CHIPS R&D Office offer $1.6 Billion for Advanced Packaging

The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging in the United States. With up to $1.6 billion in cooperative agreements and other transaction agreements, this program seeks to establish domestic capacity for cutting-edge packaging technologies crucial for next-generation computing, AI, and low-power electronics.This funding is part of the broader...

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Applied Materials unveils Advanced Chip Wiring and Stacking

Applied Materials introduced groundbreaking materials engineering innovations designed to enhance the performance-per-watt of computer systems. These innovations enable copper wiring to scale to the 2nm logic node and below, addressing the increasing demand for energy-efficient computing in the AI era. The industry faces significant challenges as it scales to 2nm and below. Current logic chips, which contain billions of transistors connected...

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SEMI: Global semiconductor equipment sales to hit record $109B in 2024

Global sales of semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecasted to reach an unprecedented $109 billion in 2024, marking a 3.4% year-on-year growth, according to SEMI’s Mid-Year Total Semiconductor Equipment Forecast unveiled at SEMICON West 2024. This growth trajectory is expected to continue into 2025, with sales predicted to soar to $128 billion, driven by robust demand in both front-end and back-end...

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Sparkle activates PoP at Rome’s Largest Data Centre Campus

Sparkle, Italy’s premier international service provider, and Aruba S.p.A, the country’s leading provider of cloud and data services, have announced the activation of a new Sparkle Point of Presence (PoP) at Aruba’s Hyper Cloud Data Centre in Rome. This new PoP, set to be inaugurated soon, strengthens Rome’s position as a global connectivity hub between Europe, Africa, the Middle East, and Asia, facilitated by Sparkle’s new BlueMed cable. The BlueMed...

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AMD to acquire Silo AI for $665 Million, expanding AI capabilities

AMD agreed to acquire Silo AI, Europe’s largest private AI lab, for approximately $665 million in cash. This acquisition is a strategic move by AMD to enhance its end-to-end AI solutions based on open standards and to strengthen its partnership within the global AI ecosystem. Silo AI’s team, comprising world-class AI scientists and engineers, is known for developing customized AI models and platforms for leading enterprises across various markets,...

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Norway's Sodvin replaces GPON with Ciena’s XGS-PON

Sodvin AS, a provider of telecommunications and energy solutions, is leveraging Ciena’s fiber broadband platform to improve the capacity and reach of its residential broadband services throughout Trøndelag county, Norway. Utilizing its existing power infrastructure, Sodvin is deploying fiber-optic networks to extend broadband access to residents and businesses in the region. Ciena’s XGS-PON solution replaces previously deployed GPON technology,...

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