#OCPSummit23: Pathways to Optical Innovation for AI Data Centers

 Nathan Tracy, President from OIF, provides an update:- He discusses the direction of OIF's main work areas to enable the future of AI Data Centers.- He delves into the specifics of 200G electrical, 100G Linear Optics, and the OIF's CMIS activities- He introduces a new project focused on determining and prioritizing the requirements for these data centers, with the aim to deliver industry-standard interoperable solutions.https://youtu.be/TbdB22IFKV4Filmed...

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#OCPSummit23: Accelerating the Chiplet Economy

The implementation of chiplet designs and OCP's Open Domain-Specific Architecture (ODSA) could have a big impact on data centers. Bapi Vinnakota, ODSA Project Lead from Open Compute Project, provides an update:- He discusses the OCP's efforts to reduce friction in the development of chiplets, emphasizing that it's not just about interfaces, but also about transforming the value chain and workflow for chiplet-based products.- Bapi introduces the recently...

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#OCPSummit23: CXL for AI-Powered Data Centers

The emerging Compute Express Link (CXL) is making big progress as the cache-coherent interconnect for processors, memory expansion and accelerators. At #OCPSummit23, we got and update from Siamak Tavallaei, Advisor to the Board from CXL Consortium:He discusses the three major elements of the AI-powered data center challenge: the compute element, the memory needed for the compute, and the interconnect.He explains how the CXL specification allows for...

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#OCPSummit23: AI Efficiency and Scalability with Ampere

How will data centers scale for AI workloads? Sean Varley, VP of Product Marketing from Ampere, shares a perspective:- AI is emerging as a major workload in data centers, but models are in flux.- Despite the prevalence of proprietary technology, there's a shift towards open technology in AI deployment, with Ampere forming an AI Platform Alliance to encourage this.- The AI Platform Alliance aims to bring vendors together to create platforms for the...

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Samsung unveils Shinebolt high-bandwidth memory for AI

Samsung unveiled its next-generation high-bandwidth memory, HBM3E DRAM, for AI-model training and inference in the data center. The HBM3E boasts 9.8 Gbps per pin speed, meaning it can achieve transfer rates exceeding up to more than 1.2 terabytes-per-second (TBps). In order to enable higher layer stacks and improve thermal characteristics, Samsung has optimized its non-conductive film (NCF) technology to eliminate gaps between chip layers and...

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SES wins DISA contract for LEO services

SES Space & Defense has been awarded a five-year, Indefinite Delivery Indefinite Quantity (IDIQ) contract for proliferated Low Earth Orbit (pLEO) satellite-based services (SBS) from the Defense Information Systems Agency’s (DISA) Defense Information Technology Contracting Organization (DITCO) on behalf of the U.S. Space Force. The contract is valued at up to USD 900 million. Satellite services delivered via multiple orbits enable a...

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Approved Networks ships 400G QSFP-DD ZR transceiver

Approved Networks, a brand of Legrand, introduced its 400G QSFP-DD ZR transceiver. "We are thrilled to introduce the 400G QSFP-DD ZR to the market," said Brian Patton, VP of Engineering at Approved Networks. "As the demand for high-speed, long-range connectivity surges, our innovative solution empowers businesses to bridge geographical gaps, share data seamlessly, and unlock new possibilities in communication. The 400G QSFP-DD ZR exemplifies...

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Nokia supplies 600G for Cybernet in Pakistan

Cybernet, the leading fixed-line telecommunications provider in Pakistan, has the country’s first DWDM network operating at 600 Gbps per wavelength using equipment from Nokia.. By establishing international points of presence (POPs) in MC-1 in Barka (Oman), MRS-2 in Marseille (France), SmartHub in Fujairah (UAE) and SG1 in Singapore, Cybernet is providing its global peering community members with its advanced IXP platform powered by the Nokia...

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