Wednesday, August 25, 2021

Comcast Business accelerates software-defined services with Masergy

Comcast Business agreed to acquire Masergy, which offers managed SD-WAN, UCaaS, CCaaS, and security services for global enterprises. Financial terms were not disclosed.

Comcast Business said the acquisition accelerates its increasing growth serving large and mid-size companies, particularly U.S.-based organizations with multi-site global operations.

Masergy, which is based in Plano, Texas, has more than 1,400 customers in nearly 100 countries.

“Masergy provides a perfect complement to our portfolio of enterprise services and solutions and will allow us to instantly and dramatically amplify our growth in the global enterprise market,” said Bill Stemper, President, Comcast Business. “We’re excited to welcome Masergy’s employees and leadership to Comcast Business as we bring continued innovation and superior experience to our customers.”

“On behalf of everyone at Masergy, we are thrilled to join the Comcast Business family and are extremely excited for the next chapter of Masergy. We are confident that together we can significantly enhance our service offerings to businesses of all sizes in their journey to the cloud,” said Chris MacFarland, Chairman and CEO, Masergy.

https://www.masergy.com/

Masergy Performance Edge boosts SD-WAN + SASE

Masergy introduced a new SD-WAN and SASE capability designed to minimize packet loss over public broadband connections, making them perform more like a private Ethernet circuit.

Masergy Performance Edge is available with Masergy’s Managed SD-WAN Secure and SASE offerings and uses proprietary network architecture along with industry standard and compatible routing algorithms. The company says it is able to minimize packet loss over public broadband connections for more predictable application experiences.

https://www.masergy.com/sd-wan/performance-edge

Calix expands XGS-PON and 100G transport capabilities

Calix introduced new line cards to simplify the deployment of software-defined XGS-PON networks and 100G transport, even in temperature-hardened environments like cabinets. 

The two new AXOS E7-2 Intelligent Modular System line cards, the XG801 and the CE201, along with the latest 10G Outdoor GigaPoint ONT, the GP4200XH, enable BSPs to deliver 10 Gbps XGS-PON services, high-density aggregation, and 100G temperature hardened transport capabilities while simplifying the addition of more capacity and scale to their networks.

Both the XG801 and CE201 support the use of widely available commercial temperature (C-Temp) 100G optics to be used in outside plant cabinets (i.e., industrial temperature applications), simplifying the addition of capacity throughout the access network.

The cards enable L2 FTTH/FTTB residential and business 10-gigabit XGS-PON/GPON services, providing high-density aggregation and 100G transport flexibility, as well as 10GE point-to-point. 

“Broadband service providers need XGS-PON networks to support applications like HD and 4K content streaming, video surveillance services, and cloud-enabled interactive gaming,” said Michel Langlois, chief development officer at Calix. “The new line cards and optical solutions for the Intelligent Access EDGE, which is powered by the Network Innovation Platform (AXOS), radically simplifies the path to XGS-PON and 100G transport—ushering in unprecedented scale, capacity, and cost-per-bit economics. The new solutions and the Network Innovation Platform are already making it easier than ever for BSPs to build future proof 10G networks as shown by the number of service providers that installed the cards and instantly moved subscribers over.”

https://www.calix.com/solutions/intelligent_access_edge.html

NTIA receives $2.5 billion in funding requests

The U.S. Department of Commerce’s National Telecommunications and Information Administration (NTIA) received more than 230 applications for the Broadband Infrastructure Program, for a total of more than $2.5 billion in funding requests across 49 states and U.S. territories.


NTIA has begun reviewing the applications as part of the $288 million grant program, which was funded by the Consolidated Appropriations Act, 2021 (the Act). Grants will be awarded to covered partnerships between a state, or political subdivisions of a state, and providers of fixed broadband service. The program’s 90-day application window closed on Tuesday, August 17.

“The intense demand for this program across the country demonstrates the widespread need for better broadband connectivity in unserved communities,” said U.S. Secretary of Commerce Gina M. Raimondo. “These investments are critical, but there is more to be done. The bipartisan Infrastructure Investment and Jobs Act, recently passed by the Senate, will expand upon the groundwork being laid by this program to advance digital equity and get us one step closer to every American having access to high-speed, affordable, and reliable Internet.” 

HPE builds exascale supercomputer for Argonne National Lab

The U.S. Department of Energy’s Argonne National Laboratory has selected Hewlett Packard Enterprise to build a new testbed supercomputer to prepare critical workloads for future exascale systems that will deliver up to four times faster performance than Argonne’s current supercomputers.

