Presented this week at the Alibaba Group Investor Day conference.
Thursday, September 20, 2018
Telia Carrier to offer Cloud Connect service in TierPoint's data centers
Telia Carrier will offer its Cloud Connect service across 25 TierPoint data centers in the U.S. across 14 metro areas, including Boston, Charlotte, Chicago, Connecticut, Dallas, Kansas City, Milwaukee, Nashville, New York, Omaha, Philadelphia, Raleigh, St. Louis, and Seattle.
Telia Carrier’s Cloud Connect provides multiple, geographically diverse connections to the world’s largest cloud providers, including Microsoft, Amazon, Google and IBM.
Customers in TierPoint’s facilities will also benefit from access to Telia Carrier’s MEF 2.0 certified data center-to-data center Ethernet service, which connects to more than 150 Points-of-Presence worldwide.
“As enterprises continue to entrust their critical business processes to the cloud, direct and secure connectivity which bypasses the public internet becomes vital,” said Staffan Göjeryd, CEO, Telia Carrier. “In partnering with TierPoint, we’re able to bring enhanced global connectivity and our award winning customer care to many additional new locations, providing the quality of service and performance that enterprise customers expect. We’re really excited about expanding this relationship and in particular, the tangible benefits it will bring to TierPoint’s customers.”
“This new partnership with Telia Carrier is yet another key step in the process of expanding the connectivity options for clients using our data centers and cloud pods,” said TierPoint Chief Technology Officer Terry Morrison. “It further enhances our market-leading, edge-infrastructure solutions.”
Telia Carrier’s Cloud Connect provides multiple, geographically diverse connections to the world’s largest cloud providers, including Microsoft, Amazon, Google and IBM.
Customers in TierPoint’s facilities will also benefit from access to Telia Carrier’s MEF 2.0 certified data center-to-data center Ethernet service, which connects to more than 150 Points-of-Presence worldwide.
“As enterprises continue to entrust their critical business processes to the cloud, direct and secure connectivity which bypasses the public internet becomes vital,” said Staffan Göjeryd, CEO, Telia Carrier. “In partnering with TierPoint, we’re able to bring enhanced global connectivity and our award winning customer care to many additional new locations, providing the quality of service and performance that enterprise customers expect. We’re really excited about expanding this relationship and in particular, the tangible benefits it will bring to TierPoint’s customers.”“This new partnership with Telia Carrier is yet another key step in the process of expanding the connectivity options for clients using our data centers and cloud pods,” said TierPoint Chief Technology Officer Terry Morrison. “It further enhances our market-leading, edge-infrastructure solutions.”
- Earlier this month, Telia Carrier announced the activation of a new PoP (Point-of-Presence) in Tokyo, Japan. Telia Carrier noted that recently there has been a significant increase in the amount of IP traffic moving through APAC, a region that loves its online gaming, rich Internet and video content.
ECOC 2018: First COBO-compliant optical modules
The world’s first optical modules compliant with Consortium for On-Board Optics (COBO) will be shown at next week's ECOC Exhibition 2018 in Rome, Italy.
Specifically, COBO will present a showcase of solutions from Molex, Ciena and SENKO, TE Connectivity, Credo, and AOI.
A goal of COBO is to bring interoperable and interchangeable optical modules into the manufacturing of networking equipment to help address industry challenges, including continual traffic growth, the need for lower power consumption and the increasing speeds of networking technologies such as 400 Gigabit Ethernet.
“Next-generation technologies such as Artificial Intelligence, 5G, and the Internet of Things (IoT) are progressing at a rapid rate and all stand to benefit from equipment manufacturers’ adoption of on-board optics,” said Brad Booth, President of COBO. “The data produced by these applications needs to move efficiently and rapidly between devices and the demonstrations not only represent a significant step forward in achieving this through board-mounted optical modules but also a big step towards mass deployment of interoperable solutions.”
Some highlights:
COBO - Stand 608 at ECOC Exhibition 2018
A look at COBO and the drive for on-board optics
Specifically, COBO will present a showcase of solutions from Molex, Ciena and SENKO, TE Connectivity, Credo, and AOI.
A goal of COBO is to bring interoperable and interchangeable optical modules into the manufacturing of networking equipment to help address industry challenges, including continual traffic growth, the need for lower power consumption and the increasing speeds of networking technologies such as 400 Gigabit Ethernet.
