Nokia looks to Marvell for 5G silicon development

Nokia is working with Marvell to develop 5G multi-RAT (Radio Access Technology) silicon, including multiple generations of custom silicon and infrastructure processors. The new generation of custom system-on-chip (SoC) and infrastructure processors will expand the range of Nokia ReefShark chipsets. Marvell brings its multi-core Arm processor platforms. Nokia said these new chipsets are designed to be deployed in several building blocks of its AirScale...

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Telenor and Telia build Multi-Operator Core Network with Nokia

Telenor and Telia are building a shared wireless network supporting a Multi-Operator Core Network (MOCN) feature in Denmark. Nokia is the solution provider. A trial network with the 5G MOCN feature has been deployed and verified with successful end-to-end test calls. The MOCN architecture model enables network sharing with each mobile operator having their own core network and sharing common radio access network infrastructure as well as spectrum...

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Nokia expands fiber access portfolio with Lightspan MF-2 node

Nokia is expanding its fiber access portfolio with a new Lightspan MF access node designed for the 5G era, a new Beacon 6 in-home gateway that supports 5G mobile data offloading and several Nokia Bell Labs innovations that reduce latency. Nokia’s new Lightspan MF-2 fiber access node is based on its Quillion chipset family. Some details: High capacity, small form factor access node fit for distributed deployments 10G PON today, and ready for evolution...

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Marvell partners with Samsung on RAN processing

Marvell and Samsung Electronics Co. are extending their collaboration to include additional segments of the Radio Access Network (RAN). The solutions will build on the OCTEON Fusion platform and integrating Samsung’s unique intellectual property. To date, the companies have worked closely to deliver multiple generations of baseband and transport processing solutions for base stations based on Marvell’s OCTEON and OCTEON Fusion processors. In addition,...

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Innovium delivers SONiC/SAI for TERALYNX based Switch Systems

Innovium announced the first delivery of production-grade SONiC/SAI running on its TERALYNX switch silicon family. “Our continued innovation, with over 75 patents, has enabled us to deliver a comprehensive data center switch family from 1 – 12.8Tbps performance. We now have over 20 switch system designs with the world’s leading ODM & OEM system partners, based on TERALYNX switch portfolio,” said Rajiv Khemani, CEO and Co-Founder of Innovium...

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Ericsson begins production at its U.S. 5G factory

Ericsson manufactured its first 5G base station at its factory in Lewisville, Texas. The first unit is the millimeter-wave Street Macro solution, which is key to Ericsson’s 5G portfolio for its North American customers. All radio access components are housed in one lightweight enclosure, allowing service providers to rapidly grow 5G coverage in complex city environments. Erik Simonsson, Head of the USA 5G Smart Factory, Ericsson, says: “We’re excited...

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SiTime offers 48-hour worldwide availability of MEMS oscillators

SiTime is now offering 48-hour availability of its MEMS oscillators. Previously, customers had to wait up to 20 weeks and sometimes pay non-recurring engineering (NRE) fees to get oscillators that were configured to their exact requirements. SiTime’s rapid programming service accelerates the phases of typical product development to help technology innovators take an industrial and IoT product idea to design and production quickly and easily. SiTime...

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SES and Telesat support FCC’s C-band Order

SES and Telesat, as founding members of the C-Band Alliance, applauded the FCC's final C-band Report and Order. "We congratulate the Commission on striking the right balance to ensure accelerated access to the spectrum with appropriate incentives, providing an effective transition framework, and adequately protecting critical satellite services for customers and earth station operators." FCC approves C-Band spectrum rules Sunday, March 01,...

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Infinera announces $200M convertible senior notes offering

Infinera announced the pricing of $200 million aggregate principal amount of convertible senior notes due 2027 in a private placement to qualified institutional buyers. Infinera also granted the initial purchaser of the Notes a 13-day option to purchase up to an additional $30 million in aggregate principal amount of Notes. The company said the proceeds would be used for general corporate purposes, including working capital to fund growth and potential...

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Red Hat Summit 2020 to move to a virtual experience

Red Hat Summit, which was scheduled for April 27-29 in San Francisco, will move to a virtual tradeshow format. The physical event was canceled due to concerns about coronavirus (COVID-19). The Red Hat Summit Virtual Experience will be a free, immersive multi-day event from April 28-29, 2020, including keynotes, breakout sessions, access to Red Hat experts, etc. ...

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