
Intel announced microarchitecture and memory details of its next-generation Intel Xeon Phi processor (code-named Knights Landing) and an end-to-end interconnect fabric optimized for fast data transfers, both aimed at powering High-Performance Computing (HPC) systems.
Knights Landing, which is expected to debut in the second half of 2015, will include up to16GB high-bandwidth, on-package memory at launch – designed in partnership with Micron – to...