Renesas demos Arm Cortex-M85 processor prototype

Renesas Electronics will demonstrated a microcontroller (MCU) based on the recently announced Arm Cortex-M85 processor at the Embedded World 2022 Exhibition and Conference in Nuremburg Germany from June 21-24.

Renesas introduced the RA (Renesas Advanced) Family of Arm Cortex-M based MCUs in October of 2019, entering the general-purpose Arm-Cortex-M market with a robust and feature rich family of flash-based MCUs. In roughly 30 months, Renesas has introduced 17 MCU groups encompassing well over 200 individual parts. In addition, Renesas has developed a robust ecosystem of partners providing customers with comprehensive solutions for IoT, AI/ML, industrial automation, medical, building automation, home appliance and multiple other applications.

The Arm Cortex-M85 processor features Helium technology, Arm’s M-Profile Vector Extension that enables advanced DSP/ML capabilities and helps accelerate compute intensive applications such as endpoint AI. Delivering over 6 CoreMark/MHz, Cortex-M85 enables demanding IoT use cases that require the highest compute performance and DSP or ML capability, realized on a single, simple-to-program, Cortex-M processor.

"As a lead partner with Arm, we are proud to be the first to demonstrate an MCU based on the high-performance Cortex-M85 processor, a clear example of the momentum that we have built in the Arm ecosystem,” said Roger Wendelken, Senior Vice President in Renesas’ IoT and Infrastructure Business Unit. “The RA family has enjoyed tremendous success in a very short time, demonstrating the core strengths that make Renesas an MCU powerhouse, including design expertise, legendary quality, and close collaboration with customers and partners in all markets and all geographies.”

“To continue to scale and grow, the next generation of IoT solutions demand ever-improving levels of performance, security and simplified development, and we have delivered this with the new Arm Cortex-M85,” said Dipti Vachani, senior vice president and general manager, Automotive and IoT Line of Business at Arm. “This demonstration of the first silicon based on our most secure and highest performance Cortex-M processor will showcase the new and exciting applications it will enable and further cements our ongoing close collaboration with Renesas.”

www.renesas.com/ra

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Renesas intros PCIe Gen6 clock buffers and multiplexers

Renesas Electronics introduced the first clock buffers and multiplexers that meet stringent PCIe Gen6 specifications. 

Renesasis offering 11 new clock buffers and 4 new multiplexers. The new devices, which also support and provide extra margin for PCIe Gen5 implementations, complement Renesas’ low-jitter 9SQ440, 9FGV1002 and 9FGV1006 clock generators to offer customers a complete PCIe Gen6 timing solution for data center/cloud computing, networking and high-speed industrial applications.

The PCIe Gen6 standard supports extremely high data rates of 64 GT/s while requiring very low clock jitter performance of less than 100fs RMS. Renesas’ new RC190xx clock buffers and RC192xx multiplexers have PCIe Gen6 additive jitter specs of only 4fs RMS, making them virtually noiseless, and thereby future-proofing customer designs for the next generation of industry standards.

“PCIe Gen6 timing will be at the heart of new equipment in data centers, high-speed networking and other applications,” said Zaher Baidas, Vice President of the Timing Products Division at Renesas. “As we have done for preceding generations, Renesas is providing customers with the first timing solution to enable these new, higher-performance systems. Our customers know that we have the technical expertise and market knowledge to ensure that their products will be able to meet future requirements as well.”

https://www.renesas.com/us/en/products/clocks-timing

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Renesas completes acquisition of Celeno

Renesas Electronics completed its previously announced acquisition of Celeno Communications for approximately US$315 million (approximately 35.9 billion yen at an exchange rate of 114 yen to the dollar) with payment to be made gradually in cash following certain milestones as set forth in the definitive agreement.

http://www.renesas.com

Renesas acquires Celeno for Wi-Fi 6 & 6E silicon 

Wednesday, October 27, 2021  Israel, Japan, Renesas, Silicon  

Renesas Electronics agreed to acquire Celeno Communications, a start-up providing Wi-Fi solutions, for approximately US$315 million (approximately 35.9 billion yen at an exchange rate of 114 yen to the dollar) in cash. 