“Next-generation technologies such as Artificial Intelligence, 5G, and the Internet of Things (IoT) are progressing at a rapid rate and all stand to benefit from equipment manufacturers’ adoption of on-board optics,” said Brad Booth, President of COBO. “The data produced by these applications needs to move efficiently and rapidly between devices and the demonstrations not only represent a significant step forward in achieving this through board-mounted optical modules but also a big step towards mass deployment of interoperable solutions.”Some highlights:
- Molex will display a COBO module-based reference layout board that includes high-density front panel Optical EMI shielding adapters, a blind-mate optical backplane interconnect and an on-card optical cabling featuring FlexPlane technology. The demo will highlight how system vendors can utilize Molex optical cable management technologies to integrate COBO on-board optical modules into next-generation system architectures.
- Ciena and SENKO will show how low-profile face plate connector solutions can enhance the air flow capability and fiber management inside equipment, which will include the CS Connector, a new high-density solution, MPO PLUS Bayonet, and μ-LC that can create more space inside the equipment. In addition, two white papers will be available. The first looks at Data Center Interconnect traffic growth and how this drives the need for increased electrical high-speed signaling, best in-class layout and selection of printed circuit board laminate, where analysis is made of different material properties in the context of COBO applications and verification is made of the compliance to OIF CEI-56G-VSR-PAM4. The second study performs a thermal assessment including the coherent application in context to verify thermal capabilities of the COBO module for 14.4Tb/s capacity 1RU line card.
- A 112Gbps demonstration will be performed jointly by TE Connectivity and Credo via a test set-up that provides a feasibility demonstration for future COBO applications using 100Gbps electrical lanes based on TE Connectivity’s channel and high-speed connector driven by Credo Semiconductor transceiver silicon.
- AOI will exhibit a 400G 16 lane on-board optics device that can achieve 2km reach at 1310nm wavelength. It leverages the COBO form factor, electrical pin out and electrical connector specifications released earlier this year. AOI is taking advantage of the SiP technology for this compact device which has a highly integrated design for an on-board optics module.
COBO - Stand 608 at ECOC Exhibition 2018
Filmed at NetEvents 2018 in San Jose, California
A look at COBO and the drive for on-board optics
The Consortium for On-Board Optics (COBO) was formed three years ago to develop specifications to permit the use of board-mounted optical modules in the manufacturing of networking equipment, such as switches and even servers. The specifications will cover electrical interfaces, pin-outs, connectors, thermals, etc. The idea is to drive the development of interchangeable and interoperable optical modules that can be mounted onto motherboards...
ECOC 2018: Acacia presents 600 Gbps per Wavelength Coherent Transmission
At the upcoming the European Conference on Optical Communications (ECOC) in Rome, Acacia Communications will demonstrate its AC1200 coherent module with dual-core design enabling 1.2 Tbps error-free transmission over fiber with 600 Gbps per wavelength.
The Acacia AC1200 module supports transmission capacity of up to 1.2 Tbps in a footprint that is 40 percent less than the size of the 5” x 7” modules that support transmission speeds of 400 Gbps today.
The module is based on Acacia’s Pico DSP ASIC, which utilizes two wavelengths that can be configured to support from 100 Gbps to 600 Gbps capacity each. The Acacia AC1200 supports a suite of advanced three-dimensional (3D) shaping features that may be optimized to enable performance approaching theoretical limits on a wide range of network configurations.
Acacia shipped its first AC1200 module customer samples in March 2018 and anticipates production to begin by the end of 2018.
Acacia said its high-capacity solution targets the requirements for connections between large data centers with reaches of 100km and above using standard single-mode fiber.
At ECOC, Acacia will also be leading various discussions on topics such as Digital Signal Processing (DSP), subsea communications and lab automation.
9:00 a.m. -12:30 p.m. – Christian Rasmussen, founder and vice president of digital signal processing and optics, will share his thoughts on the “Future scaling and capabilities of DSP algorithms” in the Coherent DSP in Optical Communications Workshop.
9:00 a.m. -12:30 p.m. – Timo Pfau, principal DSP engineer, will present on “What can DSP bring to optical access” in the DSP for Next Generation Optical Access Workshop.
9:00 a.m. -12:30 p.m. – Hongbin Zhang, principal DSP engineer, will present on the “Future of transponders for submarine transmission” in the Submarine Systems Workshop.
