Tuesday, July 19, 2022

OCP releases Bunch of Wires (BoW) spec for chiplet interconnect

The OCP Foundation released its Bunch of Wires (BoW) specification for Chiplet interconnect, representing a next step in the OCP Open Domain Specific Architecture (ODSA) Project's march towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply chain model. 

BoW specifies a physical layer (PHY) optimized for System on a Chip (SoC) disaggregation, and complements OCP ODSA Open High Bandwidth Interconnect (OpenHBI) PHY specification targeting High Bandwidth Memory and other parallel bandwidth intensive use cases.

The ODSA BoW PHY specification is optimized for both commodity (organic laminate) and advanced packaging technologies, enabling cost and energy efficient, as well as high-performance designs across a wide range of process nodes. The specification was authored to allow many use cases driving significant economies of scale. Care was taken to impose as few constraints as possible and to avoid including required features in the specification that could increase design complexity when disaggregating an existing SoC.

The OCP Foundation notes that its BoW specification follow an open license model. It is already in use in at least 10 companies, including Samsung and NXP, over a dozen different use cases spanning 5, 6, 12, 16, 22 and 65nm process nodes, and covering Chiplet-based products for networking, specialized AI silicon, FPGAs, and processors. 

"The demand for specialized silicon has been increasing steadily due to workload diversity, such as with the adoption of AI and ML, and we expect this trend to continue for several years. In response to this demand the OCP recognizes that it must be a catalyst to establish open and standardized Chiplet ecosystems and new markets by investing in Chiplet interconnect technology that will enable composable silicon. The release of the BoW specification is an important step in this direction. We expect to increase our efforts on developing supply chain models for composable silicon," said Bill Carter, CTO, OCP Foundation.

"The semiconductor industry continues to innovate in new and exciting directions with multicore application specific SoCs, custom core architectures, deep learning, optical communications, analog processing techniques, RF interfaces, memory architectures and more. The new challenge is how to integrate all of these disparate innovations, several of which are not practical to produce at cutting- edge process nodes. Today's announcement from the OCP ODSA, releasing the Bunch of Wires open-source specification for Chiplet interconnect, supplies a new tool toward expanding innovation in the market. This opens the door to a more competitive landscape and diversity in innovation at varying cadences and is fuel or a healthy industry," said Tom Hackenberg, Principal Analyst, Computing & Software Semiconductor, Memory and Computing Division, Yole Intelligence.


OCP 2019: New Open Domain-Specific Architecture sub-project 

The Open Compute Project is launching an Open Domain-Specific Architecture (ODSA) sub-project to define an open interface and architecture that enables the mixing and matching of available silicon die from different suppliers onto a single SoC for data center applications. The goal is to define a process to integrate best-of-breed chiplets onto a SoC. Netronome played a lead role initiating the new project. “The open architecture for domain-specific...

Dell'Oro: DWDM equipment market to surpass $17B by 2026

Demand for optical transport DWDM equipment is forecast to surpass $17 billion by 2026, according to a new report from Dell'Oro Group. Over the next five years, it is expected that DWDM long gaul system sales will grow at a faster pace than WDM Metro system sales. 

"Although there is a ton of market turbulence, we do not see demand for DWDM equipment letting up," said Jimmy Yu, Vice President at Dell'Oro Group. "In fact, the biggest issue is that demand seems to be growing faster than supply. Hence, even if a mild recession were to occur, we think the worst case scenario is that demand will align with supply sooner."

"Hence, we are projecting continuous growth for DWDM system revenues. The only difference over the next five years, compared to previous years, is that we are expecting more growth from DWDM Long Haul since IPoDWDM should lower the use of WDM Metro systems in data center interconnect," added Yu.

Additional highlights from the Optical Transport 5-Year July 2022 Forecast Report:

  • DWDM Long Haul revenue is forecast to grow at a five-year compounded annual growth rate (CAGR) of 5 percent.
  • WDM Metro revenue is forecast to grow at a five-year CAGR of 3 percent.
  • Capacity shipments each year are projected to grow at an average annual rate of 30+ percent.
  • Spectral efficiency is expected to improve at an average annual rate of 9 percent.


Verizon starts rollout of 100 MHz of C-band spectrum

Verizon has started deploying with 100 MHz of C-band spectrum in many markets across the US – a significant increase from the 60 MHz it has deployed in 5G markets to date.

In the recent trial, using 100 MHz of C-band spectrum, engineers were able to reach 1.4 Gbps peak download speeds near active cell sites and 500 Mbps further away from the towers.