The new system, which Argonne has named Polaris, will deliver approximately 44 petaflops of peak double precision performance and nearly 1.4 exaflops of theoretical AI performance, which is based on mixed-precision compute capabilities.

Polaris uses 280 HPE Apollo Gen10 Plus systems, which are HPC and AI architectures built for the exascale era and customized to include the following:

  • 560 2nd and 3rd Gen AMD EPYC processors
  • 2240 NVIDIA A100 Tensor Core GPUs, making it ALCF’s largest GPU-based system to date.
  • HPE Slingshot, a high performance Ethernet fabric designed for HPC and AI solutions. HPE Slingshot will also be featured in Argonne’s Aurora exascale system.
  • HPE Performance Cluster Manager, a system management software solution.

 “As we approach the exascale era, which will power a new age of insight and innovation, high performance computing (HPC) will play a critical role in harnessing data to take on the world’s most pressing challenges. Increasingly, the computational power and scale required to process artificial intelligence and machine learning data sets can only be delivered through HPC systems, and HPE uniquely provides a powerful, software-driven platform capable of tackling complex scientific data and simulations,” said Justin Hotard, senior vice president and general manager, HPC and Mission Critical Solutions at HPE. 

AWS announces two cyber security initiatives

Amazon announced two cyber security initiatives that will be offered to the public in October:


  • Cybersecurity training materials it has developed to keep its employees and sensitive information safe from cyberattack. 

  • A free multi-factor authentication (MFA) device for AWS customers designed to further secure their environments. The free MFA token adds a layer of security to protect customers’ AWS accounts against phishing, session hijacking, man-in-the-middle, and malware attacks. Customers can also use their MFA devices to safely access multiple AWS accounts, as well as other token-enabled applications, such as GitHub, Gmail, and Dropbox.


Wind River and Intel collaborate on 5G vRAN for FlexRAN

 Wind River and Intel are jointly developing a 5G vRAN solution that integrates Intel FlexRAN reference software for systems powered by 3rd Gen Intel Xeon Scalable processors with built-in AI acceleration, and also features Intel Ethernet 800 Network Adapters and the Intel vRAN Dedicated Accelerator ACC100 in concert with Wind River Studio. 

The collaboration will further expand with future next-generation Intel Xeon Scalable processors (Sapphire Rapids). 

Wind River Studio provides a cloud-native platform for the development, deployment, operations, and servicing of mission-critical intelligent systems. Its cloud infrastructure capabilities include a fully cloud-native, Kubernetes container-based architecture based on the StarlingX open source project for the deployment and management of distributed edge networks at scale. 

“As 5G opens up new opportunities across industries, there will be an increasing need to put greater intelligence and compute to the edges of the network, where new use cases evolve and thrive. As such, operators must adopt a low-latency far-edge cloud architecture to enable these new use cases in an intelligent, AI-first world,” said Kevin Dallas, president and CEO at Wind River. “Together with Intel, we are providing a best-in-class differentiated solution to help customers deliver on high-reliability, ultra-low-latency, and highly efficient offerings for their next-generation networks.”

http://www.windriver.com/studio

US Dept of Energy awards $54 million for microelectronics projects

The U.S. Department of Energy (DOE) announced nearly $54 million for 10 new projects to increase energy efficiency in microelectronics design and production.

The research will be led by DOE’s National Laboratories and include participation from academia and industry. The research will aim to increase energy efficiency and functionality while stimulating US-based innovation as the foundation for future domestic technology development and manufacturing. These projects are “co-design” microelectronics projects, involving multi-disciplinary collaboration that takes into account the interdependencies among materials, physics, architectures, and software.  

https://www.energy.gov/articles/us-department-energy-announces-54-million-increase-energy-efficiency-microelectronics

Snowflake clocks Q2 revenue of $272.2 million, up 104% yoy

Snowflake, which provides data cloud services reported revenue of $272.2 million for its second quarter of fiscal 2022, ended July 31, 2021. This represents 104% year-over-year growth. 

Product revenue for the quarter was $254.6 million, representing 103% year-over-year growth. Remaining performance obligations were $1.5 billion, representing 122% year-over-year growth. Net revenue retention rate was 169% as of July 31, 2021. The company now has 4,990 total customers and 116 customers with trailing 12-month product revenue greater than $1 million. 