Tuesday, September 25
1:30 - 3:00 p.m. – BinBin Guan, optical engineer, will lead the Lab Automation Hackathon in which there will be eight demonstrations for various common lab automation tasks.
Wednesday, September 26
1:30 p.m. - Timo Pfau will present his invited paper titled, “High performance coherent ASIC” as part of the SC3 - Digital Signal Handling Techniques for Optical Communication Systems session.
The Acacia AC1200 module supports transmission capacity of up to 1.2 Tbps in a footprint that is 40 percent less than the size of the 5” x 7” modules that support transmission speeds of 400 Gbps today.The module is based on Acacia’s Pico DSP ASIC, which utilizes two wavelengths that can be configured to support from 100 Gbps to 600 Gbps capacity each. The Acacia AC1200 supports a suite of advanced three-dimensional (3D) shaping features that may be optimized to enable performance approaching theoretical limits on a wide range of network configurations.
Acacia shipped its first AC1200 module customer samples in March 2018 and anticipates production to begin by the end of 2018.
Acacia said its high-capacity solution targets the requirements for connections between large data centers with reaches of 100km and above using standard single-mode fiber.
At ECOC, Acacia will also be leading various discussions on topics such as Digital Signal Processing (DSP), subsea communications and lab automation.
9:00 a.m. -12:30 p.m. – Christian Rasmussen, founder and vice president of digital signal processing and optics, will share his thoughts on the “Future scaling and capabilities of DSP algorithms” in the Coherent DSP in Optical Communications Workshop.
9:00 a.m. -12:30 p.m. – Timo Pfau, principal DSP engineer, will present on “What can DSP bring to optical access” in the DSP for Next Generation Optical Access Workshop.
9:00 a.m. -12:30 p.m. – Hongbin Zhang, principal DSP engineer, will present on the “Future of transponders for submarine transmission” in the Submarine Systems Workshop.
Tuesday, September 25
1:30 - 3:00 p.m. – BinBin Guan, optical engineer, will lead the Lab Automation Hackathon in which there will be eight demonstrations for various common lab automation tasks.
Wednesday, September 26
1:30 p.m. - Timo Pfau will present his invited paper titled, “High performance coherent ASIC” as part of the SC3 - Digital Signal Handling Techniques for Optical Communication Systems session.
ECOC 2018: Foxconn Interconnect Technology shows 400 Gbps interconnects
Foxconn Interconnect Technology (FIT) will showcase its latest 400 Gbps interconnect solutions in featured product and technology demonstrations at ECOC 2018.
Specifically, live traffic demonstrations will incorporate a selection of FIT's 400G QSFP-DD interconnect solutions that include various configurations of optics, cables, cages and connectors that combine to deliver 400 Gbps solutions.
"FIT is committed to the development of 400G PAM4 based products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, and direct attach copper (DAC) on the market. The product and technology showcases that will take place at this year's ECOC demonstrate both our commitment to the QSFP-DD and OSFP MSA's, and our position as a market and technology leader," said Steve Shultis, Senior Director of Product Marketing at Foxconn Interconnect Technology.
In addition to contributing to the QSFP-DD and OSFP Multisource Agreements (MSAs), FIT is one of the founding promoters of both the 100G Lambda MSA supporting single-mode fiber optic links and the new 400G BiDi MSA supporting links over widely available and deployed parallel multimode links.
Specifically, live traffic demonstrations will incorporate a selection of FIT's 400G QSFP-DD interconnect solutions that include various configurations of optics, cables, cages and connectors that combine to deliver 400 Gbps solutions.
"FIT is committed to the development of 400G PAM4 based products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, and direct attach copper (DAC) on the market. The product and technology showcases that will take place at this year's ECOC demonstrate both our commitment to the QSFP-DD and OSFP MSA's, and our position as a market and technology leader," said Steve Shultis, Senior Director of Product Marketing at Foxconn Interconnect Technology.In addition to contributing to the QSFP-DD and OSFP Multisource Agreements (MSAs), FIT is one of the founding promoters of both the 100G Lambda MSA supporting single-mode fiber optic links and the new 400G BiDi MSA supporting links over widely available and deployed parallel multimode links.
