Ciena's new WaveRouter targets converged metro networks

Ciena introduced its new WaveRouter platform architecture for unifying IP, optical, and compute functionality in a single platform for the converged metro network. 

Ciena says WaveRouter is built on an open purpose-built router equipped with intelligent operating system software with performance data streaming, integrated with coherent pluggables, and augmented with optimized photonic line systems, for flexibility and programmability. The company cites the following features and benefits:

• Ultra-high metro capacity and multi-layer (IP/Optical) awareness and coordination

• Commercial temperature (0°C to +40°C) for space- constrained locations

• Separate modular redundant controller, route processor, and fabric 6–192 Tb/s+

• IP routing, BGP-LU, SR-MPLS, Carrier Ethernet, and SRv6 ready

• MACsec and IPsec ready

• SDN next-generation management, including support for protocols such as NETCONF/YANG, gNMI/gRPC, and GRPC dial-in/dial-out telemetry

• Single IP address for management

• Ciena’s MCP multi-layer support for end-to-end network management control and planning

• Hot-swappable redundant AC or DC power

“Service providers are looking to simplify their networks through convergence to gain a competitive edge in a cloud-driven, always-connected world. Until now, they’ve had to compromise when it came to capacity, operational ease, and sustainability. WaveRouter takes an innovative approach, combining the best in IP, coherent optics, and flexible photonics driven by multi-layer operations for real performance and energy advantages,” said Scott McFeely, Senior Vice President, Global Products and Services, Ciena.

WaveRouter will be generally available in the third quarter of 2023.

https://www.ciena.com/insights/white-papers/cienas-coherent-routing-paves-the-way-for-true-ip-optical-convergence

Read More

Intel Foundry and Arm announce design collaboration

Intel Foundry Services (IFS) and Arm agreed to undertake design technology co-optimization (DTCO), in which chip design and process technologies are optimized together to improve power, performance, area and cost (PPAC) for Arm cores targeting Intel 18A process technology. 

Intel said its 18A process delivers two breakthrough technologies, PowerVia for optimal power delivery and RibbonFET gate all around (GAA) transistor architecture for optimal performance and power. 

IFS and Arm will develop a mobile reference design, allowing demonstration of the software and system knowledge for foundry customers. With the industry’s evolution from DTCO to system technology co-optimization (STCO), Arm and IFS will work together to optimize the platforms from applications and software through package and silicon, leveraging Intel’s unique open system foundry model.

“There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology,” said Pat Gelsinger, CEO of Intel Corporation. “Intel’s collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology.”

“Arm’s secure, energy-efficient processors are at the heart of hundreds of billions of devices and the planet’s digital experiences,” said Rene Haas, CEO of Arm. “As the demands for compute and efficiency become increasingly complex, our industry must innovate on many new levels. Arm’s collaboration with Intel enables IFS as a critical foundry partner for our customers as we deliver the next generation of world-changing products built on Arm.”

https://www.intc.com/news-events/press-releases/detail/1614/intel-foundry-and-arm-announce-multigeneration

Read More

Rambus joins IFS Accelerator IP Alliance

Rambus has joined the Intel Foundry Services (IFS) Accelerator IP Alliance. 

Through the alliance, Rambus will have access to Intel's process roadmaps to provide advanced security and interface IP solutions optimized for performance, power, area and security for Intel process and packaging technologies. With Rambus IP on IFS, customers can design state-of-the-art SoCs for the data center, edge, 5G, automotive and military-aerospace applications.

"As part of our IDM 2.0 strategy, IFS is partnering with leading IP companies like Rambus to create a robust chip design ecosystem that will help our mutual customers deliver leading-edge silicon performance for the most demanding applications," said Suk Lee, VP of Ecosystem Development Office at IFS. "As the first open system foundry, our advanced process & packaging technologies and resilient supply chain, combined with Rambus IP, will lead the way to solutions that power our digital world."

"Rambus is a renowned provider of industry-leading IP solutions to customers across a broad market landscape including fast-growing data center and AI/ML applications,” said Sean Fan, chief operating officer at Rambus. “We are proud to join the Intel Foundry Services Accelerator IP Alliance and look forward to delivering IP to our mutual customers, enabling the most advanced SoCs.”

Read More

NTIA launches $1.5 billion Public Wireless Supply Chain Fund

The National Telecommunications and Information Administration (NTIA) launched a Public Wireless Supply Chain Innovation Fund aimed at developing of open and interoperable networks. 