“Snowflake saw continued momentum in Q2 with triple-digit growth in product revenue, reflecting strength in customer consumption,” said Snowflake Chairman and CEO Frank Slootman. “While increasing net revenue retention rate to 169%, we also boosted gross margin and operating margin efficiency while our adjusted free cash flow was positive for the third quarter in a row.”

Snowflake's customers use the Data Cloud to unite siloed data, discover and securely share data, and execute diverse analytic workloads.



NTIA establishes two broadband-focused offices


 The U.S. Department of Commerce’s National Telecommunications and Information Administration (NTIA) announced the establishment of the Office of Internet Connectivity and Growth (OICG) and the Office of Minority Broadband Initiatives (OMBI).

  • The Office of Internet Connectivity and Growth  will house all broadband activities at NTIA, including three active broadband grant programs: the Broadband Infrastructure Program, the Tribal Broadband Connectivity Program and the Connecting Minority Communities Pilot Program. The office will also house BroadbandUSA, which provides community outreach, support for state leaders, technical assistance, and helps coordinate federal broadband resources and programs.  The OICG will be led by Douglas Kinkoph, who has served as the head of NTIA’s broadband program since 2015. The 
  • The Office of Minority Broadband Initiatives codifies NTIA’s work on its Minority Broadband Initiative since 2018. The OMBI, established within the OICG, fulfills requirements of the Connecting Minority Communities provisions enacted into law as part of the Consolidated Appropriations Act, 2021. The office will continue NTIA’s efforts to collaborate with federal agencies; state, local and tribal governments; Historically Black Colleges and Universities, Tribal Colleges and Universities and Minority-Serving Institutions; and any interested stakeholders to promote initiatives related to expanding connectivity and digital opportunities for anchor communities.




Tuesday, August 24, 2021

Windstream Wholesale announces 3 new fiber routes

Windstream Wholesale has begun the initial work to add fiber to three routes on its rapidly expanding transport network: New York City to Albany to Montreal; Jacksonville, Florida, to Savannah, Georgia, to Myrtle Beach, South Carolina, to Raleigh, North Carolina; and Tulsa to Muskogee, Oklahoma, to Little Rock, Arkansas. 

Windstream said these three new routes are part of its initiative to expand its fiber infrastructure and provide a rich set of high-bandwidth WAN advantages including low-latency transport to major data and international hubs across the U.S., including in Miami, New York City, Dallas, Los Angeles and San Jose. The project will pull high-count fibers through existing conduits on some spans as well as construction of some new paths on other segments. Diverse routing options protect networks against outages, while delivering coast-to-coast transport, as well as connectivity to thousands of Windstream-lit buildings across the U.S.

Windstream’s recently announced offerings include:

  • Dark fiber and lit transport services from the Hillsboro, Oregon, ecosystem to Portland, Seattle, Sacramento, Salt Lake City, and points beyond. Diversity options include multiple routes from Hillsboro to Portland to include or avoid the Pittock Block data centers.
  • Access from the Jacksonville and Boca Raton international cable landing stations to all major U.S. data centers.
  • Wave services up to 400G, with the first commercial deployment turned up in 2020.

Windstream Wholesale continues to leverage its new Intelligent Converged Optical Network (ICON) with efficiency, speed, and diversity in mind, providing a high-bandwidth infrastructure that will enable the digital transformation and innovation needed for today’s rapidly evolving businesses. 

https://www.windstreamenterprise.com/wp-content/uploads/2018/02/national-network-map.pdf

Arista expands its R3-Series routers for next-gen edge

 Arista Networks introduced new routers and enhancements to its EOS (Extensible Operating System) for next-generation network edge roles in the multi-cloud era. 

The new capabilities for virtual private networking and traffic engineering enable three additional edge use cases for multi cloud, metro and 5G RAN based on Arista’s cloud-grade routing principles.

