ECOC22: OIF demonstrates 400ZR, Co-Packaging, CEI 112G, 224G, CMIS

At this week's ECOC 2022 exhibition in Basel, Switzerland, OIF is hosting nearly 30 member companies in demonstrations in four critical areas: 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) architectures and Common Management Interface Specification (CMIS) implementations.400ZR DemoOIF’s 400ZR project is proving successful in facilitating new and simplified architectures for high bandwidth inter-data center interconnects and...

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ECOC22: Keysight's waveform generator speeds well past 160 GBaud

Keysight Technologies introduced its M8199B arbitrary waveform generator (AWG), which provides R&D engineers a high-performance signal source for arbitrary signals that enables development of designs employing multi-level modulation formats (e.g. 64QAM) at well beyond 160 GBaud.Applications beyond 128 GBaud demand a new class of generators that provide high speed, precision and flexibility at the same time. Keysight addressed these challenges...

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ECOC22: SABIC intros ultra-high-heat resin for CPO transceivers

SABIC introduced its EXTEM RH1016UCL resin, a new ultra-high-heat, near-infrared (IR)-transparent grade well-suited for injection-molded lenses used in co-packaged optical transceivers and other optical connectors. EXTEM RH1016UCL resin is one of the first IR-transparent thermoplastics that can robustly withstand the 260°C peak temperature of printed circuit board (PCB) reflow soldering while maintaining dimensional stability of the molded part....

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