OpenLight unveils 224G InP-based modulator

OpenLight demonstrated a 224G InP-based modulator available for Tower's PH18DA platform for datacom applications supporting 224G per wavelength

The new 224G modulator is integrated on a demonstration PIC with a heterogeneous integrated laser and other required silicon photonics components to enable a full transmitter. 

"This new modulator doubles the speed of every PIC," said Dr. Adam Carter, Chief Executive Officer at OpenLight. "For instance, our 800G DR8 PIC which was recently announced can become a 1.6T PIC (8x200G). Alternatively, a 400G DR4 PIC can now deliver 800G with four lanes. Our latest offering allows datacom customers to not only prepare for the future, but also keep up with the growing need for increased connectivity speeds."

"Our partnership with OpenLight continues to augment capability offered to all our silicon photonics foundry customers," said Dr. Marco Racanelli, Senior Vice President and General Manager of Tower Semiconductor's Analog Business Unit. "OpenLight's technology through Tower Semiconductor allows customers to achieve 224G operation on a silicon photonics platform and achieve the same benefits offered by on-chip lasers and optical gain without the need for separate lasers and costly attachment methods."

"200G modulation is a key building block and critical path to the delivery of next generation Ethernet speeds based upon 200G/lane," said Jim Theodoras, Vice President of Research and Development at HGGenuine USA. "This is not just a 200G modulator, but one that is available in a hybrid photonic integrated circuit. Next generation Ethernet cannot be delivered at the power and densities being requested by datacom customers without photonic integrated circuits, and we are happy to partner with OpenLight on their industry leading PIC technology that will enable not just 1.6T today, but also 3.2T in the near future."  

https://www.openlightphotonics.com

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Open XR Forum completes test of Point-to-Point 400G Pluggable Optics

The Open XR Forum demonstrated long-haul point-to-point transmission between QSFP56-DD coherent transceivers over 1,400 km at 400 Gb/s using 16QAM modulation, as well as error-free performance at 300 Gb/s using 8QAM modulation over a span of 2,495 km. 

The testing was conducted in conjunction with founding member Lumen Technologies using Infinera's ICE-XR 400G QSFP56-DD transceivers operating in third-party routers and transmitting over third-party line systems. The long-distance performance demonstrates the potential for pluggable transceivers to be used in DWDM long-haul and large metro networks. The integrated management features, which included in-band remote management and streaming telemetry, demonstrated transport functionality typically found in a transponder, but in the compact form of a pluggable transceiver. This management decoupling of key transceiver functions from host routing functions is a new and easily generalized method for integration and management of coherent transceivers in any host device, including routers, switches, and servers. The ability to separate management of IP and Optical functions better aligns with existing service provider operational models, helping resolve a key barrier for deployment of IP over DWDM.

The Open XR Forum said the demonstration is significant in two ways:

• long-reach performance equal to or greater than current state-of-the-art transceivers, 
• the first published demonstration of an advanced management method that enables management and control of optical transceiver functions independently from the host equipment.

The details and results of this demonstration are available in an Open XR Forum report, P2P (Point-to-Point) Performance and Host Independent Management Proof of Concept Demonstration.

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NTT Electronics ships 400G coherent co-package device for 400ZR/ZR+

NTT Electronics is now sampling its 400G coherent co-packaged devic for 400ZR/ZR+ optical transceivers. 

The new ExaLIGHT 400 consists of integrated dies of NTT Electronics’ ExaSPEED 400-R DSP and Silicon photonics based Coherent Optical Sub-Assembly (COSA 2.0) in a single package, which can be controlled by firmware for optimal performance. The package is non-hermetic and TEC-free and utilizes reflowable solder in BGA configuration to achieve 30% reduction in overall dimension compared to discreet design. 

NTT Electronics says the new ExaLIGHT 400 CPD eliminates the complexity of PCB design for supporting high speed signals between discrete DSP and coherent optics and simplifies module development. Furthermore, it creates additional space inside a small form factor pluggable module which is essential to integrate EDFA for 0dBm output power applications. NTT Electronics is pleased to be collaborating with key industry interconnect and optical transceiver suppliers, as part of its role to support the development of this innovative technology.

“The Coherent co-packaged device is an attractive offering for us, as a pluggable module provider. Its compactness is beneficial for small form factor module designs, and we’re also able to achieve better production yields than discrete components. We believe these features of coherent co-packaged devices will help us further development of efficient coherent pluggable modules,” said Joseph Chon, Director of Coherent Technology & Product Line Management, Molex.

“Pluggable coherent module assembly can be greatly simplified by simply combining ExaLIGHT 400 CPD with tunable Lasers. Its compactness and unified software design kit (SDK) for both DSP and COSA greatly reduce our customer’s development time of coherent pluggable modules,” said Tatsuhito Suzuki, NTT Electronics Executive Vice President and General Manager of Broadband System & Device Business Group. “Coherent CPD technology is a significant milestone for development of coherent pluggable modules. NTT Electronics continues to provide innovative solutions for key components to our valued partners”, he added.

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Eoptolink launches 800G, 400G and 100G Multimode BIDI transceivers

Eoptolink Technology introduced multimode BIDI transceivers: 800G SR4.2, 400G SR4.2 and 100G SR1.2.  The 800G and 400G versions are available in both OSFP and QSFP-DD800 form factors. 

