The OCP Foundation released its Bunch of Wires (BoW) specification for Chiplet interconnect, representing a next step in the OCP Open Domain Specific Architecture (ODSA) Project's march towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply chain model. BoW specifies a physical layer (PHY) optimized for System on a Chip (SoC) disaggregation, and complements OCP ODSA Open High...