’ hardware, provides mobile operators with mature IP/MPLS functionality for their cell site gateways. Additionally, the combined CNOS and carrier-class hardware provide a unique stacking capability that delivers simple node expansion and increased resiliency. Multiple gateway elements can be connected to double node capacity while operating as a single routing entity.

“We are committed to meeting the demanding requirements of network operators as they evolve their networks to address the challenge of a timely and cost-efficient introduction of 5G services,” said Mikko Hannula, Vice President, Engineering & Product Management at Infinera. “Through rigorous testing and design, we are pleased to collaborate with Edgecore Networks to pioneer and deploy solutions to TIP’s DCSG specifications and to mark this milestone for open networking with the first volume commercial deployment of the technology now underway.”

TIP Summit: Edgecore developing Odyssey-DCSG, the Cell Site Gateway

Tuesday, October 16, 2018  Edgecore, TIP  

Edgecore Networks announced plans for Odyssey-DCSG, an open networking cell site gateway that conforms to the Disaggregated Cell Site Gateway (DCSG) specification developed by Vodafone, Telefonica, Orange, and TIM Brazil within the Telecom Infra Project (TIP). Edgecore said it will contribute the complete hardware design of the cell site gateway to TIP, and will make the Odyssey-DCSG product generally available in Q3 2019. The Edgecore Odyssey-DCSG...

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Infinera intros TIP-compliant Disaggregated Cell Site Gateway

Wednesday, February 27, 2019  Infinera  

Infinera introduced a Disaggregated Cell Site Gateways (DCSG) that conforms to the Telecom Infra Project (TIP) DCSG specification, which was developed by the Open Optical & Packet Transport (OOPT) Project Group within TIP in collaboration with Tier 1 global mobile operators, including Vodafone, Telefonica, TIM Brasil, BT and Orange. The new gateway can be used for the backhaul of cell site traffic and is based on an open and disaggregated...

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German carriers collaborate on 6,000 new cell sites

Deutsche Telekom, Telefónica Deutschland, and Vodafone are joining forces to set-up and operate up to 6,000 new cell sites. 1&1 Drillisch AG has been invited to participate in this network expansion collaboration.

Following a total investment of around 6.5 billion euros for the auction of the new spectrum licenses in summer 2019, the agreed cooperation serves to largely close white spots in sparsely populated regions and along traffic routes in an economically viable way. 

"The planned collaboration is a milestone for network expansion in Germany”, states Telekom Deutschland’s Managing Director Dirk Wössner and adds,  “Our common goal is to eliminate coverage gaps in the mobile network as soon as possible. Sharing infrastructure is nothing new for us. Sharing it at this scale, however, is a major step in the right direction. After all, high-speed internet and excellent voice quality on road, rail and water are vital for an industrial country like Germany that relies on mobile communications”.

“Mobile communications will be the most important technology in the coming decade. And we are pooling our resources to put Germany in an ideal position”, says Markus Haas, CEO of Telefónica Deutschland, and elaborates, “This collaboration is an outstanding example of intelligent cooperation towards taking the next logical step. We must join forces if we are to consolidate Germany’s position as a leading business location that is ready to take on future challenges. Together, we will take digital transformation in Germany to the next level”.

“Today, we are forging an alliance to combat dead spots and increase mobile communications coverage even in areas where it is not profitable”, explains Vodafone Deutschland CEO Hannes Ametsreiter, adding, “In future, hundreds of thousands will benefit from this – people in small rural communities, people on roads, people traveling by train. Together, we operators will construct and share a common infrastructure in dead spots – and of course continue to be rivals in a competitive infrastructure market in the rest of the country. This is good for the network, good for customers and good for Germany’s digital future”.

Deutsche Telekom kicks off 5G rollout

Wednesday, July 17, 2019  DT  

Deutsche Telekom has kicked off its 5G rollout in Germany and expects to have 300 5G antennas in more than 100 locations online by the end of the year.

The first six German cities with 5G include Berlin, Bonn, Darmstadt, Hamburg, Leipzig, and Munich. In the upcoming 18 months, the 20 largest cities in Germany will all be connected with 5G.

