As part of the Chips for America program to drive U.S. leadership in semiconductors, $3 billion will be allocated to a new National Advanced Packaging Manufacturing Program. The funding targets advanced packaging technology in the United States that can be deployed to manufacturing facilities, including recipients of CHIPS manufacturing incentives.
An initial funding opportunity for this program is expected to be announced in early 2024.
This initiative is outlined in the “Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), published by CHIPS for America.
- materials and substrates,
- equipment, tools and processes,
- power delivery and thermal management,
- photonics and connectors,
- a chiplet ecosystem, and
- co-design for test, repair, security, interoperability and reliability.
“Within a decade, we envision that America will both manufacture and package the world’s most sophisticated chips,” said NIST Director Laurie E. Locascio. “This means both onshoring a high-volume advanced packaging industry that is self-sustaining, profitable and environmentally sound, and conducting the research to accelerate new packaging approaches to market.”
The four R&D programs under the CHIPS for America initiative are:
- National Semiconductor Technology Center: This public-private consortium is aimed at being the central point for semiconductor research across the nation.
- National Advanced Packaging Manufacturing Program: Focused on developing the capability to package chips in multiple dimensions with various functions, known as advanced packaging, to maintain leadership in semiconductor manufacturing.
- Manufacturing USA Institute(s): Funded by CHIPS for America, these institutes will advance research and commercialization of semiconductor manufacturing technologies, with a focus on virtualization, simulation, automation, and workforce training.
- CHIPS R&D Metrology: Managed by NIST, this program involves the measurement science critical for developing new materials, packaging, and production methods for semiconductors. It includes working on reference materials, data, and calibrations for chip manufacturing equipment and advising on standards development for processes and cybersecurity
https://www.nist.gov/system/files/documents/2023/11/19/NAPMP-Vision-Paper-20231120.pdf
European Chips Act promises billions for semiconductor fabs
The European Parliament and the Council reached agreement to proceed with a European Chips Act aimed at strengthening European competitiveness and resilience in this strategic sector.
The European Union aims to to double its current global market share of semiconductor manufacturing to 20% in 2030.
There are three pillars to the European Chips Act.
- A Chips for Europe Initiative will combine investments from the Union, Member States and the private sector. The Initiative will be supported by €6.2 billion of public funds, of which €3.3 billion from the EU budget agreed today for the period until 2027, the end of the current multi-annual financial framework. This support will come in addition to €2.6 billion public funding already foreseen for semiconductor technologies. The €6.2 billion will support activities, such as the development of a design platform and setting up of pilot lines to accelerate innovation and production. The Initiative will also help the establishment of competence centres, located across Europe, which will provide access to technical expertise and experimentation, helping companies, SMEs in particular, to improve design capabilities and developing skills.
- Spur an estimated €43 billion in public and private investments in manufacturing facilities for chipmakers and their suppliers. European Chips Act createsframework for Integrated Production Facilities and Open EU Foundries that are “first-of-a-kind” in the Union and contribute to the security of supply and to a resilient ecosystem in the Union interest.
- Establish a coordination mechanism between the Member States and the Commission for strengthening collaboration with and across Member States, monitoring the supply of semiconductors, estimating demand, anticipating shortages, and, if necessary, triggering the activation of a crisis stage. To address such situations, the European Chips Act establishes a dedicated toolbox of measures that can be undertaken.
