OIF published two Implementation Agreements (IA):Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach - which specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range 36 Gsym/s to 58 Gsym/s. The intended applications encompass multiple-chip modules (MCM), co-packaged optics...