"We punched our ticket for a 5G future with the spectrum auction. Our goal now is to get 5G to the streets, to our customers, as quickly as possible. Nearly three-quarters of our antenna locations in Germany are connected with optical fiber – we're now building on that," says Dirk Wössner, Member of the Board of Management, Deutsche Telekom, and Managing Director, Telekom Deutschland GmbH. "Our teams are working hard in every area. Whether we're talking about the network, rate plans, or devices and applications – we're speeding up to get 5G started this year. At the same time, we need a clear regulatory framework and pragmatism from the authorities – particularly when it comes to questions regarding regional spectrum, local roaming, allocation of the auction proceeds, and the approval procedures – which takes far too long in Germany."

In parallel, Deutsche Telekom is working on 5G campus networks, together with industrial users. In this approach, the network build-out follows the specific needs of business customers. "We're already working on the 5G network with Osram and automotive supplier ZF," says Claudia Nemat, Deutsche Telekom Board Member, Technology and Innovation. "Whether mobility concepts in cities, manufacturing in the industry of tomorrow, or virtual reality in the entertainment sector is involved: 5G is the key. And the industry can count on us as a partner in the 5G rollout."

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Inphi to acquire eSilicon for $226 million

Inphi Corporation agreed to acquire eSilicon for $216 million in both cash and the assumption of debt.

“The Inphi team is excited to enhance our value proposition to our cloud and telecom customers with the addition of the eSilicon team and IP,” said Ford Tamer, president and CEO of Inphi. “eSilicon adds to Inphi world-class 2.5D packaging, SerDes, custom silicon and operations teams. Just as we successfully leveraged our Cortina and Clariphy acquisitions, eSilicon will advance our shared commitments in driving successful customer engagement, industry-leading innovation, and best of class execution.”

Inphi lists the following drivers for the acquisition:

• Combine Inphi’s DSP, TiA, Driver and SiPho disciplines with eSilicon’s 2.5D packaging and custom silicon design capabilities and accelerate the roadmap for electro-optics, 5nm advanced CMOS process node, and custom DSP solutions
• Augment Inphi’s existing SerDes team and resources
• Extend Inphi’s addressable market in Cloud data center networking and Telecom 5G infrastructure with top tier OEM customers
• Expand Inphi’s presence into new, strategic geographies for talent acquisition with engineering design centers in Italy, Romania, Vietnam, and Spain and operations in Malaysia
• Add between $80 to $120 million to 2020 revenue, be accretive to 2020 EPS and both the 2021 revenue and EPS growth rates
• Increase Inphi’s operational scale with suppliers, lowering costs and resulting in financial leverage
• Result in Inphi paying about 2.2X 2020 revenue in a combination of cash and debt assumption

The acquisition is expected to close in the fourth quarter of 2019, subject to US and Vietnamese regulatory approval and customary closing conditions. Concurrent with the signing of the definitive agreement, eSilicon has sold its Embedded Memory IP (SRAM, TCAM, and multi-port memory compiler) and Interface IP (HBM and HBI) assets to Synopsys Incorporated.

http://www.inphi.com

eSilicon tapes out 7nm Combo PHY for high bandwidth memory

Thursday, May 09, 2019  ESilicon  

eSilicon announced the tapeout of a 7nm test chip to provide silicon validation of its physical interface (PHY) to support the new JEDEC standard JESD235B, referred to informally as high bandwidth memory (HBM) 2E and emerging low-latency HBM technology.  The chip contains a 7nm PHY from eSilicon and a controller from Northwest Logic.  This 7nm test chip, along with a previously taped out 7nm test chip will be part of a 2.5D test system...

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eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC

Wednesday, May 01, 2019  ESilicon  

eSilicon announced the tapeout of a 7nm test ASIC that supports 400G gearbox and retimer functionality. Fabrication is expected in September. A gearbox converts multiple serial data streams at one rate to multiple streams at another rate. Serial-to-parallel and parallel-to-serial converters (SerDes) are critical to this functionality. A retimer improves signal integrity by equalizing, retiming and re-conditioning the received data to extend reach. The...

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Digi to acquire Opengear for $140 million

Digi International, a supplier of IoT solutions, agreed to acquire Opengear for upfront cash of approximately $140 million with a potential for contingent consideration of up to an additional $15 million based on revenue performance through 2020.

Opengear, which was founded in 2004, supplies failover-to-cellular and out-of-band management solutions to a broad range of Fortune 100 and other customers. Opengear is headquartered in Edison, New Jersey, with R&D centers in Silicon Valley and Brisbane, Australia, with an additional office in Sandy, Utah. Opengear is expected to retain its existing office locations and future office consolidations, if any, will be designed to minimize disruption to employees and customers.