Celeno, which is headquartered in Israel, offers advanced Wi-Fi chipsets and software solutions, for high-performance home networks, smart buildings, enterprise and industrial markets. Its compact chipset offerings for Wi-Fi 6 and 6E deliver exceptional Wi-Fi network performance and increased security with low latency and low power consumption. Celeno’s breakthrough Wi-Fi Doppler Imaging technology, a Wi-Fi based, high-resolution imaging technology, is ideal for home elderly care and assisted living, home security, safe driving and digital and connected factories. It depicts, tracks and analyzes the motion, behavior and location of people and objects using standard Wi-Fi, eliminating the need for multiple cameras or sensors in home environments and commercial buildings.

As the world’s No.1 embedded processor supplier, Renesas offers a breadth of low-power MCU/MPU/SoC processors, wireless ICs, sensors and power management technologies. Celeno’s field-proven Wi-Fi and software capabilities are highly complementary to Renesas. The combination creates comprehensive, end-to-end embedded solutions for addressing the fast-growing markets for low-power connectivity in IoT, infrastructure, industrial and automotive applications.

“The transaction announced today underscores our continuous commitment to improve performance and efficiency in electronic systems,” said Hidetoshi Shibata, President and CEO of Renesas. “Building on our recently-expanded connectivity portfolio following the Dialog acquisition, the addition of Celeno provides us with more advanced Wi-Fi connectivity capabilities to deliver end-to-end connectivity solutions for both clients and access points. Renesas is now strongly positioned to capitalize on the growing opportunities from the massive rise in connectivity and requirements created by today’s increasingly connected world.”

 

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Renesas acquires Celeno for Wi-Fi 6 & 6E silicon

Renesas Electronics agreed to acquire Celeno Communications, a start-up providing Wi-Fi solutions, for approximately US$315 million (approximately 35.9 billion yen at an exchange rate of 114 yen to the dollar) in cash. 

Celeno, which is headquartered in Israel, offers advanced Wi-Fi chipsets and software solutions, for high-performance home networks, smart buildings, enterprise and industrial markets. Its compact chipset offerings for Wi-Fi 6 and 6E deliver exceptional Wi-Fi network performance and increased security with low latency and low power consumption. Celeno’s breakthrough Wi-Fi Doppler Imaging technology, a Wi-Fi based, high-resolution imaging technology, is ideal for home elderly care and assisted living, home security, safe driving and digital and connected factories. It depicts, tracks and analyzes the motion, behavior and location of people and objects using standard Wi-Fi, eliminating the need for multiple cameras or sensors in home environments and commercial buildings.

As the world’s No.1 embedded processor supplier, Renesas offers a breadth of low-power MCU/MPU/SoC processors, wireless ICs, sensors and power management technologies. Celeno’s field-proven Wi-Fi and software capabilities are highly complementary to Renesas. The combination creates comprehensive, end-to-end embedded solutions for addressing the fast-growing markets for low-power connectivity in IoT, infrastructure, industrial and automotive applications.

“The transaction announced today underscores our continuous commitment to improve performance and efficiency in electronic systems,” said Hidetoshi Shibata, President and CEO of Renesas. “Building on our recently-expanded connectivity portfolio following the Dialog acquisition, the addition of Celeno provides us with more advanced Wi-Fi connectivity capabilities to deliver end-to-end connectivity solutions for both clients and access points. Renesas is now strongly positioned to capitalize on the growing opportunities from the massive rise in connectivity and requirements created by today’s increasingly connected world.”

“This is a compelling transaction for both our customers and employees. Our depth and strength in connectivity combined with Renesas’ industry leading portfolio of embedded solutions will allow us, together, to open up new growth areas we can target,” said Gilad Rozen, President and CEO of Celeno. “Renesas will also provide us with the go-to-market capabilities to bring Celeno to a broader range of customers.”

