Aktino, a start-up based in Irvine, California, unveiled a unique new way of bonding copper pairs into higher capacity "fiber-like" access lines. The solution, which is aimed at business-class services for locations not served by fiber, is a carrier-class product for long-reach DS3 (45 Mbps) over copper.Aktino' uses Multiple Input Multiple Output (MIMO) techniques found in high-performance wireless equipment. Unlike earlier copper bonding solutions, Aktino's silicon performs the bonding at the physical layer, overcoming noise and line impairment...