
Intel demonstrated the first multi-chiplet package using Universal Chiplet Interconnect Express (UCIe) interconnects.Universal Chiplet Interconnect Express (UCIe) is an open industry standard for a die-to-die interconnect and serial bus between chiplets. It is co-developed by AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC. In August 2022, Alibaba Group and Nvidia joined as board members. The open specification...