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Renesas completes acquisition of Dialog Semi

Renesas Electronics completed its previously announced acquisition of Dialog Semiconductor Plc.  Renesas will fund the cash consideration payable to Dialog shareholders of approximately EUR 4.8 billion (approximately 624.0 billion yen at an exchange rate of 130 yen to the Euro) through a combination of debt, cash on hand and the proceeds of an equity offering of approximately 222.6 billion yen 

Dialog, which is based in Reading, UK, is provider of highly-integrated and power-efficient mixed-signal ICs used in IoT, consumer electronics and high-growth segments of automotive and industrial end-markets. Dialog brings a wide range of product offerings including battery and power management, power conversion, configurable mixed-signal (CMIC), LED drivers, custom mixed-signal ICs (ASICs), and automotive power management ICs (PMICs), wireless charging technology, and more. Dialog also offers broad and differentiated BLE, WiFi and audio system-on-chips (SoCs) that deliver advanced connectivity for a wide range of applications; from smart home/building automation, wearables, to connected medical. All these systems complement and expand Renesas’ leadership portfolio in delivering comprehensive solutions to improve performance and efficiency in high-computing electronic systems. Dialog was founded in 1981 and has 2,300 employees.

“Today represents an important milestone for Renesas. This transaction builds on our long-term strategy to offer a complete set of solutions with more leading-edge analog and mixed signal products that deliver value and innovation to the customers,” said Hidetoshi Shibata, President & CEO of Renesas. 

https://www.renesas.com/br/en/document/ppt/renesas-and-dialog-zoom-webinar-presentation-material

Renesas to acquire Integrated Device Technology for $6.7 billion

Tuesday, September 11, 2018  IDT, Japan, Mergers And Acquisitions, Renesa, Silicon Valley  

Renesas Electronics Corporation of Japan has agreed to acquire Integrated Device Technology (IDT, NASDAQ: IDTI) for approximately US$6.7 billion (approximately 733.0 billion yen at an exchange rate of 110 yen to the dollar), combing two recognized leaders in embedded processors and analog mixed-signal semiconductors. IDT shares are to be acquired at a price of US$49.00 per share. IDT, which is based in San Jose, California, is a leading supplier...

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Renesas to Acquire Intersil for $3.2 Billion

Monday, September 12, 2016  Mergers And Acquisitions, Silicon  

Renesas Electronics Corporation agreed to acquire Intersil for US$22.50 per share in cash, representing an aggregate equity value of approximately US$3.2 billion (approximately 321.9 billion yen at an exchange rate of 100 yen to the dollar). Renesas supplies microcontroller (MCU) and system-on-chip (SoC) products and technologies.  Intersil specializes in power management and precision analog capabilities. The acquisition is also expected...

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Fire at Renesas' Naka semiconductor fab halts production of 300mm wafers

Renesas Electronics Corporation was struck by a fire in the N3 Building (300mm line) of its Naka Factory (located in Hitachinaka, Ibaraki Prefecture) on March 19, 2021 at 2:47am.

The fire was extinguished on the same day and there no casualties to the employees and no damages to the building. However, Renesas said there was some damage to some of the utility equipment, including its pure water supply, the air conditioning system, as well as to some of the manufacturing equipment. The burned area is approximately 600m2, which is around 5% of the 12,000m2 clean room area of the first floor N3 Building, and the burned manufacturing equipment was 11 units, which is around 2% of the manufacturing equipment of the N3 Building. 

Production at N3 Building (300mm wafers) has temporarily halted while the company cleans the interior of the clean room and procures replacements of the burned equipment.

Renesas aims to resume production within one month. The financial impact from halting the N3 Building production is approximately 17 billion yen per month. 

In a press conference, company officials extended their apologies for the occurrence of the fire, the circumstances and the causes, as well as the outlook going forward. 

"We would like to give our sincerest apologies to neighboring residents, customers, partner companies, relevant authorities and all those involved for the trouble the fire caused,” said Hidetoshi Shibata, President & CEO of Renesas. “In addition, we would like to express our gratitude for the fire department and those who partook in the extinguishing of the fire.”