ECOC 2018: eSilicon to show 7nm 56G PAM4 long-reach SerDes
eSilicon plans to demonstrate the silicon performance of its 7nm 56G long-reach SerDes during ECOC 2018 (Anritsu booth #408).
eSilicon will show a periodic pattern generator (PPG)-to-chip live demo with different backplane reaches. Specifically, the demonstration will show 56G PAM4 data transfer running at 56Gb/s over two different BERTSCOPE channels with two different reaches, both driven by the Anritsu MP1900A Signal Quality Analyzer-R using a passive and an active PAM4 combiner. The demo with Anritsu is significant because it will show how it is possible to leverage TX finite impulse response (FIR) capabilities to increase performance and improve power figure of merit (FOM) and functionality. A key feature is high insertion loss tolerance with low bit-error rates to support increased bandwidth in legacy equipment.
“To obtain such reach and effectively stress the PAM4 SerDes receiver, it is very important to be able to generate an original extremely high-quality signal, and include equalization and stress tools for full control of the TX side. During the bring-up period, a flexible solution like Anritsu’s MP1900A is the best choice for an interoperability test,” said Anritsu EMEA Wireline Marketing Director Alessandro Messina.
eSilicon will show a periodic pattern generator (PPG)-to-chip live demo with different backplane reaches. Specifically, the demonstration will show 56G PAM4 data transfer running at 56Gb/s over two different BERTSCOPE channels with two different reaches, both driven by the Anritsu MP1900A Signal Quality Analyzer-R using a passive and an active PAM4 combiner. The demo with Anritsu is significant because it will show how it is possible to leverage TX finite impulse response (FIR) capabilities to increase performance and improve power figure of merit (FOM) and functionality. A key feature is high insertion loss tolerance with low bit-error rates to support increased bandwidth in legacy equipment.“To obtain such reach and effectively stress the PAM4 SerDes receiver, it is very important to be able to generate an original extremely high-quality signal, and include equalization and stress tools for full control of the TX side. During the bring-up period, a flexible solution like Anritsu’s MP1900A is the best choice for an interoperability test,” said Anritsu EMEA Wireline Marketing Director Alessandro Messina.
ECOC 2018: Semtech exhibits CDR platform for 25G SFP28 SR modules and AOCs
At ECOC 2018, Semtech will highlight multiple products including its ClearEdge CDR platform for low-cost 25G SFP28 SR modules and Active Optical Cables.
Semtech will also feature its laser drivers, limiting amplifiers, ROSAs, signal conditioners, transceivers, and transimpedance amplifiers (TIAs).
Semtech supplies high-speed optical transceiver ICs and offers optical networking solutions that support multiple next-generation PAM4 and NRZ connectivity standards including Ethernet, PON, Optical Transport Network (OTN), Fibre Channel, and InfiniBand.
Semtech will also feature its laser drivers, limiting amplifiers, ROSAs, signal conditioners, transceivers, and transimpedance amplifiers (TIAs).Semtech supplies high-speed optical transceiver ICs and offers optical networking solutions that support multiple next-generation PAM4 and NRZ connectivity standards including Ethernet, PON, Optical Transport Network (OTN), Fibre Channel, and InfiniBand.
ECOC 2018: Go!Foton shows its latest fiber management hub
At ECOC 2018, Go!Foton will showcase the newest member of its line of "PEACOC" high-density fiber management solutions.
The new PEACOC Fiber Distribution Hub (FDH) is designed to be utilized beyond central offices and data centers.
“The PEACOC FDH reinvents the concept of OSP cable management, by providing open, front-side access to all of the operating assets including cabling, splices and optical components,” said Michael Zammit, VP and GM of Connectivity Solutions at Go!Foton.
It features Go!Foton's patented spreadable adapter technology, which improves technician access to small form factor connectors while providing superior fiber management and routing. By enabling this functional modularity, flexible cable management, and multiple mounting options, the Go!Foton FDH can be customized to meet the needs of any customer and deployment situation.
The high-density PEACOC FDH is available in both a hermetically sealed dome enclosure for underground use or a more traditional pole and wall mounted metallic enclosure. Providing options for either factory pre-stub cables or field fusion splicing of both the feeder and distribution cables, the PEACOC FDH leverages Go!Foton’s existing legacy in the manufacture of passive optical components. The solution can also be equipped with a wide assortment of PLC optical splitters without sacrificing easy access to both front and rear subscriber connections.
http://www.gofoton.com
The new PEACOC Fiber Distribution Hub (FDH) is designed to be utilized beyond central offices and data centers.
