Sunday, October 22, 2023

#OCPSummit23: Pathways to Optical Innovation for AI Data Centers

 Nathan Tracy, President from OIF, provides an update:

- He discusses the direction of OIF's main work areas to enable the future of AI Data Centers.

- He delves into the specifics of 200G electrical, 100G Linear Optics, and the OIF's CMIS activities

- He introduces a new project focused on determining and prioritizing the requirements for these data centers, with the aim to deliver industry-standard interoperable solutions.

Filmed at OCP Summit 2023 (#OCPSummit23) in San Jose. Want to be involved our video series? Contact

#OCPSummit23: Accelerating the Chiplet Economy

The implementation of chiplet designs and OCP's Open Domain-Specific Architecture (ODSA) could have a big impact on data centers. Bapi Vinnakota, ODSA Project Lead from Open Compute Project, provides an update:

- He discusses the OCP's efforts to reduce friction in the development of chiplets, emphasizing that it's not just about interfaces, but also about transforming the value chain and workflow for chiplet-based products.

- Bapi introduces the recently announced language, CDXML, developed within the OCP. This language allows every chiplet made globally to have a JEDEC JPE30 part model, which can be used to create electronic data sheets, aiding in tool flows for multiple vendors and design searches.

- He shares the exciting transition of the open chiplet economy from theoretical slides and documents to tangible products and prototypes. This includes an experience center featuring chiplet-based products, IP, and workflow from 11 different companies in the ecosystem.

Filmed at OCP Summit 2023 (#OCPSummit23) in San Jose. Want to be involved our video series? Contact

#OCPSummit23: CXL for AI-Powered Data Centers

The emerging Compute Express Link (CXL) is making big progress as the cache-coherent interconnect for processors, memory expansion and accelerators. At #OCPSummit23, we got and update from Siamak Tavallaei, Advisor to the Board from CXL Consortium:

  • He discusses the three major elements of the AI-powered data center challenge: the compute element, the memory needed for the compute, and the interconnect.
  • He explains how the CXL specification allows for the creation of an environment with many interconnected systems through high-speed, low-latency interconnects that participate with coherent memory.
  • He elaborates on how CXL enables us to interface with emerging memory technologies, providing larger memory blocks to accelerator elements and increasing the bandwidth available to compute elements.

Filmed at OCP Summit 2023 (#OCPSummit23) in San Jose. 

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#OCPSummit23: AI Efficiency and Scalability with Ampere

How will data centers scale for AI workloads? Sean Varley, VP of Product Marketing from Ampere, shares a perspective:

- AI is emerging as a major workload in data centers, but models are in flux.

- Despite the prevalence of proprietary technology, there's a shift towards open technology in AI deployment, with Ampere forming an AI Platform Alliance to encourage this.

- The AI Platform Alliance aims to bring vendors together to create platforms for the entire ecosystem, focusing on open technology, AI acceleration, and sustainability.

Filmed at OCP Summit 2023 (#OCPSummit23) in San Jose. Want to be involved our video series? Contact

Samsung unveils Shinebolt high-bandwidth memory for AI

Samsung unveiled its next-generation high-bandwidth memory, HBM3E DRAM, for AI-model training and inference in the data center. 

The HBM3E boasts 9.8 Gbps per pin speed, meaning it can achieve transfer rates exceeding up to more than 1.2 terabytes-per-second (TBps). In order to enable higher layer stacks and improve thermal characteristics, Samsung has optimized its non-conductive film (NCF) technology to eliminate gaps between chip layers and maximize thermal conductivity.

Samsung’s 8H and 12H HBM3 products are currently in mass production and samples for Shinebolt are shipping to customers. 

