Akraino Release 3 extends use cases

LF Edge announced the availability of Akraino Release 3, featuring new blueprints that focus on mobile edge computing (MEC), AI/ML, and Cloud edge. Akraino Edge Stack delivers an open source software stack that supports a high-availability cloud stack optimized for edge computing systems and applications. Designed to improve the state of carrier edge networks, edge cloud infrastructure for enterprise edge, and over-the-top (OTT) edge, it enables...

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Cisco's revenue drops 9% to $12.2 billion

Cisco reported revenue of $12.2 billion, GAAP net income of $2.6 billion or $0.62 per share, and non-GAAP net income of $3.4 billion or $0.80 per share, for its fourth fiscal quarter ended July 25, 2020. The figure represents a 9% drop in revenue compared to a year earlier, the third straight quarterly drop. Earnings per share rose 22%. Product revenue was down 13% and service revenue was flat. Revenue by geographic segment was: Americas down 12%,...

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Acacia samples 100G QSFP-DD fixed wavelength module with 120km reach

Acacia Communications has begun sampling a new 100G coherent pluggable transceiver for edge and access applications with unamplified links up to 120km. The new QSFP-DD point-to-point (P2P), fixed wavelength, hot-pluggable module provides network operators with a coherent alternative to direct-detect solutions. Acacia says its coherent P2P solutions are extremely tolerant to fiber types, chromatic dispersion, polarization mode dispersion (PMD),...

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FCC prevails in court challenge to accelerated 5G cell deployments

The U.S. Court of Appeals for the Ninth Circuit sided with the FCC in upholding the vast majority of three orders to accelerate the deployment of wireless and wireline broadband infrastructure. In the cases, local and state governments were seeking to FCC rules that streamline the installation of 5G infrastructure over the objection of local authorities. FCC Chairman Ajit Pai states: “Today’s decision is a massive victory for U.S. leadership in...

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Samsung implements "X-Cube" 3D IC packaging in 7nm and 5nm

Samsung Electronics announced the immediate availability of its 3D IC packaging technology, eXtended-Cube (X-Cube). "Samsung's new 3D integration technology ensures reliable through-silicon via (TSV) interconnections even at the cutting-edge EUV process nodes," said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. "We are committed to bringing more 3D IC innovation that can push the boundaries of semiconductors.” The...

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Ericsson chalks up its 100th 5G commercial agreement

Ericsson announced a big 5G milestone -- its 100th commercial 5G agreement or contract with unique communications service providers. The figure includes 58 publicly announced contracts and 56 live 5G networks, spanning five continents. The latest deal is with Telekom Slovenije. Börje Ekholm, President and CEO, Ericsson, says: “Our customers’ needs have been central to the development and evolution of Ericsson’s 5G technology across our portfolio...

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China Mobile tests SRv6 optimization with ZTE

ZTE completed a forwarding-plane multi-vendor interoperability test of an SRv6 header compression optimization solution in partnership with China Mobile. The SRv6 optimization solution is an improvement and supplement to the standard SRv6 solution. It can support all SRv6 functions while reducing the size of the header by 4 times. In addition, it can effectively solve the problems such as high encapsulation overheads of 128bit SRv6 SID, low forwarding...

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