Broadcom debuts 200G/lane PAM-4 DSP PHY

Broadcom announced shipping of its 5nm 200G/lane optical PAM-4 DSP PHY featuring 200G/lane serial optical interfaces, which enable 800G and 1.6T pluggable optical transceiver modules.The new Sian BCM85822 is optimized for the 1.6T OSFP-XD transceiver module design and would effectively enable 51.2T switching capacity in a 1RU rack to improve bandwidth density in hyperscale data centers. Further, the adoption of 200G/lane optical interfaces lays the...

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#ECOC23: DustPhotonics unveils 800G Silicon Photonics chip

DustPhotonics introduced a single-chip 800G PIC (Photonic Integrated Circuit) for DR8 and DR8+ applications, providing 8 optical channels independently modulated at 100Gb/s for an aggregate bandwidth of 800Gb/s. The chip is designed into a compact 7.5mm x 7mm package, enabling it to be used in industry standard QSFP and OSFP style form factors.  The PIC includes on-chip lasers, incorporating DustPhotonics' patented L3C (low-loss laser coupling)...

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#ECOC23: Avicena demos microLED transceiver in 16nm finFET CMOS

At this week's ECOC in Glasgow, Avicena is demonstrating its LightBundle multi-Tbps chip-to-chip interconnect technology.Currently, high-bandwidth memory (HBM) modules must be co-packaged with GPUs because the GPU-memory electrical interconnect is limited to just a few millimeters in length. Conventional optical interconnects based on VCSELs or Silicon Photonics (SiPh) promise to extend the interconnect reach. However, they are challenged by the...

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#ECOC23: Lumentum intros InP-Based 130+ GBaud Smart TROSA, 800G ZR

At this week's ECOC in Glasgow, Lumentum is showcasing its latest solutions, including:800G ZR+ and 0dBm 400G ZR+ Transceivers: Lumentum 800G ZR+ and 0dBm 400G ZR+ compact transceivers, which are crucial components for connecting data centers, enable IP over DWDM by directly plugging into switches and routers. These transceivers, available in QSFP-DD and OSFP form factors and utilizing Lumentum's new 130+ GBaud Smart TROSA, offer high output power...

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#ECOC23: Semtech and Broadcom demo 200G/lane optical transceiver

Semtech is showcasing a 200G/lane optical transceiver featuring its latest FiberEdge 200G PAM4 PMDs and Broadcom’s latest generation 5nm 112GBd PAM4 DSP, EML and PD devices. These next generation of optical modules capable of bandwidths up to 1.6TB will drive the adoption of 51.2TB next generation switching platforms.“The demonstration of a 200G/lane ready-to-adopt optical module validates the 200G/lane technology, of which Semtech has been an early...

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#ECOC23: Semtech demos 100G/Lane Linear Pluggable

Semtech is demonstrating 100G/lane linear pluggable optical links featuring its latest FiberEdge 100G PAM4 PMDs.The demo includes:800G SR8 LPO (Linear Pluggable Optics) module, featuring Semtech’s FiberEdge GN1848 quad VCSEL driver and GN1816 quad TIA, interoperating with latest switch ASIC technology, in Semtech’s booth #517800G SR8 LPO (Linear Pluggable Optics) module, featuring Semtech’s FiberEdge GN1848 quad VCSEL driver and GN1816 quad TIA,...

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#ECOC23: Semtech and Coherent demo 200G per Lane driver with 200G laser

Semtech is showcasing its latest FiberEdge 200G PAM4 MZM driver driving a 200G DFB-MZ laser from Coherent Corp.The joint demonstration at ECOC 2023 will include a differentially driven DFB-MZ InP laser from Coherent and Semtech’s PAM4 driver, demonstrating a clear path toward 1.6T and 3.2T optical transceiver deployments in data centers.“We are very excited to continue our collaboration with Coherent as advanced lasers and optics get developed in...

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U.S. Dept of Commerce opens funding for smaller CHIPS projects

The U.S. Department of Commerce’s CHIPS Program Office (CPO) issued its second Notice of Funding Opportunity (NOFOs) targeted toward the semiconductor supply chain. This NOFO will support smaller projects, which CPO defines as being under $300 million in total capital costs. Eligible applicants include those intending to use CHIPS funding to support the construction, expansion, or modernization of semiconductor materials and manufacturing equipment...

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Vapor IO Launches Its “Monetize the AI Edge” Program

Vapor IO is kicking off a new"Monetize the AI Edge"initiative to help partners accelerate the availability of real-time AI by delivering bundled AI services via Vapor IO’s shared and neutral host infrastructure.Tolaga Research has recently completed a report on the addressable market for edge AI across the 36 U.S. markets in which Vapor IO operates. Tolaga estimates that by 2028, the combined value of edge AI in those 36 markets will be approximately...

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