IOWN: Advancements in Thin-film Lithium Niobate Photonics

A panel discussion at last week’s IOWN Acceleration event, hosted by NTT in Japan, focused on how Thin-film Lithium Niobate (TFLN) photonics aims to combine the scalability of silicon with the performance of lithium niobate.IOWN stands for the "Innovative Optical and Wireless Network" and is an initiative led by NTT to pursue a forward-looking vision for a new kind of information infrastructure. One of the central technologies in IOWN is advanced...

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Kulicke and Soffa books order for SiPH Co-Packaged Optics

 Singapore-based Kulicke and Soffa Industries, which is known for designing, manufacturing, and servicing equipment used in the assembly of semiconductor devices, confirmed the release of multiple orders for its Thermocompression Bonding (TCB) solutions, primarily supporting Silicon Photonics (SiPh) based Co-Packaged Optics (CPO) applications deployed in high-bandwidth networking transceivers. K&S anticipates a series of follow on CPO orders...

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Introducing the Advanced Photonics Coalition

A new Advanced Photonics Coalition was announced at the OpticaPhotonic-Enabled Cloud Computing Industry Summit, which was hosted at Juniper Networks’ Aspiration Dome in Sunnyvale, California.Picking up on the previous Consortium for On-Board Optics (COBO), APC aims to foster cooperation across all corners of the ecosystem.“Our mission is for optical fabs to be leading and creating the world’s best technology in terms of reliability, validation, and...

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MediaTek debuts RedCap modem chipset

MediaTek has unveiled its T300 series, the world's first 6nm Radio Frequency System-On-Chip (RFSOC) designed specifically for RedCap applications. The RedCap (reduced capability) specifications, part of the 3GPP Release 17,  are aimed at devices that do not need the full capabilities of standard 5G NR. These devices have reduced complexity, making them more cost-effective and energy-efficient.The MediaTek T300 series is notable for its...

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Synopsys.ai Copilot to accelerate Chip Design

A newly introduced Synopsys.ai Copilot, the result of a strategic collaboration with Microsoft to integrate Azure OpenAI Service, aims to accelerate the design process for semiconductors. Azure OpenAI Service gives customers access to OpenAI's large language models (LLMs) with the enterprise-ready capabilities of Microsoft Azure. Synopsys.ai Copilot brings together Azure OpenAI Service generative AI capabilities with Synopsys' chip design...

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MediaTek expands Wi-Fi 7 Chipset portfolio

MediaTek introduced its Filogic 860 and Filogic 360 chipsets supporting Wi-Fi7. Sampling is underway.Filogic 860 combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. The Filogic 860 platform key features:* 6nm low power Wi-Fi design* Single-MAC MLO support* Supports 4096-QAM...

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