The $1.5 billion fund, which is part for the CHIPS and Science Act of 2022, will help to ensure that the future of 5G and next-gen wireless technology is built by the U.S. and its global allies and partners –not vendors from nations that threaten U.S. national security. 

The Innovation Fund’s first Notice of Funding Opportunity (NOFO) aims to expand and improve testing to demonstrate the viability of new approaches to wireless like open radio access networks (Open RAN) and remove barriers to adoption. NTIA anticipates it will award up to $140.5 million during this first tranche of grants. The first round of awards will provide for a range of R&D and testing activities in this critical field, including: 

• Expanding industry-accepted testing and evaluation (T&E) activities to assess and facilitate the interoperability, performance, and/or security of open and interoperable, standards-based 5G radio access networks; and 
• Developing new or improved testing methodologies to test, evaluate, and validate the interoperability, performance, and/or security of these networks, including their component parts. 

Later NOFOs will build upon the foundational work of this first NOFO, creating an ecosystem for wireless innovation built by the U.S. and its global allies.  

“The Innovation Fund is a critical step toward securing 5G wireless networks while driving innovation at home and abroad,” said Secretary Gina Raimondo. “Investing in the next generation of innovation will unlock opportunities for new and emerging companies to compete in the global telecom market, strengthen our telecom supply chains and provide our allies and friends with trusted choices and innovative technologies to compete in the 21st Century.  We look forward to bringing the best of industry, academia, and the public together to deliver on this initiative.”  

“This fund is a critical downpayment on our efforts to reshape the global wireless infrastructure supply chain towards secure and trusted vendors,” said Sen. Mark Warner (VA). “I look forward to seeing how the Department – working with U.S. and allied innovators and network operators – helps encourage this market to move towards security, interoperability, and greater wireless innovation.” '

Applications due: 02-June-2023

Rolling Awards Begin: August 2023

https://ntia.gov/issues/innovation-fund/notice-of-funding-opportunity

Read More

DISA deploys HPE Aruba Networking Infrastructure

The Defense Information Systems Agency (DISA) is modernizing and securing its multi-class wireless networks with HPE Aruba Networking ESP (Edge Services Platform) solutions.

As part of DISA’s digital transformation strategy under the Fourth Estate Network Optimization (4ENO) initiative, the deployment will include HPE Aruba Networking Wi-Fi 6 Access Points (APs) and HPE Aruba Networking ClearPass in support of approximately 400,000 DoD users and warfighters worldwide.

The 4ENO initiative includes an upgrade to a unified HPE Aruba Networking wireless infrastructure and new security capabilities at DISA Headquarters at Fort Meade, Maryland, for 4th Estate Agencies, and across DISA’s new DoDNet. The 4th Estate is a group of approximately two dozen DoD agencies that support the armed services and intelligence communities. DoDNet will provide secure as-a-service networking, IT systems, and business applications to participating 4th Estate agencies in support of DISA’s vision for establishing a single digital enterprise.

https://news.arubanetworks.com/news-release-details/2023/Defense-Information-Systems-Agency-DISA-Modernizes-Wireless-Networks-and-Access-Management-Across-All-Classification-Levels-With-HPE-Aruba-Networking-Infrastructure/default.aspx

Read More

Sony Semi invests in Raspberry Pi for edge AI

Sony Semiconductor Solutions announced a strategic investment in aspberry Pi Ltd. (RPL). The minority investment cements the relationship between the two companies, to provide a development platform for SSS's edge AI devices to the worldwide community of Raspberry Pi users.

"Our goal is to provide new value to a variety of industries and support them in solving issues using our innovative edge AI sensing technology built around image sensors," said Terushi Shimizu, President and CEO of Sony Semiconductor Solutions Corporation. "We are very pleased to be partnering with Raspberry Pi Ltd. to bring our AITRIOS™ platform -- which supports the development of unique and diverse solutions utilizing our edge AI devices -- to the Raspberry Pi user and developer community, and provide a unique development experience."

"Sony Group is a longstanding and valued strategic partner. Our pre-existing relationship encompasses contract manufacturing, and the provision of image sensors and other semiconductor products," said Eben Upton, CEO of Raspberry Pi Ltd. "This transaction will allow us to expand our partnership, bringing Sony Semiconductor Solutions' line of AI products to the Raspberry Pi ecosystem, and helping our users to build exciting new machine-learning applications at the edge."

Read More