Google Cloud is now on a $10 billion per annum run rate while YouTube is at $15 billion in annual ad revenue.
In Q4 2019, Google Cloud generated $2.614 billion in revenue, up from $1.709 billion a year earlier.
“Our investments in deep computer science, including artificial intelligence, ambient computing and cloud computing, provide a strong base for continued growth and new opportunities across Alphabet,” said Sundar Pichai, Chief Executive Officer of Alphabet and Google. “I’m really pleased with our continued progress in Search and in building two of our newer growth areas — YouTube, already at $15 billion in annual ad revenue, and Cloud, which is now on a $10 billion revenue run rate."
“In 2019 we again delivered strong revenue growth, with revenues of $162 billion, up 18% year over year and up 20% on a constant currency basis,” said Ruth Porat, Chief Financial Officer of Alphabet and Google. “To provide further insight into our business and the opportunities ahead, we’re now disclosing our revenue on a more granular basis, including for Search, YouTube ads and Cloud.”
The achievement leverages wavelength beam combining (WBC) technology on a direct diode laser (DDL) to produce a high quality output beam. The output power optimization of the high-beam-quality blue laser (wavelength band = 400 – 450nm) was realized by combining more than 100 emitters from multiple diode bars with WBC technology.
USVP said its strategy is to be the lead Series A investor in companies based in the U.S. or Israel in four core sectors: cybersecurity, enterprise software, consumer and healthcare—including the emerging digital health sector.
Intelsat 40e will be based on Maxar’s 1300-class satellite platform and Intelsat Epic. It will deliver high-throughput, “coast-to-coast” coverage for North America. It will also integrate NASA’s Tropospheric Emissions: Monitoring of Pollution (TEMPO) payload.
The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16-gigabit (Gb) DRAM dies on top of a buffer chip. This HBM2E package is then interconnected in a precise arrangement of more than 40,000 ‘through silicon via’ (TSV) microbumps, with each 16Gb die containing over 5,600 of these microscopic holes.
