
Intel unveiled RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, a new backside power delivery method. In a webcast presentation highlighting its process and packaging technology roadmaps through 2025, Intel vowed a swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. The company said it is on-track to received the first High NA EUV...