  • Multi Cloud Edge: Demand for public cloud services is creating the new cloud edge, created by the cloud footprint at the network edge to deliver services closer to the end customer. Cloud edges are being built globally, with 100G/400G directly connecting to the cloud, based on a repeatable Layer 3 architecture, common software-driven provisioning and programmatic traffic steering, to deliver uninterrupted service that scales globally.
  • Metro Edge: Legacy router designs are degrading quality and end-user experiences for service providers. To meet the new bandwidth demand and faster connectivity for E-LINE and E-LAN services, service providers are upgrading their metro ethernet edge with Capex efficient, high density merchant silicon-based 100G/400G routing platforms. Additionally, to achieve Opex efficiency, service providers are simplifying protocol complexity by adopting a single protocol for multiple edge VPN services and driving consistent automation for the metro fabric - the combination for faster and scalable service delivery.
  • 5G RAN Edge: 5G architecture is disaggregating traditional mobile backhaul, bringing the public cloud footprint in the RAN (Radio Access Network) for real-time localized service updates. To address bandwidth demand from distributed nodes and a radically scaled user/device and traffic profiles, 5G edge requires scale-out repeatable routing design with high speed, high-performance connectivity, a single OS for open standards-based protocols, and consistent automation framework across the mobile backhaul and Multi-access Edge Compute (MEC) deployments, enabling Opex efficiency and faster time to market for new services.

The features for the new routing use cases are available now in the latest EOS release.

Additions and updates to the Arista R3-Series include:

7800R3 and 7500R3 modular systems scaling to 460Tbps of capacity

  • New 7500R3 and 7800R3 line cards with native 25G SFP ports for flexible scaleout of edge routing applications
  • Expanded 7800R3 range with 16-slots for up to 576 400G or 768 100G ports

7280R3 Series of 1U and 2U systems scales up to 9.6Tbps with 24 ports of 400G in 1U and with newly released options expanding the solutions for network edge

  • 7280CR3MK-32P4S and 7280CR3MK-32D4S with 32 100G ports and four 400G ports providing both routing scale and integrated MACsec encryption at 100G
  • 7280CR3-36S and 7280CR3K-36S, offering 36 100G ports and flexible port modes for all network edge roles from 10G to 400G
  • 7280SR3M-48YC8, offering 48 25G ports plus 8 100G ports with MACsec encryption
  • 7280SR3-40YC6, offering 40 25G ports plus 6 100G ports for aggregation and access deployment
https://www.arista.com/en/company/news/press-release/12922-pr-20210824

Mavenir demos first 2G containerized architecture

Mavenir announced the commercial readiness of a containerized GSM 2G architecture using an enhanced fronthaul (FH) interface between the Multi Radio Access Technology (MRAT), Remote Radiohead Unit (RRU) and the Distributed Unit (DU) and demonstrating full frequency hopping, multiple TRX’s, multiple codecs, ciphering and handovers in readiness for commercial deployments.

Mavenir combined the 2G technology from its ip.access acquisition and containerized the GSM layer 1, 2 and 3 protocols of 2G in the DU microservices architecture that can be run in parallel and on the same platform with the 4G/5G network architecture.

In addition, Mavenir has developed an enhanced 2G interface MRAT protocol on top of the O-RAN Alliance-based enhanced Common Public Radio Interfaces (eCPRI) interface with minimal adaptation and will make this combined interface openly available by standardizing the interface in the O-RAN Alliance. This containerized solution is scalable with the feature rich and industry leading Mavenir Webscale Platform as well as other 3rd party webscale platforms.

“Mavenir is excited to have developed and demonstrated a world’s first, viability of an Open vRAN containerized architecture for 2G with the addition of multiple air interface protocols using an O-RAN based architecture,” said Pardeep Kohli, president and CEO of Mavenir. “This milestone enables us to readily support operators in making a complete swap from proprietary Radio Access Network (RAN) solutions to open interfaces, and virtualized Web-Scale architectures.”

Mavenir will contribute to O-RAN Alliance in the standardization of the fronthaul interface for 2G. The Mavenir solution also brings the advantages of Open RAN lower layer split (LLS) mode to the DU Architecture allowing CSPs to centralize the 2G DUs as well freeing up space and complexity at the tower site. This also enables pooling of the Central Processing Unit (CPU) resources across several sites.

https://www.mavenir.com/press-releases/mavenir-demonstrates-worlds-first-2g-containerized-architecture/


Palo Alto Networks sees rapid growth in SASE

Palo Alto Networks reported revenue of $1.2 billion for its fiscal fourth quarter 2021, ended July 31, 2021, compared with total revenue of $950.4 million for the fiscal fourth quarter 2020. GAAP net loss for the fiscal fourth quarter 2021 was $119.3 million, or $1.23 loss per diluted share, compared with GAAP net loss of $58.9 million, or $0.61 per diluted share, for the fiscal fourth quarter 2020.

