
Intel highlighted two new advanced packaging and test technologies for its foundry customers.
Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package.
Intel said this technology embeds a small silicon bridge chip in the package, enabling very high density die-to-die connections only where needed. Standard...