At its annual Memory Tech Day in San Jose, Samsung also highlighted:

  • the 32Gb DDR5 DRAM with the industry’s highest capacity, the industry’s first 32Gbps GDDR7 
  • the petabyte-scale PBSSD, which offers a significant boost to storage capabilities for server applications.
  • new 3D structures for sub-10-nanometer (nm) DRAM, allowing larger single-chip capacities that can exceed 100 gigabits (Gb)
  • Samsung is working on its next-generation 11nm-class DRAM, which is set to offer the industry’s highest density.

In addition, Samsung believes NAND flash breakthroughs will shrink cell sizes and refine channel hole etching techniques are also in development, enabling 1,000-layer vertical NAND (V-NAND).

“The new era of hyperscale AI has brought the industry to a crossroads where innovation and opportunity intersect, presenting a time with potential for great leaps forward, despite the challenges,” said Jung-Bae Lee, President and Head of Memory Business at Samsung Electronics. “Through endless imagination and relentless perseverance, we will continue our market leadership by driving innovation and collaborating with customers and partners to deliver solutions that expand possibilities.”

SES wins DISA contract for LEO services

SES Space & Defense has been awarded a five-year, Indefinite Delivery Indefinite Quantity (IDIQ) contract for proliferated Low Earth Orbit (pLEO) satellite-based services (SBS) from the Defense Information Systems Agency’s (DISA) Defense Information Technology Contracting Organization (DITCO) on behalf of the U.S. Space Force. 

The contract is valued at up to USD 900 million. 

Satellite services delivered via multiple orbits enable a comprehensive range of new connectivity capabilities for the U.S. DoD. Non-geostationary satellite orbits (NGSO) - LEO and MEO - provide low-latency and flexible, fiber-like connectivity ideal for high-bandwidth, real-time applications, while GEO satellites enhance global resiliency and redundancy enabling a broader scope of government use cases.

SES Space & Defense also offers enterprise management and control (EM&C) capabilities, facilitating a seamless, integrated network of COMSATCOM and MILSATCOM systems and extensive experience in building and operating global networks. This enables DoD users to enjoy resilient, redundant, and secure multi-orbit, multi-band network soluti

Approved Networks ships 400G QSFP-DD ZR transceiver

Approved Networks, a brand of Legrand, introduced its 400G QSFP-DD ZR transceiver. 

"We are thrilled to introduce the 400G QSFP-DD ZR to the market," said Brian Patton, VP of Engineering at Approved Networks. "As the demand for high-speed, long-range connectivity surges, our innovative solution empowers businesses to bridge geographical gaps, share data seamlessly, and unlock new possibilities in communication. The 400G QSFP-DD ZR exemplifies our dedication to pushing the boundaries of technology to drive progress and growth."

Nokia supplies 600G for Cybernet in Pakistan

Cybernet, the leading fixed-line telecommunications provider in Pakistan, has the country’s first DWDM network operating at 600 Gbps per wavelength using equipment from Nokia.. 

By establishing international points of presence (POPs) in MC-1 in Barka (Oman), MRS-2 in Marseille (France), SmartHub in Fujairah (UAE) and SG1 in Singapore, Cybernet is providing its global peering community members with its advanced IXP platform powered by the Nokia 7750 SR and 7250 IXR routers. This platform ensures optimum connection capacity to meet both current and future needs. Cybernet offers Internet, EVPN and MPLS-based services with rich Quality of Service (QoS) at its international POPs.

Cybernet successfully implemented Nokia’s advanced integrated ROADM architecture based on flexgrid technology. Additional software management and control functions from Nokia’s WaveSuite service enablement automation software help Cybernet to further increase operational efficiencies. Broadband and enterprise customers can also benefit from low latency, superior quality of services and an enhanced customer experience.

Maroof Ali Shahani, Chief Operating Officer of Cybernet, said: “Using Nokia’s innovative in-house PSE-Vs chipset with super-coherent optical engines allows us to connect our main sites while also giving us headroom to grow our capacity efficiently and cost-effectively. Through our partnership with Nokia, we can meet our customers’ increasing demand for the best connectivity services while also enabling them to benefit from the latest innovations within optical technology.”