Ultra Accelerator Link group aims for open interconnect standard

AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft agreed to develop an open industry standard for interconnecting AI accelerators.The Ultra Accelerator Link (UALink) group will develop a specification to define a high-speed, low-latency interconnect for scale-up communications between accelerators and switches in AI computing pods.The 1.0 specification will enable the connection of up to 1,024 accelerators...

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Alphawave Semi collaborates with Arm on compute chiplets

Alphawave Semi is working with Arm to develop an advanced compute chiplet based on Arm Neoverse Compute Subsystems (CSS) for systems used in artificial intelligence/machine learning (AI/ML), high-performance computing (HPC), data centers, and 5G/6G networking infrastructure. This development follows Alphawave Semi's entry into the Arm Total Design ecosystem last year, which focuses on creating custom silicon solutions using Arm Neoverse CSS.The chiplet-based...

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Rapidus and IBM target 2nm chiplet packaging technology

Rapidus, headquartered in Tokyo, and IBM  announced a partnership focused on 2nm chiplet packaging technology. Rapidus will leverage IBM's advanced semiconductor packaging technology. This partnership is part of a broader international collaboration under the framework of the New Energy and Industrial Technology Development Organization (NEDO).As part of this partnership, Rapidus engineers will work alongside IBM at its North American packaging...

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Joint ASML-imec Lab to accelerate High NA EUV for chip foundries

ASML and imec (Interuniversity Microelectronics Centre), a renowned research and development organization based in Leuven, Belgium, inaugurated a new High NA EUV Lithography Lab in Veldhoven, the Netherlands. The new facility is equipped with a prototype High NA EUV scanner (TWINSCAN EXE:5000) and surrounding processing and metrology tools.The opening of the joint ASML-imec High NA EUV Lab marks a significant milestone in preparing High Numerical...

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Italy's Fastweb sells its stake in FiberCop to KKR

Fastweb, which is the Italian subsidiary of Swisscom, agreed to sell its full 4.5% stake in FiberCop to KKR, the U.S.-based investment firm. The deal was valued at EUR 438.7 million, a value in line with the pro rata price paid by KKR to TIM for its stake. The transaction remains subject to the completion of the NetCo transazioni by KKR, closing is expected in Q3 2024.Fastweb has been a shareholder in FiberCop – a company established by the Italian...

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Indonesia's Telin builds Cable Landing Station for Bifrost cable

Telin hosted a groundbreaking ceremony for the Cable Landing Station (CLS) near Pantai Mutiara, a critical component of the Bifrost Cable System. The ambitious Bifrost cable will connect Singapore and North America through Indonesia, enhancing connectivity across the Java Sea and the Celebes Sea. The construction of the CLS marks a significant milestone in the project, which has been under development since March 2021, in collaboration with...

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Deep Blue One links French Guiana, Suriname, Guyana, T&T

Digicel Group announced the activation of its subsea fibre cable, Deep Blue One, linking the Caribbean and South America with landings in French Guiana, Suriname, Guyana and Trinidad & Tobago.Marcelo Cataldo, Digicel Group’s Chief Executive Officer said, “Subsea fibre has long been the backbone of global connectivity, and Deep Blue One is set to serve as a catalyst for the next wave of economic development in the region. At Digicel, our focus...

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