Verizon said the rollout is occurring several months earlier than expected due to agreements with satellite providers to clear C-Band spectrum (which was originally scheduled to be cleared in December 2023).  As more spectrum is cleared in the coming months and years, Verizon customers ultimately will have access to between 140-200 MHz of C Band spectrum across the nation.

“This increase from using 60MHz to 100 MHz of C-band – which we will ultimately have available in many markets across the US  – allows us to support more network traffic, deliver even better performance to our customers and add new products and services on top of the mobile and fixed wireless access solutions we provide today,” said Kyle Malady, EVP and President, Global Networks and Technology.  “Reaching new levels of innovation and digital transformation in our society requires a fundamental transformation of the networks our world runs on. The continued evolution of our network is paving the way for this tremendous growth.”


Openreach rolls out ADVA’s next-gen edge for Ethernet services

Openreach, has deployed ADVA's next generation of edge technology to support Ethernet Access Direct (EAD) services to customers throughout the UK. 

Openreach’s new infrastructure features the ADVA FSP 150-XG100Pro Series, a MEF 3.0-certified, 10Gbit/s programmable demarcation and aggregation platform. It enables Openreach to offer Carrier Ethernet and IP services with a range of bandwidth options from 100Mbit/s to 10Gbit/s. The new technology supports highly precise synchronization with hardware-based SyncE and PTP. It is managed by the Ensemble Controller suite, enabling integration into Openreach’s existing network. Openreach also offers optical spectrum services exceeding 10Gbit/s to allow movement of large amounts of data around the UK.

The rollout extends a longstanding relationship with ADVA. Over 250,000 Openreach circuits are deployed using the ADVA FSP 150.

“We’re continuing our close relationship with ADVA as we roll out the next generation of our Ethernet services. Over the past 10 years, ADVA’s technology has played a major part in the success of our EAD portfolio. It’s enabled service providers across the country to bring new offerings to the market while helping us establish the finest reputation for quality and reliability,” said Mark Logan, director of products at Openreach. “Through working with ADVA, we can enable our customers with flexible high-bandwidth point-to-point connectivity.”

“Openreach has gone from strength to strength in recent years, enabling many service providers to expand their UK networks and bring high-quality connectivity to millions of customers. We’re proud of our close connection with the Openreach team and are excited that they’ve chosen to continue our partnership,” commented Hartmut Müller-Leitloff, SVP of sales EMEA at ADVA. “Even in a time of global supply chain challenges and component shortages, our customers know that no one else does more than ADVA to make sure we deliver. We’ll carry on supporting Openreach every step of the way throughout its next decade of success.”


Augtera unveils its AI/ML-powered NetOps for data centers

 Augtera Networks, a start-up based in Palo Alto, California, unveiled its AI/ML-powered Network Operations platforms for data centers.

“Over the last three years we have partnered with some of the largest Data Center Network Operations teams to refine our solution,” said Rahul Aggarwal, Founder and CEO of Augtera Networks. “Our AI/ML algorithms have been specialized for Data Center networks and customers are seeing dramatic improvement in KPIs such as detection, mitigation, and repair. Most importantly, our technology reduces the total number of incidents that are actioned, resulting in operations teams not just running faster, but running smarter and more effectively.”

Augtera Networks Data Center Solution:

  • Proactive detection of environmental and optical degradation
  • Anomaly detection for aggregates such as a POD, fabric, or Data Center interconnects
  • Fabric, server, and Hybrid Cloud, latency, and loss anomaly detection
  • Flow analysis including Hybrid Cloud
  • Fabric congestion impact on application sessions
  • VXLAN and EVPN underlay / overlay insights including ECMP analysis
  • Firewall and Load Balancer anomalies
  • Multi-vendor support including Arista Networks, Cisco Systems, Juniper Networks, Dell Enterprise SONiC, F5, Palo Alto Networks, VMWare, and any equipment using industry-standard interfaces
  • Integrations including Amazon Web Services, Azure, Google Cloud Platform, ServiceNow, and Slack.

The solution includes capabilities that come standard with all Augtera Networks solutions including:

  • Holistic data ingestion
  • Automated creation of operationally relevant trouble tickets
  • Policy-driven auto-correlation and noise elimination
  • AI/ML-based anomaly & gray failure detection
  • Topology auto discovery
  • Multi-layer, topology-aware, auto-correlation
  • Topology-mapped “Time-machine” visualization of metrics, events, & anomalies
  • Real-Time Syslog anomaly detection including Zero-Day anomalies
  • DevOps friendly APIs


At the ONUG Spring 2022 event, a key topic of discussion was the critical staff shortages faced by IT departments. Optimizing network operations has become a priority. John Heinz, Director of Sales Engineering at Augtera, discusses how machine learning and automation can reduce time to root cause detection and thus help alleviate the staffing shortage.

