
In a keynote address at the Intel Innovation event in San Jose, California, Pat Gelsinger demonstrated a pluggable co-package photonics solution -- a detachable, optical-in-package connector. Intel describes it as a a high-yielding, glass-based solution with a pluggable connector that simplifies manufacturing and lowers costs, opening possibilities for new system and chip package architectures in the future.Gelsinger also previewed future high-volume...