Non-GAAP net income for the fiscal fourth quarter 2021 was $161.9 million, or $1.60 per diluted share, compared with non-GAAP net income of $144.9 million, or $1.48 per diluted share, for the fiscal fourth quarter 2020. A reconciliation between GAAP and non-GAAP information is contained in the tables below.

"Our strong Q4 performance was the culmination of executing on our strategy throughout the year, including product innovation, platform integration, business model transformation and investments in our go-to-market organization," said Nikesh Arora, chairman and CEO of Palo Alto Networks. "In particular, we saw notable strength in large customer transactions with strategic commitments across our Strata, Prisma and Cortex platforms."  



https://www.paloaltonetworks.com/company/press/2021/palo-alto-networks-reports-fiscal-fourth-quarter-2021-financial-results

Cerebras advances its "Brain-scale AI"

Cerebras Systems disclosed progress in its mission to deliver a "brain-scale" AI solution capable of supporting neural network models of over 120 trillion parameters in size. 

Cerebras’ new technology portfolio contains four innovations: Cerebras Weight Streaming, a new software execution architecture; Cerebras MemoryX, a memory extension technology; Cerebras SwarmX, a high-performance interconnect fabric technology; and Selectable Sparsity, a dynamic sparsity harvesting technology.

  • Cerebras Weight Streaming enables the ability to store model parameters off-chip while delivering the same training and inference performance as if they were on chip. This new execution model disaggregates compute and parameter storage – allowing researchers to flexibly scale size and speed independently – and eliminates the latency and memory bandwidth issues that challenge large clusters of small processors. It is designed to scale from 1 to up to 192 CS-2s with no software changes.
  • Cerebras MemoryX is a memory extension technology. MemoryX will provide the second-generation Cerebras Wafer Scale Engine (WSE-2) up to 2.4 Petabytes of high performance memory, all of which behaves as if it were on-chip. With MemoryX, CS-2 can support models with up to 120 trillion parameters.
  • Cerebras SwarmX is a high-performance, AI-optimized communication fabric that extends the Cerebras Swarm on-chip fabric to off-chip. SwarmX is designed to enable Cerebras to connect up to 163 million AI optimized cores across up to 192 CS-2s, working in concert to train a single neural network.
  • Selectable Sparsity enables users to select the level of weight sparsity in their model and provides a direct reduction in FLOPs and time-to-solution. Weight sparsity is an exciting area of ML research that has been challenging to study as it is extremely inefficient on graphics processing units. Selectable sparsity enables the CS-2 to accelerate work and use every available type of sparsity—including unstructured and dynamic weight sparsity—to produce answers in less time.

“Today, Cerebras moved the industry forward by increasing the size of the largest networks possible by 100 times,” said Andrew Feldman, CEO and co-founder of Cerebras. “Larger networks, such as GPT-3, have already transformed the natural language processing (NLP) landscape, making possible what was previously unimaginable. The industry is moving past 1 trillion parameter models, and we are extending that boundary by two orders of magnitude, enabling brain-scale neural networks with 120 trillion parameters.”

https://cerebras.net/news/cerebras-systems-announces-worlds-first-brain-scale-artificial-intelligence-solution/


Cerebras unveils 2nd-gen, 7nm Wafer Scale Engine chip

Cerebras Systems introduced its Wafer Scale Engine 2 (WSE-2) AI processor, boasting 2.6 trillion transistors and 850,000 AI optimized cores.

The wafer-sized processor, which is manufactured by TSMC on its 7nm-node, more than doubles all performance characteristics on the chip - the transistor count, core count, memory, memory bandwidth and fabric bandwidth - over the first generation WSE. 

“Less than two years ago, Cerebras revolutionized the industry with the introduction of WSE, the world’s first wafer scale processor,” said Dhiraj Mallik, Vice President Hardware Engineering, Cerebras Systems. “In AI compute, big chips are king, as they process information more quickly, producing answers in less time – and time is the enemy of progress in AI. The WSE-2 solves this major challenge as the industry’s fastest and largest AI processor ever made.”


The processors powers the Cerebras CS-2 system, which the company says delivers hundreds or thousands of times more performance than legacy alternatives, replacing clusters of hundreds or thousands of graphics processing units (GPUs) that consume dozens of racks, use hundreds of kilowatts of power, and take months to configure and program. The CS-2 fits in one-third of a standard data center rack.