The 800G SR4.2 transceiver uses 850nm and 910nm VCSELs with 106Gbps wavelengths. Two wavelengths are combined bidirectionally onto a single fiber. The 800G SR4.2 uses 4+4 fibers in an MPO-12 connector interface. This enables a smooth upgrade path from 400G to 800G without the need to replace the fiber infrastructure.

The 400G SR4.2 transceiver operates at 53Gbps wavelengths and follows the same architecture of the 800G SR4.2.  It can be configured for 400G point to point connectivity or as 400G to 4x100G with breakout connectivity. Both 100G MM bidi modules and 100G SR1.2 legacy modules based on IEEE KP4 FEC are supported in the 4x100G breakout application.

The 100G SR1.2 modules use a QSFP28 form-factor with duplex LC interface. The 850nm and 910nm wavelengths are combined onto a single fiber to guarantee interoperability with the 400G SR4.2 modules. The line side FEC follows the IEEE KP4 FEC.

"Our customers have reached out to us and asked us to develop these modules," explains Sean Davies, Eoptolinks VP Sales, "By introducing multimode BIDI optical transceivers capable of supporting 800G, 400G, and 100G, we have enhanced our comprehensive line of Multi-Mode transceivers and AOC cables supporting data rates from 10G to 800G."

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MACOM acquiresL inearizer Communications Group

MACOM Technology Solutions has acquired Linearizer Communications Group for approximately $49 million.

Linearizer, which is based in Hamilton, New Jersey and was founded in 1991 by Dr. Allen Katz, pecializes in non-linear microwave predistortion for use in terrestrial, avionic and space-based applications and high-performance microwave photonic solutions for use in the industrial and defense markets. The Linearizer team uses proprietary design and manufacturing techniques to produce its high-performance components and subsystems. Linearizer has a long history of service to its loyal customer base, which is primarily in North America.

“We are pleased to welcome Linearizer’s team into MACOM,” stated Stephen G. Daly, President and Chief Executive Officer, MACOM. “This acquisition strengthens MACOM’s component and subsystem design expertise in our target markets, which is in line with our long-term growth strategy.”

Dr. Allen Katz, Founder and President of Linearizer, stated, “We are thrilled to become part of MACOM. The synergy between our organizations is incredible. We look forward to executing a growth strategy utilizing the resources that MACOM can bring to bear.”

www.macom.com

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OFS joins Terabit BiDi Multi-Source Agreement

OFS has joined the Terabit BiDi Multi-Source Agreement (MSA) group. 

The MSA recently announced the publication of release 1.0 of its optical specifications for 800 Gb/s and 1.6 Tb/s optical interfaces over 70 meters of OM4 multimode fiber (MMF) and over 100m of OM5 multimode fiber. The MSA's specifications utilize the widely adopted dual wavelength bidirectional transmission technology. This provides an upgrade path to the large-scale deployed parallel MMF cabling infrastructure. The specifications are built on the 100 Gb/s Ethernet MMF specifications.

Additional members of the Terabit BiDi MSA include Alibaba, Arista, Broadcom, Cisco, Coherent, CommScope, Corning, Dell Technologies, HGGenuine, Hisense, Lumentum, MACOM, Marvell, Panduit and Tencent.

info@terabit-bidi-msa.com 

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Gigi Sohn drops bid for FCC commissioner seat

Over one year after being nominated by President Biden, Gigi Sohn formally withdrew from consideration as an FCC commissioner. 

The position requires U.S. Senate consent and despite three confirmation hearings, it did not appear likely that she could gain  approval. 

For now, the fifth seat at the FCC remains vacant.

Biden nominates Jessica Rosenworcel and Gigi Sohn to FCC

Tuesday, October 26, 2021  FCC, People  

President Biden nominated Jessica Rosenworcel to serve as Chair of the Federal Communications Commission and Gigi Sohn as Commissioner of the FCC.Jessica Rosenworcel presently serves as acting chair of the FCC. She has served as a Commissioner since 2012. Prior to joining the agency, she served as Senior Communications Counsel for the United States Senate Committee on Commerce, Science, and Transportation, under the leadership of Senator John D....

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Casela achieves record high-efficiency, high-power uncooled 1.31 um CW-DFB lasers

 Casela Technologies introduced its 1310nm band high-power, continuous-wave (CW) distributed feedback (DFB) lasers .

Cáselas claims record high power conversion efficiency and optical powers for silicon photonics-based transceivers.

Casela’s new 1 and 2 mm long DFB lasers achieve 125mW to 200mW optical power when uncooled and 300 to 400mW, respectively, when cooled, enabling the use of single laser for DR4 and DR8 transceivers. High optical powers are achieved at industry-leading power conversion efficiencies of 30% when cooled and 20% when uncooled operating at the maximum rated power. Key features include large modes with near-circular profiles that improve coupling efficiency to fibers or silicon-based waveguides and reliable operation proven during accelerated life testing. The same high-efficiency, high-power laser design is also available at other WDM, LAN-WDM and CWDM4 wavelengths. 

“Casela was founded by industry veterans to focus on an innovative path to higher laser powers and efficiency demanded by new requirements in datacenters and system-on-chip (SOC) applications,” said Dr. Bo Lu, CEO of Casela Technologies. “With the demonstration and publication of our industry-leading laser results at OFC 2023, we are announcing our new laser platform and products for transceiver and co-packaged optics applications. We are also pleased that Casela’s high-output laser performance has been validated by multiple customers and will be available in high-volume production in 2H2023.”

www.caselatech.com

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