Rambus expands its line of DDR5 memory interface chips

Rambus has expanded its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor, complementing its Registering Clock Driver (RCD), to deliver high-performance, high-capacity memory solutions for DDR5 computing systems. Both the SPD Hub and Temperature Sensor are critical components on a memory module that sense and report important data for system configuration and thermal management. The SPD Hub is used in both server and client modules, including RDIMMs, UDIMMS and SODIMMS, and the temperature sensor is designed for server RDIMMs.

“The new performance levels of DDR5 memory place an increased premium on signal integrity and thermal management for server and client DIMMs,” said Sean Fan, chief operating officer at Rambus. “With over 30 years of memory subsystem design experience, Rambus is ideally positioned to deliver DDR5 chipset solutions which enable breakthrough bandwidth and capacity for advanced computing systems.”

Key features of the SPD Hub (SPD5118) include:
  • I2C and I3C bus serial interface support Advanced reliability features 
  • Expanded NVM space for customer-specific applications 
  • Low latency for fastest I3C bus rates 
  • Integrated temperature sensor 
  • Meets or exceeds all JEDEC DDR5 SPD Hub operational requirements (JESD300-5A) 

Key features of the Temperature Sensor (TS5110) include:
  • Precision thermal sensing I2C and I3C bus serial interface support 
  • Low latency for fastest I3C bus rates 
  • Meets or exceeds all JEDEC DDR5 Temperature Sensor operational requirements (JESD302-1.01)


Rambus samples 5600 MT/s DDR5 registering clock driver

Rambus has begun sampling its 5600 MT/s 2nd-generation registering clock driver (RCD) chip to the major DDR5 memory module (RDIMM) suppliers. This new level of performance represents a 17% increase in data rate over the first-generation 4800 MT/s Rambus DDR5 RCD. Rambus said it is able to deliver 5600 MT/s performance at lower latency and power while optimizing timing parameters for improved RDIMM margins.“The RCD is a mission-critical...

Verizon lands $400M contract with FBI

The Federal Bureau of Investigation (FBI) has awarded a $400 million Enterprise Infrastructure Solutions (EIS) task order to Verizon Public Sector to help the agency meet increasing demands for data bandwidth around the globe.

Under the contract, Verizon will provide Ethernet access capabilities and a resilient global Virtual Private Network Services (VPNS) with a Verizon 4G LTE and 5G Nationwide cellular fixed wireless access arrangement, enabling the move to wireless connections provisioned on-demand for faster deployment at FBI locations, and support for high-speed connectivity for FBI agents working in the field.

Verizon’s EIS task order with the FBI includes 24/7 direct access to Verizon’s IT development team to address critical problems or discuss potential system enhancements, enabling the FBI to support a wide range of applications, such as cloud computing, video and imaging transmissions, and data applications that drive demand for dynamic bandwidth capacity.

“We understand the critical nature of the work we will do with the FBI to improve network availability, enhance operational efficiency, use tailored approaches to meet individual division needs, and help modernize technology,” said Maggie Hallbach, Senior Vice President, Public Sector at Verizon. “Building on nearly 20 years of partnership with the Bureau, this next phase will provide stable solutions and a modern network that is faster, more scalable and secure that will help the FBI achieve its mission.”


Liberty Global names CommScope as DOCSIS 4.0 partner

Liberty Global has selected CommScope to develop and deploy a Remote MACPHY Device (RMD) Node platform for DOCSIS 4.0 (D4.0), accelerating Liberty Global’s progress towards 10G capabilities.  

This project marks the industry’s first D4.0 initiative in Europe and leverages CommScope’s DOCSIS leadership and end-to-end portfolio of solutions to deliver a new custom node and RMD platform specifically for Liberty Global. The RMD Node platform for D4.0 will simplify Liberty Global’s hybrid fiber-coaxial (HFC) network transformation to deliver multi-gigabit services—in turn providing its subscribers with seamless access to new high-bandwidth, low-latency services and enabling Liberty Global to ultimately achieve 10G capabilities on the HFC network cost-effectively.