“The PEACOC FDH reinvents the concept of OSP cable management, by providing open, front-side access to all of the operating assets including cabling, splices and optical components,” said Michael Zammit, VP and GM of Connectivity Solutions at Go!Foton.
It features Go!Foton's patented spreadable adapter technology, which improves technician access to small form factor connectors while providing superior fiber management and routing. By enabling this functional modularity, flexible cable management, and multiple mounting options, the Go!Foton FDH can be customized to meet the needs of any customer and deployment situation.
The high-density PEACOC FDH is available in both a hermetically sealed dome enclosure for underground use or a more traditional pole and wall mounted metallic enclosure. Providing options for either factory pre-stub cables or field fusion splicing of both the feeder and distribution cables, the PEACOC FDH leverages Go!Foton’s existing legacy in the manufacture of passive optical components. The solution can also be equipped with a wide assortment of PLC optical splitters without sacrificing easy access to both front and rear subscriber connections.
http://www.gofoton.com
ECOC 2018: InnoLight demos 400G QSFP-DD DR4
InnoLight Technology, which is based in Suzhou, China, will demonstrate a 400G QSFP-DD DR4 interoperating with 100G single lambda DR1 at ECOC 2018.
In addition, InnoLight will introduce its family of 400G optical transceivers, including 400G OSFP, 400G QSFP-DD and 100G QSFP28 single lambda optical products.
Innolight's current and upcoming products include: OSFP SR8, QSFP-DD SR8, QSFP28 DR1, OSFP 2XFR4, QSFP-DD DR4/DR4+, QSFP28 FR1, OSFP DR4/DR4+, QSFP-DD FR4, SFP-DD AOC, OSFP FR4, QSFP-DD LR4, OSFP LR4.
"New applications such as digital reality, artificial intelligence, machine learning, and 5G wireless are driving the network traffic to an unprecedented level. Cloud operators need continuing innovation in optical solutions to support bandwidth demand. InnoLight's comprehensive family of 400G solutions will enable cloud operators to rapidly upgrade its networks from 100G to 400G. InnoLight, with its advanced R&D capability, strong technology partnerships, state-of the-art manufacturing capability will continue to provide better solutions for the industry," said Osa Mok, Chief Marketing Officer of InnoLight Technology.
In addition, InnoLight will introduce its family of 400G optical transceivers, including 400G OSFP, 400G QSFP-DD and 100G QSFP28 single lambda optical products.
Innolight's current and upcoming products include: OSFP SR8, QSFP-DD SR8, QSFP28 DR1, OSFP 2XFR4, QSFP-DD DR4/DR4+, QSFP28 FR1, OSFP DR4/DR4+, QSFP-DD FR4, SFP-DD AOC, OSFP FR4, QSFP-DD LR4, OSFP LR4."New applications such as digital reality, artificial intelligence, machine learning, and 5G wireless are driving the network traffic to an unprecedented level. Cloud operators need continuing innovation in optical solutions to support bandwidth demand. InnoLight's comprehensive family of 400G solutions will enable cloud operators to rapidly upgrade its networks from 100G to 400G. InnoLight, with its advanced R&D capability, strong technology partnerships, state-of the-art manufacturing capability will continue to provide better solutions for the industry," said Osa Mok, Chief Marketing Officer of InnoLight Technology.
ECOC 2018: II-VI to show twin flexband 1xN WSS, OTDR
II-VI, a vertically integrated manufacturing company based in Saxonburg, Pennsylvania and offering optoelectronic products, plans to showcase its products for ROADM line cards and highly compact optical amplifier solutions tailored to enable high bit rate DWDM transceivers.
These will include:
These will include:- The twin flexband 1xN WSS powered by the Gen-2 LightFlow(TM) switch engine with 12.5 GHz bandwidth granularity for next-generation coherent long haul and metro networks.
- The dual port pluggable Optical Time Domain Reflectometer (OTDR) for embedded network monitoring applications in carrier and data center networks.
- The 3-pin micro-pump and 8-pin mini-DIL pump lasers now available at 400 mW and 500 mW respectively, to enable next-generation coherent transceivers.
- II-VI's product showcase includes one of the industry's broadest and most vertically integrated portfolios of products for ROADM line cards and highly compact optical amplifier solutions tailored to enable high bit rate DWDM transceivers.
