Linear Pluggable Optics Consortium gets underway

A new Linear Pluggable Optics Multi-Source Agreement (LPO MSA) is underway to develop the specifications for networking equipment and optical modules.The founding participants of the LPO MSA encompass a notable array of companies such as Accelink, AMD, Arista, Broadcom, Cisco, Eoptolink, Hisense, Innolight, Intel, MACOM, NVIDIA, and Semtech Corporation.The initial target of the MSA is an optimized optical interconnect with LPO modules on both ends...

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Marvell demos 3D Silicon Photonics (SiPho) Engine

Marvell is demonstrating a 3D Silicon Photonics Engine designed for next-generation AI clusters and cloud data centers. The new device packs 32 channels of 200G electrical and optical interfaces for connecting next-generation AI clusters and cloud data centers at multi-terabit speeds. The 200 Gbps device delivers 2x the bandwidth, 2x the input / output (I/O) bandwidth density, and 30% lower power per bit compared to comparable devices with 100...

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TeraSignal intros CMOS Re-Driver for 800G LPO

TeraSignal has begun sampling a novel intelligent 400G (4x100G) PAM4 modulator driver with digital link training and link monitoring for 800G linear pluggable optical (LPO) modules. TeraSignal’s new TS8401/02 intelligent modulator driver addresses the limitations of traditional LPO modules, which unlike DSP-based re-timers, have lacked the capabilities for automatic adaptation, digital link monitoring and link training, making them challenging...

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New Photonics debuts Transmitter-on-Chip PIC

NewPhotonics introduced its second generation photonic integrated circuit with integrated optical equalizer for high-throughput optical interconnects. The enhanced transmitter-optimized chip offers breakthrough minimal latency and power performance at 800 GBps and 1.6 TBps for linear receive optics (LRO) and linear drive pluggable optics (LPO) applications in the data center.The NewPhotonics NPG102 PIC is an octal and quad parallel single mode (PSM)...

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Corning intros Multifiber Pushlok connectors

Corning introduced its Multifiber Pushlok Technology for simplifying and accelerating fiber deployments.Multifiber Pushlok is a “stick-and-click” connector technology thatallows operators to deploy more fiber in tighter spaces – an essential consideration for increasing data usage. It is a key feature in a new line of Evolv solutions, which take complicated splicing tasks out of the field to help installers connect homes and businesses more efficiently.The...

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Coherent opens 6-inch indium phosphide (InP) wafer fabrication

Coherent has established the world’s first capability for 6-inch indium phosphide (InP) wafer fabrication, in the company’s Sherman, Texas, and Järfälla, Sweden, wafer fabs. Coherent is in the process of qualifying several existing products on its 6-inch InP platform, including a 200G electro-absorption modulated laser (EML), 200G distributed-feedback laser and Mach-Zehnder modulator (DFB-MZ), 100G EML, high-speed photodetectors, and high-power...

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Avicena's Sub-pJ/bit LightBundle Chiplet Interconnect covers 10m

Avicena unveiled its new scalable LightBundle chiplet interconnect for extending ultra-high density die-to-die (D2D) connections up to 10m at multi-Tbps/mm shoreline bandwidth density and sub-pJ/bit energy efficiency. The new chiplet interconnect, which is based on Avicena’s LightBundle platform, supports unprecedented shoreline density and energy efficiency for HPC and AI cluster architectures.Currently, High Bandwidth Memory (HBM) modules...

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NLM Photonics Names Brad Booth as New CEO

NLM Photonics, a start-up based in Seattle, named current board member Brad Booth as its new CEO, replacing co-founder Gerard Zytnicki, who will stay in a leadership role as Chief Operating Officer and continue serving on the Board of Directors as Chairperson. Booth previously served at Meta Platforms and Microsoft Azure, where he focused on developing next-generation optical connectivity solutions for Cloud and AI data centers. Previously,...

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Ericsson to cut 1,200 jobs in Sweden

Ericsson plans to cut approximately 1,200 jobs in Sweden. The company confirmed that it has opened negotiations with the unions.In addition to the headcount reduction, the cost saving initiatives cover various areas such as reduction of consultants, streamlining of processes, and reduced facilities.https://www.ericsson....

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Pilot Photonics targets CPO, secure EIC award

Pilot Photonics, a start-up based in Dublin, Ireland, secured €2.5M from the European Innovation Council (EIC) to develop, integrate and commercialize key technology blocks relevant to a coherent co-packaged optics (CPO) solution.Pilot Photonics said it continues to develop a number of its patented technologies including comb lasers, ring resonator IQ modulators and comb-enhanced DSP algorithms. These innovations are relevant to both pluggable and...

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