The production at N2 Building (200mm line) and the WT Building (wafer testing) is operating as usual. 

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Renesas to acquire Dialog for EUR 4.9B for mixed-signal ICs

Renesas Electronics agreed to acquire Dialog Semiconductor Plc for EUR 4.9 billion (approximately 615.7 billion yen). 

Dialog, which is based in Reading, UK, is provider of highly-integrated and power-efficient mixed-signal ICs used in IoT, consumer electronics and high-growth segments of automotive and industrial end-markets. Dialog brings a wide range of product offerings including battery and power management, power conversion, configurable mixed-signal (CMIC), LED drivers, custom mixed-signal ICs (ASICs), and automotive power management ICs (PMICs), wireless charging technology, and more. Dialog also offers broad and differentiated BLE, WiFi and audio system-on-chips (SoCs) that deliver advanced connectivity for a wide range of applications; from smart home/building automation, wearables, to connected medical. All these systems complement and expand Renesas’ leadership portfolio in delivering comprehensive solutions to improve performance and efficiency in high-computing electronic systems. Dialog was founded in 1981 and has 2,300 employees.

“The transaction we announced today represents our next important step in catapulting Renesas’ growth plan to achieve substantial strategic and financial benefits, following our previous acquisitions,” said Hidetoshi Shibata, President and CEO of Renesas. “Dialog has a strong culture of innovation along with excellent customer relationships and serves fast growing areas including IoT, industrial and automotive. By bringing Dialog’s talented team and expertise into Renesas, together, we will accelerate innovation for customers and create sustainable value for our shareholders.”

“For several years, we have successfully executed on a diversification strategy that positions Dialog for high-growth,” said Dr. Jalal Bagherli, CEO of Dialog. “We have built a strong foundation of high-performance analog and power efficient mixed-signal expertise, extended our product portfolio and applied our technologies into markets including 5G, wearables, automotive, smart home, connected medical and industrial IoT. This compelling platform – combined with Renesas’ leading embedded compute, analog and power portfolio – creates even greater growth opportunities in today’s increasingly connected world. The Dialog team is excited to join forces with Renesas. The combined company will be in an even stronger position to provide innovative products for these markets, building on Renesas’ extensive sales, distribution and customer support capabilities.”

https://www.renesas.com/br/en/document/ppt/renesas-and-dialog-zoom-webinar-presentation-material

Renesas to acquire Integrated Device Technology for $6.7 billion

Tuesday, September 11, 2018  IDT, Japan, Mergers And Acquisitions, Renesa, Silicon Valley  

Renesas Electronics Corporation of Japan has agreed to acquire Integrated Device Technology (IDT, NASDAQ: IDTI) for approximately US$6.7 billion (approximately 733.0 billion yen at an exchange rate of 110 yen to the dollar), combing two recognized leaders in embedded processors and analog mixed-signal semiconductors. IDT shares are to be acquired at a price of US$49.00 per share. IDT, which is based in San Jose, California, is a leading supplier...

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Renesas to Acquire Intersil for $3.2 Billion

Monday, September 12, 2016  Mergers And Acquisitions, Silicon  

Renesas Electronics Corporation agreed to acquire Intersil for US$22.50 per share in cash, representing an aggregate equity value of approximately US$3.2 billion (approximately 321.9 billion yen at an exchange rate of 100 yen to the dollar). Renesas supplies microcontroller (MCU) and system-on-chip (SoC) products and technologies.  Intersil specializes in power management and precision analog capabilities. The acquisition is also expected...

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Renesas showcases optical interconnects at virtual ECOC

Renesas Electronics will showcase its portfolio of optical communication products at this week's virtual European Conference on Optical Communication (ECOC) 2020:

Optical Communications for Datacom

PAM4-based solutions for datacom - featuring the industry’s first CMOS-based PAM4 CDR solution, the new HXT14450 CDR with integrated VCSEL driver and the HXR14450 CDR with integrated TIA are designed for 200G and 400G links and are also ideally suited for short range (SR) and Active Optical Cable operation for data centers. The series features significantly lower power and smaller size compared with traditional DSP solutions, as well as higher integration – including an integrated MCU – to further simplify system design. The series is certified for the -40°C to 85°C temperature range, making it ideal for optical communications links in 5G mid- and back-haul infrastructure. The standalone HXC44400 CDR is also available, and customers can combine it with Renesas DML drivers and TIAs to enable 200G long range links.