“Joining forces with Opengear gives customers an expansive, high-value, technology portfolio that is hardware enabled and software defined,” said Ron Konezny, President and CEO of Digi International. “Both companies have a deep commitment to our customers and will continue to invest in product development to deliver business- and mission-critical solutions.”

“Digi and Opengear will mesh well as we share so many of the same values in how we treat our customers and employees,” said Opengear CEO Gary Marks. “Our products are complementary, so customers and partners will get exceptional choice.”

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Video: Building highly-resilient SD-WANs

Traditional out-of-band network technology started out with deployments in large data centers, providing the ability to remotely access network infrastructure, says Gary Marks, CEO, Open Gear. Deployments have quickly grown to the edge, where there is strong demand driven by IoT and other applications. SD-WAN is now driving strong demand for out-of-band solutions.

This video talks about using out-of-band technology to build highly-resilent SD-WANs.

https://nginfrastructure.com/sd-wan/

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Global Cloud Xchange to emerge from Chapter 11 as a standalone company

Following earlier efforts to sell the company, Global Cloud Xchange (GCX) has decided that the best way to maximize value and position its businesses for long-term growth and success is through a standalone Plan of Reorganization .

GCX owns one of the world’s largest private undersea cable system spanning more than 68,000 route kms.

Under the terms of the proposed plan, which was first announced on 15 September 2019 with support from more than 75 percent of the company's lenders, GCX will reduce debt by $150 million, access new working capital and emerge as an independent company backed by the strong ownership of its existing senior secured noteholders.

GCX said it hopes to emerge from Chapter 11 following a court date of December 4th.

“While we had a responsibility to evaluate all potential opportunities, we at GCX are thrilled to move forward as an independent company supported by a group of existing lenders that believe in our team and the opportunities ahead of us,” said Bill Barney, Chairman and CEO of GCX. “We are confident this ownership structure – and the additional financial strength it provides – will allow us to continue to honor our commitments to employees, customers and suppliers, build upon our strategic plan and emerge as an even stronger company.”

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CoreSite increases borrowing capacity to $1.15 billion

CoreSite Realty has extended its debt maturity profile and expanded its credit facility with total borrowing capacity of $1.15 billion, including all arrangements with its syndicate of banks.

CoreSite said it has addressed all near-term debt maturities by combining and extending its 2020 and 2021 term loan maturities into a $350 million term loan due in April 2025. This new term loan represents $100 million of incremental borrowing capacity. Additionally, the term of CoreSite’s $450 million revolving credit facility was extended to 2023.

“We are pleased by the opportunity to extend near-term maturity dates and increase our overall liquidity, each of which will support our future growth and development initiatives,” said Jeff Finnin, CoreSite’s Chief Financial Officer. “We would like to thank our lending institutions for their continued support of CoreSite and for providing us with the financial flexibility to continue to profitably grow and meet our customer needs.”

http://www.CoreSite.com

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Telit adds NB-IoT modules

Telit introduced two new Narrow Band-IoT modules offering low power consumption for battery-driven applications, such assmart metering for electricity, gas and water, smart city applications, smart agriculture and almost any type of industrial sensor or mass-deployment.

Telit's NE310H2-W1 offers a 15x18mm LGA form factor and is pin-to-pin compatible with 2G and LTE-M modules of the miniature Telit xE310 Family. Optimized for ease-of-design, high yield and low-cost manufacturing, this module is compliant to 3GPP Release 14 Cat NB2. The NE310H2 is also backward compatible with 3GPP Release 13 and LTE Cat NB1 standard.

NL865H2-W1 offers a 24.4x24.4mm VQFN form factor. It offers optional built-in eSIM and is also LTE UE Category NB2 compliant to the latest 3GPP Release 14.

"The launch of NE310H2-W1 and NL865H2-W1 will address some of the major challenges OEMs, integrators and device designers have been facing,” said, Manish Watwani, chief marketing and product officer, Telit. “Particularly for connectivity and battery life, our new modules dramatically increase the number of data points they can collect from their operations and customers via IoT devices. With IoT now possible at scale and cost, it makes many previously unviable deployments ROI positive.’’

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