
Marvell demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on TSMC's 3-nanometer (3nm) process. This includes Marvell's 112G XSR SerDes (serializer/de-serializer), Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes, and a 240 Tbps parallel die-to-die interconnect.SerDes and parallel interconnects serve as high-speed pathways for exchanging data between chips or silicon components inside chiplets. Together with 2.5D and 3D packaging,...