The lineup of high performance optical signal chain products also includes the HXT45411 family of EML drivers, HXT45430 Silicon-Photonics drivers, HXT44420 family of DML drivers and HXR45400 series TIAs for PAM4 deployments.

Optical Communications for Telecom

Renesas’ 64 GBaud GX76474 driver family and GX36420 series Coherent TIAs combine exceptional analog performance, low power, and high reliability with high bandwidth and configurability to support the telecom industry’s fastest growing segment – coherent optical communications. These new drivers and TIAs support all the key requirements to support the increased demands of longer range communication including:

• Up to 400 Gbps of data speeds using industry-standard 64 GBaud modulation
• Scalable solutions for 32G, 45G, and 64G, enabling customers to optimize either for speed or for power and cost, and to adjust key parameters via Serial Peripheral Interface (SPI)
• The GX76474 and GX36420 series also cover all the optical modulator technologies currently on the market, including Lithium Niobate, Indium Phosphide, and Silicon Photonics, as well as both the industry-standard Integrated Coherent Receiver (ICR) and Transmitter Receiver Optical Sub-Assembly (TROSA) configurations.

“Over the last several months, data center, network, and telecom infrastructures have navigated significant increases in the demands and requirements placed on their systems, driven by increasing volumes of high-bandwidth data such as live and on-demand streamed content, the deployment of more AI-based systems, and a worldwide shift to the cloud as more consumers depend on connected systems for their work and daily life,” said Diwakar Vishakhadatta, Vice President of Optical Communication Products at Renesas. “

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Renesas adds RF Amplifier for 4G/5G

Renesas Electronics is now sampling a new F1490 second-generation high-gain, 2-stage RF amplifier that covers the key sub-6 GHz 5G frequency bands from 1.8 GHz to 5.0 GHz. The F1490 benefits designers with simplified product selection for their transmitter (Tx) lineup, elimination of a gain block with better margin, two selectable gain modes for system design flexibility, lower power consumption, and superior performance.

The device is suited for use with both FDD and TDD sub-6 GHz 5G applications.

Key features:

• Two selectable gain modes: 39.5 dB high gain or 35.5 dB low gain
• High performance OIP3 of 38 dBm and OP1dB of 24 dBm
• RF frequency range of 1.8 GHz to 5.0 GHz
• Ultra-low quiescent current of 75 mA
• Supply voltage of 5V
• Up to +115°C TCB operating temperature
• Today’s higher data rates drive the need for better radio signal-to-noise ratio

“The F1490 delivers high gain with selectable modes and ultra-low power consumption, while maintaining high OP1dB performance and 2.4 dB noise figure, to meet all the system-level requirements customers want from their massive MIMO 5G pre-driver,” said Naveen Yanduru, Vice President of RF Communications, Industrial and Communications Business Division at Renesas. “We are excited to continue driving LTE and 5G innovation with our RF amplifier solutions for AAS, 4G/5G base stations, and other wireless communications equipment.”

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ECOC 2019: Renesas to show full 64 Gbaud receiver

At next week's European Conference on Optical Communication (ECOC) in Dublin, Ireland, Renesas Electronics will show:

• Telecom Applications: Renesas combines a 64 Gbaud linear trans-impedance amplifier (TIA) with a photo diode to provide a full 64 Gbaud receiver solution, suitable for µICR and IC-TROSA designs. Along with the Renesas linear driver family, these solutions showcase the full spectrum of products ideal for next-generation 400G/600G coherent optical transceivers.
• Datacom and 5G Applications: The Renesas 50G PAM4 DML driver is designed for low-cost, low-power data center applications targeting 200 Gbps, as well as 1-channel applications in emerging 5G base station communication systems. Renesas will demonstrate combining the driver with a DML mounted in an industry-standard TOSA to enable a low-cost, easy-to-use solution for 5G mid-haul and back-haul applications.

