Nokia debuts its next-gen IP access, aggregation and edge routers

Nokia unveiled its 7730 Service Interconnect Router (SXR) family of next-generation IP access, aggregation and edge platforms based on its new FPcx  network processing unit (NPU), 112G SerDes, and SFP-DD optics.The new, fully programmable FPcx processor, which is implemented in 7nm silicon, enables network security features such as in-line filtering for DDoS mitigation and line-rate MACsec/ANYsec encryption. The chip also features 7-level hierarchical...

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Accton intros 51.2 Tbps switch with 64x800G ports

Taiwan-based Accton Technology introduced a series of 800G-optimized products that can provide Ethernet-based fabric and Virtual Output Queue (VoQ) based fabric for AI/ML workloads. The announcement includes a 2RU 51.2 Tbps Ethernet-based fabric system with 64x800G ports, a 4RU 51.2 Tbps Ethernet-based fabric system with 128x400G ports, and a VoQ-based fabric Distributed Disaggregated Chassis (DDC) architecture with a 128x800G Network Cloud...

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Enfabrica raises $125M for its 8 Tbps Accelerated Compute Fabric

Enfabrica,  a start-up based in Mountain View, California, closed a $125 million Series B financing round for its converged networking and memory fabric silicon and software.The company says the new capital will be deployed to advance the production of itsAccelerated Compute Fabric Switch (ACF-S) devices and solutions, which complement GPUs, CPUs and accelerators to solve critical networking, I/O and memory scaling problems in data center AI...

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Infinera's ICE-X coherent pluggables comply with Buy America

Infinera confirmed that its ICE-X intelligent coherent pluggables and compound semiconductor components  will be manufactured in the U.S. and compliant with the Build America, Buy America requirements recently released by the Commerce Department for the Broadband Equity, Access, and Deployment (BEAD) program. Infinera operates an optical compound semiconductor fabrication facility in California and an advanced testing and packaging facility...

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OpenZR+ MSA Group adds 400G 8QAM and higher transmit power

The OpenZR+ Multi-Source Agreement (MSA) Group published the OpenZR+ Rev 3.0 specification which defines a higher performing 400G 8QAM mode as well as a higher transmit power mode.The new specification is designed to further expand the application space for a coherent solution in small form factor pluggable modules, such as form factors defined by the QSFP-DD MSA and OSFP MSA.“The OpenZR+ MSA is once again paving the way towards multi-vendor interoperability...

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Intel to sell 10% stake in the IMS Nanofabrication business to TSMC

Intel agreed to sell an approximately 10% stake in the IMS Nanofabrication business to TSMC. TSMC’s investment values IMS at approximately $4.3 billion, consistent with the valuation of the recent stake sale to Bain Capital Special Situations. Intel will retain majority ownership of IMS, which will continue to operate as a standalone subsidiary under the leadership of CEO Dr. Elmar Platzgummer. The transaction is expected to close in the...

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