“Our groundbreaking D4.0 project is an important step forward in our 10G vision for the future,” stated Colin Buechner, Managing Director and Chief Network Officer, Liberty Global. “We selected CommScope to extend the capabilities of our HFC network into the next decade, because of their proven leadership and expertise in DOCSIS and next-generation networks. Together, we are laying the path to tomorrow’s multi-gigabit services and providing our subscribers across Europe with the world’s most advanced and reliable services.”

“We are excited to partner with Liberty Global once again as we demonstrate our worldwide leadership in DOCSIS,” said Guy Sucharczuk, SVP and President, Access Network Solutions, CommScope. “Our long-standing partnership with Liberty Global uniquely positions us to deliver end-to-end D4.0 solutions specific to its HFC network. This is a showcase for the global transformation of HFC into tomorrow’s 10G networks, and we’re excited to deploy this technology in Europe and beyond.”


AT&T announces $13m broadband fiber project in Indiana

AT&T has been selected for a $13 million project with the State of Indiana to bring fiber broadband to nine counties. 

The Next Level Connections Broadband project, which is contingent upon a final contract between the state of Indiana and AT&T, will connect nearly 6,100 homes, businesses and farm.

"It's tremendous seeing how our Next Level Connections efforts are helping Hoosier families and business owners obtain access to high-speed, quality broadband," said Indiana Lt. Gov. Suzanne Crouch, who also serves as Indiana's Secretary of Agriculture and Rural Affairs. "This project would bring fiber-based internet to thousands who couldn't get it before, and we're grateful for AT&T's plans for these communities."

AT&T looks to ramp investment in 5G and fiber

 AT&T is setting its sights on becoming "America's best broadband provider" based on a strategy of owning and operating both fiber and wireless. In light of closing its pending WarnerMedia transaction with Discovery, AT&T updated its financial expectations for 2022 and 2023, saying it will shift Capex to fiber and 5G.“Now that the close of the WarnerMedia deal is approaching, we are near the starting line of a new era for AT&T,”...

DigitalBridge appoints Tae Ahn as MD of Asia Capital Formation

DigitalBridge Group appointed Tae E. Ahn as Managing Director and Head of Asia Capital Formation at DigitalBridge Investment Management. Based in Singapore, he will work alongside DigitalBridge’s existing team with a focus on capital formation, coinvestment and client relationship management across Asia-Pacific.

Prior to joining DigitalBridge, he served as Senior Client Relationship Manager and Head of Korea at global private markets firm Partners Group. In that role, which he held for seven years, Mr. Ahn led fundraising, client relationship management and deal sourcing. Mr. Ahn holds a B.A. from the University of Michigan and a Masters in International Economic Policy from Columbia University.


DT to sell 51% stake in towers business to Digital Bridge and Brookfield

Deutsche Telekom will sell 51 percent of GD Towers comprising its tower assets in Germany and Austria, to Digital Bridge and Brookfield at 17.5 billion euros enterprise value on a cash and debt free basis. With around 800 employees, GD Towers operates more than 40,000 sites in Germany and Austria and has a successful track record in delivering new sites for its anchor tenant Telekom Deutschland and securing revenues with third party customers....

Swiss Life-led Consortium to acquire 27% equity Interest in DataBank

DigitalBridge Group will sell an equity stake in its DataBank company to a consortium led by Swiss Life Asset Management AG and EDF Invest.DataBank’s portfolio consists of more than 65 data centers, 20 interconnection hubs in more than 27 markets, on-ramps to an ecosystem of cloud providers, and a modular edge data center platform.Under the terms of the agreement, SLAM and EDF will acquire 27% of the fully diluted equity interests in DataBank for...

DigitalBridge to acquire Switch for $11 billion for its data centers

DigitalBridge Group agreed to acquire Switch, a leading colocation data center operator, for $34.25 per share in an all-cash transaction valued at approximately $11 billion, including the assumption of debt.Switch, which was founded in 2000, operates SuperNAP data center campuses in Las Vegas, Reno, and Grand Rapids, Michigan. The company touts its high-resiliecy and high-security designs for mission critical workloads in its "Class 5" data centers....

Ethernet Alliance offers Power over Ethernet certification testing in Taipei

The Ethernet Alliance announced Power over Ethernet (PoE) Certification Gen 2 testing in Taipei, Taiwan, with UL Solutions. 

Manufacturers of PoE devices can now pursue Gen 1 and Gen 2 certification via third-party testing at labs in both Asia and North America, as well as testing at their own facilities with Ethernet Alliance-approved equipment.