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Renesas develops Processing-In-Memory Technology for AI chips

Renesas Electronics has developed an AI accelerator that performs CNN (convolutional neural network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will accelerate increased intelligence of endpoint devices.
The company says its first test chip featuring this accelerator has achieved the power efficiency of 8.8 TOPS/W.

Renesas developed the following three technologies for the new AI accelerator: a ternary-valued (-1, 0, 1) SRAM structure PIM technology that can perform large-scale CNN computations; an SRAM circuit to be applied with comparators that can read out memory data at low power; and a technology that prevents calculation errors due to process variations in the manufacturing.

https://www.renesas.com/us/en/about/press-center/news/2019/news20190613.html

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Renesas ships 25 Gbps Directly Modulated Laser Diodes for base stations

Renesas Electronics announced commercial availability of directly modulated laser (DML) diodes that deliver 25 Gbps x four wavelengths as the light source in 100 Gbps optical transceivers.  The devices are designed for connecting 4.9G and 5G LTE base stations and between data center routers and servers.

Renesas said its new RV2X6376A Series are the industry’s first DML diodes that support full 25 Gbps speed (per individual laser) and industrial temperature (-40°C to 95°C) without cooling. The devices can be designed into compact 100 Gbps QSFP28 optical transceiver modules that use conventional NRZ modulation. They are compatible with the Coarse Wavelength Division Multiplexing (CWDM4) standard that specifies four lanes of 25 Gbps optically multiplexed onto and demultiplexed from duplex single mode fiber. The RV2X6376A Series extend the laser diodes family, joining the proven, commercial temperature grade (-5°C to 75°C) NX6375AA Series used in data centers. In addition to providing the ruggedness and reliability base stations require, the RV2X6376A Series also offers data center customers an upgrade to the wider industrial temperature range when additional margin is needed.

Key features:

• 1.3um AlGaInAs Direct Modulated DFB laser diode
• Uncooled operation (absolute maximum ratings): Tc=-40℃ - +95℃
• Output power: Po=7mW @ 25℃
• SMSR: 35dB min
• Laser operating current: 55mA max
• Laser reverse voltage: 2.6 V max
• High Reliability: MTTF of 100,000 hours (Note: MTTF not guaranteed)

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Broadcom to Acquire LTE Modem Business from Renesas Electronics

Broadcom agreed to acquire LTE-related assets from affiliates of Renesas Electronics Corporation for approximately $164 million in cash.

Broadcom is gaining a dual-core LTE SoC that is ready for volume production and is carrier-validated by leading global operators in North America, Japan and Europe. Broadcom also receives high-quality multimode, multiband, LTE-A/HSPA+/EDGE modem IP that includes support for leading-edge features such as Carrier Aggregation and VoLTE. The acquisition adds quality patents and applications to Broadcom's IP portfolio and brings some of the world's most experienced cellular engineers to Broadcom.

Broadcom said the deal will accelerate the launch of its first multimode, carrier-validated LTE SoC platform, which is now expected in early 2014.

"Today's transaction firmly establishes Broadcom's presence in the rapidly growing LTE market with a production-ready, carrier-validated SoC," said Scott McGregor, President and CEO of Broadcom. "Our LTE platform will leverage Broadcom's rich connectivity portfolio and will deliver an optimized feature set for this fast growing market."

Broadcom also updated its business outlook for the three months ending September 30, 2013. The company now expects revenue between $2.075 billion and $2.175 billion; GAAP and non-GAAP product gross margins to be up roughly 50 to 100 basis points; and GAAP and non-GAAP research and development, and selling, general and administrative expenses to be somewhat above the high-end of the previously guided range of down ~$5 million to up ~$15 million and flat to up ~$20 million, respectively.

http://www.broadcom.com/investors

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