COBO demos packet transmission between On-Board and MSA modules

At this week's ECOC 2019 in Dublin, the Consortium for On-Board Optics (COBO) showcased compliance boards built to its recently completed Module Compliance Board (MCB) and Host Compliance Board (HCB) specification. Members also demonstrated the latest developments of optical connectivity solutions for faceplate, backplane, module and co-packaged optics. Of note, a COBO proof-of-concept switch was demonstrating error-free packet transmission between...

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Broadcom delivers dual 400G MACSec PHY

Broadcom is now shipping a dual 400G MACSec PHY with AES-256 designed to address security requirements for high speed interconnects in modern network infrastructure including hyper-scale, cloud, service provider and enterprise networks. Broadcom's BCM81343 quadruples the switch bandwidth capability of the previous generation duall 100G MACSec PHY by offering dual 400G ports. The device supports the IEEE 1588 precision time protocol (PTP) providing...

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Mellanox adds SONiC to its Spectrum switches

Mellanox Technologies announced ASIC-to-Protocol (A2P) customer support solutions for the SONiC Network Operating System (NOS) on Mellanox Spectrum switches. SONiC (Software for Open Networking in the Cloud) is a fully open-sourced NOS for Ethernet switches, first created by Microsoft to run Microsoft Azure and now a community project under the Open Compute Project (OCP). SONiC is built on the Switch Abstraction Interface API (SAI) and breaks down...

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Rambus tapes out its 112G XSR SerDes PHY

Rambus taped out its 112G XSR SerDes PHY on a leading-edge 7nm process node optimized for PPA to support data center, networking, HPC, AI and ML applications. Rambus said its 112G XSR SerDes PHY represents the latest advancement in high-speed signaling technology for die-to-die (D2D) and die-to-optical engine (D2OE) connections. "As semiconductor markets turn towards chiplets to enable their high-performance products, chip-to-chip interconnects...

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Broadband Forum updates Connect Home specs

Broadband Forum has released the latest version of its Connected Home standard User Services Platform (USP) alongside new Wi-Fi data models as part of TR-181. USP 1.1 enables new deployments to implement quickly into existing infrastructure via support of MQTT, a commonly used protocol in many different aspects of the Connected Home. The Broadband Forum said its new release also provides northbound REST APIs, which define a standard way of communicating...

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Intel outlines “Barlow Pass” - 2nd gen Optane DC persistent memory

Intel outlined a series of milestones in advancing memory and storage for cloud, artificial intelligence and network edge applications. Developments include: Intel plans to operate a new Optane technology development line at its facilities in Rio Rancho, New Mexico;  The second-generation of Intel Optane DC Persistent Memory, code-named “Barlow Pass,” scheduled for release in 2020 with Intel’s next-generation Intel Xeon® Scalable processor  Intel’s...

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Aryaka extends SD-WAN with HybridWAN capability

Aryaka has extended its Global Managed SD-WAN with a HybridWAN capability, where a combination of Aryaka’s Layer 2 core connectivity and Aryaka-managed internet connectivity will provide a more flexible experience. The Aryaka core option offers guaranteed performance for business-critical traffic, while the Internet option offers cost-effective transport for non-priority traffic, an ‘Internet-first’ paradigm for enterprise connectivity that tracks...

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Bigleaf raises $21 million for its SD-WAN

Bigleaf Networks, a start-up based in Beaverton, Oregon, announced $21 million in Series B funding for its cloud-first SD-WAN. Bigleaf says that while current networking technologies have been built for the large enterprise use-case of site-to-site networking, there is a gap for SMB and mid-sized companies seeking SD-WAN solutions. Bigleaf is exclusively focused on partner-led channels, including telecom operators. The funding round was led by...

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Ericsson makes US$1.23 billion provision for U.S. investigation

Ericsson made a provision of SEK 12 billion (US$1.23 billion) to resolve the ongoing investigation by U.S. authorities. The process to find a resolution is still ongoing, but Ericsson reckons it may face a monetary sanction of US$1 billion. As previously disclosed, Ericsson has been co-operating voluntarily since 2013 with an investigation by the United States Securities and Exchange Commission (SEC) and, since 2015, with an investigation by the...

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HPE completes acquisition of Cray

Hewlett Packard Enterprise completed its previously announced acquisition of Cray Inc., the legendary supercomputer developer. The deal, which was first announced in May, was valued at approximately $1.3 billion, net of cash. “Bringing together Cray and HPE establishes the most comprehensive end-to-end portfolio across compute, storage, software and services in the fast-growing high performance computing and artificial intelligence market segments,”...

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