Early deployment sites for the first generation Cerebras WSE and CS-1 included Argonne National Laboratory, Lawrence Livermore National Laboratory, Pittsburgh Supercomputing Center (PSC) for its groundbreaking Neocortex AI supercomputer, EPCC, the supercomputing centre at the University of Edinburgh, pharmaceutical leader GlaxoSmithKline, and Tokyo Electron Devices, amongst others.

“At GSK we are applying machine learning to make better predictions in drug discovery, so we are amassing data – faster than ever before – to help better understand disease and increase success rates,” said Kim Branson, SVP, AI/ML, GlaxoSmithKline. “Last year we generated more data in three months than in our entire 300-year history. With the Cerebras CS-1, we have been able to increase the complexity of the encoder models that we can generate, while decreasing their training time by 80x. We eagerly await the delivery of the CS-2 with its improved capabilities so we can further accelerate our AI efforts and, ultimately, help more patients.”

“As an early customer of Cerebras solutions, we have experienced performance gains that have greatly accelerated our scientific and medical AI research,” said Rick Stevens, Argonne National Laboratory Associate Laboratory Director for Computing, Environment and Life Sciences. “The CS-1 allowed us to reduce the experiment turnaround time on our cancer prediction models by 300x over initial estimates, ultimately enabling us to explore questions that previously would have taken years, in mere months. We look forward to seeing what the CS-2 will be able to do with more than double that performance.”

https://cerebras.net/product

Keysight joins Google Cloud Partner Initiative

 Keysight Technologies has joined Google Cloud’s partner initiative to support agile orchestration of 5G services at the network edge.

Keysight offers a wide range of solutions for validating early designs, system interoperability and performance, network and end-point security, as well as compliance to 3GPP and O-RAN specifications. Keysight’s end-to-end solution portfolio, built on common hardware and software platforms, enables a cloud-centric ecosystem to speed deployment of multi-access edge computing (MEC), network function virtualization (NFV) and artificial intelligence (AI) technology. This allows mobile operators to confidently orchestrate innovative wireless connectivity services at the edge of the network.

“As a Google Cloud partner, Keysight will support service providers transitioning to cloud and edge computing, which are needed for delivering advanced applications and use cases such as streaming media, cloud gaming, connected vehicles, private wireless networks and immersive experiences,” said Scott Bryden, vice president of Keysight’s operator industry solutions group. “Keysight’s solutions across wireless and wireline technologies enable hyperscalers and mobile operators to create unified, heterogenous networks that support a wide range of use cases, requirements and applications.”


KGPCo to re-sell Ribbon's Cloud & Edge and IP Optical solutions

KGPCo, a leading communications network services and supply chain provider, will re-sell Ribbon's entire portfolio of Cloud & Edge and IP Optical solutions.

Ribbon and KGPCo, which already have a number of customers in the IP Optical market including joint wins at CL Tel, Eastern Slope Rural Telephone and Tombigbee Electric Cooperative, said the expanded partnership enables both organizations to leverage their respective expertise and further extend their offerings to help service providers and utilities modernize, enhance and improve their communications networks.

"We have enjoyed a number of strategic customer wins with KGPCo for our IP Optical business and are excited to broaden our relationship to now cover our Cloud & Edge solutions," said David Hogan, Vice President of Enterprise & Channel Sales for Ribbon. "Our expanded partnership allows both organizations to leverage our individual strengths to help service providers transform their legacy networks. Additionally, having the ability to now extend KGPCo's world-class services capabilities to our customers and prospects will be a critical component of our joint successes moving forward."


Monday, August 23, 2021

Zayo lays out its 400G upgrade plan

Zayo announced the planned deployment of thirty-one high capacity, 400G-enabled long haul routes across North America and Western Europe. The significant network update is expected through Q1 of 2022. Up to 800G transmission will be available in select areas as Zayo deploys significant speed enhancements in anticipation of future network needs.

“400G is rapidly becoming the prevailing requirement for networks and Zayo is breaking new ground with its 800G capabilities,” said Brian Lillie, Chief Product and Technology Officer. “This deployment underscores Zayo’s commitment to maintaining the leading edge of communications infrastructure and providing state-of-the art network solutions critical to our customers’ digital transformation journeys.”

Zayo said its optimized wavelength network is designed to provide a direct route for multi-cloud and multi-market connectivity, ideal for content providers, hyperscalers, carriers and data centers. The upgrade will also enable reduced physical space requirements as well as reduced operation and maintenance costs resulting from a 40% reduction in power consumption.

http://wwww.zayo.is/400G

Zayo appoints Steve Smith as its new CEO

Zayo Group named Steve Smith as Chief Executive Officer, replacing Dan Caruso.. Smith was recently a Managing Director of the Private Equity firm GI Partners. Before that, he was CEO of Equinix for over 10 years, growing revenues from $400 million to $4.4 billion across 200 data centers, in 52 markets. He is a West Point graduate and an 8-year Army veteran.“Steve’s track record successfully managing growing digital infrastructure businesses...

Seaborn appoints Steve Orlando as CEO

Seaborn Networks appointed Steve Orlando as its new Chief Executive Officer.Orlando brings 27 years of experience across senior leadership positions at Zayo Group, Orlando joins Seaborn from Zayo Group, where he served as the Senior Vice President of Fiber and Network Solutions. In this role, he led product, operations and network development to support indirect and direct sales for the organization across 18 states in the Central Region. He...

Citing increased demand to 100G ports, Zayo announced a significant boost to its IP Transit capacity in key metro markets across the United States. Zayo recently completed upgrades to support 100G IP Transit in Phoenix, San Jose and Denver. These three metro areas join Atlanta, Boston, New York, Miami, San Francisco and Seattle in benefiting from Zayo’s 100G enabled services. “We're also meeting requests from higher bandwidth consumers as they...

Zayo adds U.S. wavelength routes

Zayo announced four new long-haul optical wavelength routes in the U.S: Miami to New Orleans features a high-capacity DWDM network, an architecture used to increase bandwidth. This route, which provides a diverse route out of Miami, provides an option for Latin American carriers that require backhaul from cable landing stations in the area. With completion expected in the third calendar quarter, the route will expand Zayo’s growing presence in...


Djibouti Telecom doubles capacity of DARE1 cable with Ciena

Djibouti Telecom is deploying Ciena’s GeoMesh Extreme submarine network solution to upgrade its DARE1 (Djibouti Africa Regional Express1) network serving the East Africa region. The upgrade utilizes Ciena's 6500 Packet-Optical Platform powered by the WaveLogic family, allowing a doubling of line rates to 400 Gbps. Spectrum Sharing capabilities enable the partitioning of submarine optical spectrum to different end users for more efficient use of undersea assets. The network is managed via Ciena’s Manage, Control and Plan (MCP) domain controller.

Located on the northeast coast of the Horn of Africa, Djibouti is situated on the Bab el-Mandeb Strait—one of the world’s busiest shipping routes serving the Indian Ocean and Red Sea. The nation is a connectivity hub for East Africa, made possible by state-owned network provider Djibouti Telecom.


As part of a consortium of telecoms operators, Djibouti Telecom operates eight submarine cable systems, including DARE1, which crosses Djibouti, Kenya, and Somalia. The 5,000 km network, which connects the countries to data centers and content providers around the world, offers businesses and citizens access to internet, mobile, and global cloud services. 

http://www.ciena.com

DARE-1 subsea cable enters service to East Africa

The Djibouti Africa Regional Express (DARE) submarine cable system has entered service in East Africa and the Horn of Africa. 

The 4,900 km cable links Djibouti, Somalia and Kenya. The project was funded by Djibouti Telecom, Somtel, Hormuud Telecom and Telkom Kenya. Total investment was US$81 million.

DARE-1 has a design capacity of 36 Tbps, making it the largest in the region.

https://international.djiboutitelecom.dj/dare1/internet-le-cable-dare-1-mis-en-service/

IBM Telum Processor features interconnect to link up to 32 chips

IBM unveiled its upcoming Telum Processor for artificial intelligence applications. A Telum-based system is planned for the first half of 2022.

Telum is IBM's first processor that contains on-chip acceleration for AI inferencing while a transaction is taking place. The chip contains 8 processor cores with a deep super-scalar out-of-order instruction pipeline, running with more than 5GHz clock frequency, optimized for the demands of heterogenous enterprise class workloads. The completely redesigned cache and chip-interconnection infrastructure provides 32MB cache per core, and can scale to 32 Telum chips. The dual-chip module design contains 22 billion transistors and 19 miles of wire on 17 metal layers.

The chip is developed in Samsung's 7nm EUV technology node.

IBM said its Telum processor excels in AI-specific workloads, such financial services workloads like fraud detection, loan processing, clearing and settlement of trades, anti-money laundering and risk analysis. 

https://newsroom.ibm.com/2021-08-23-IBM-Unveils-On-Chip-Accelerated-Artificial-Intelligence-Processor

Intel secures foundry contract in Pentagon's RAMP-C program

The U.S. Department of Defense awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. 

The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. In October 2020, DOD launched the RAMP program using the Advanced Commercial Capabilities Project Phase 1 Other Transaction Authority. 

The contract was awarded to the newly established Intel Foundry Services business through the NSTXL consortium-based S2MARTS OTA. Financial terms were not disclosed.

“One of the most profound lessons of the past year is the strategic importance of semiconductors, and the value to the United States of having a strong domestic semiconductor industry. Intel is the sole American company both designing and manufacturing logic semiconductors at the leading edge of technology. When we launched Intel Foundry Services earlier this year, we were excited to have the opportunity to make our capabilities available to a wider range of partners, including in the U.S. government, and it is great to see that potential being fulfilled through programs like RAMP-C,” stated Pat Gelsinger, Intel CEO

Under RAMP-C Intel Foundry Services will partner with industry leaders, including IBM, Cadence, Synopsys and others, to support the U.S. government’s needs for designing and manufacturing assured integrated circuits by establishing and demonstrating a semiconductor IP ecosystem to develop and fabricate test chips on Intel 18A, Intel’s most advanced process technology.

“The RAMP-C program will enable both commercial foundry customers and the Department of Defense to take advantage of Intel’s significant investments in leading-edge process technologies,” said Randhir Thakur, Intel Foundry Services president. “Along with our customers and ecosystem partners, including IBM, Cadence, Synopsys and others, we will help bolster the domestic semiconductor supply chain and ensure the United States maintains leadership in both R&D and advanced manufacturing. We look forward to a long-term collaboration with the U.S. government as we deliver RAMP-C program milestones.”

https://www.intel.com/content/www/us/en/newsroom/news/intel-wins-us-project-develop-foundry-ecosystem.html 

U.S. DoD backs Intel for semiconductor packaging tech

The U.S. Department of Defense awarded a contract to Intel to enable the U.S. government to access Intel’s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon.

The project, which is supported by the DoD's State-of-the-Art Heterogeneous Integration Prototype (SHIP) program,  is executed by the Naval Surface Warfare Center, Crane Division, and administered by the National Security Technology Accelerator.

The second phase of SHIP will develop prototypes of multichip packages and accelerate advancement of interface standards, protocols and security for heterogeneous systems. SHIP prototypes will integrate special-purpose government chips with Intel’s advanced, commercially available silicon products, including field programmable gate arrays, application-specific integrated circuits and CPUs. This combination of technologies provides new paths for the U.S. government’s industry partners to develop and modernize the government’s mission-critical systems while taking advantage of Intel’s U.S. manufacturing capabilities.

Heterogeneous packaging allows the assembly of multiple, separately manufactured integrated circuit dies (chips) onto a single package to increase performance while reducing power, size and weight. SHIP provides the U.S. government access to Intel’s advanced heterogeneous packaging technologies, including embedded multi-die interconnect bridge (EMIB), 3D Foveros and Co-EMIB (combining both EMIB and Foveros).

“Intel and the U.S. government share a priority to advance domestic semiconductor manufacturing technology. The SHIP program will enable the Department of Defense to take advantage of Intel’s advanced semiconductor packaging capabilities, diversifying their supply chain and protecting their intellectual property while also supporting ongoing semiconductor R&D in the U.S. and preserving critical capabilities onshore,” stated Jim Brinker, president and general manager of Intel Federal LLC.

“To ensure that the U.S. defense industry base can continue to deliver state-of-the-art electronics for national security, it is imperative that the Department of Defense (DoD) partners with leading U.S. semiconductor companies," Nicole Petta, principal director of microelectronics, Office of the Under Secretary of Defense for Research and Engineering. "The DoD microelectronics roadmap recognizes the importance of strategic partnerships with industry. The roadmap also prioritizes and recognizes that as process scaling slows, heterogeneous assembly technology is a critical investment for both the DoD and our nation. SHIP directly contributes to advancing the objectives outlined in the DoD roadmap and the DoD looks forward to working with Intel, a world leader in this technology.”

http://www.intel.com




In 2018, Intel demonstrated a new 3D packaging technology, called "Foveros," which for the first time brings 3D stacking to logic-on-logic integration. Foveros will will allow products to be broken up into smaller “chiplets,” where I/O, SRAM and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top. The first Foveros product will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die.