Monday, March 25, 2024

New Photonics debuts Transmitter-on-Chip PIC

NewPhotonics introduced its second generation photonic integrated circuit with integrated optical equalizer for high-throughput optical interconnects. The enhanced transmitter-optimized chip offers breakthrough minimal latency and power performance at 800 GBps and 1.6 TBps for linear receive optics (LRO) and linear drive pluggable optics (LPO) applications in the data center.

The NewPhotonics NPG102 PIC is an octal and quad parallel single mode (PSM) transmitter for 8x and 4x 200G PAM4 transceivers. The silicon photonics chips monolithically integrate elements of the transmitter including laser, modulator and an optical equalizer enabling consistent optical link performance and extended distance. The best-in-class transmitter design simplifies system integration and improves OEM manufacturing yield and transceiver reliability.

The optical equalizer located closest to TP2 facilitates signal dispersion compensation that enables consistent optical link performance and interoperability. Optical signal processing enables >1000x lower latency resulting in lower system pJ/bit.

Key Highlights:

  • Performance consistency, improved distance, lower latency and power
  • Improved transceiver yields and extended reliability
  • 3.9W low power consumption
  • Simplifies system assembly with flip-chip package

"AI continues to drive data center processing needs of large language models (LLMs) ramping requirements for low power and low latency fiber connectivity," said Doron Tal, SVP and GM Optical Connectivity at NewPhotonics. "The differentiating utility of linear drive and optical equalization technology enables LPO modules to operate in all ports with different insertion losses ensuring interoperability between different host vendors and enabling a low power, low latency DSP-free alternative."

https://www.newphotonics.com/post/introducing-our-new-transmitter-on-chip-pic-with-integrated-equalizer

Intel integrates 224Gbps SerDes with NewPhotonics' Engine

Intel and NewPhotonics announced a milestone achievement: the integration of Intel new 224Gbps electrical SerDes design with NewPhotonics' Photonics Engine, resulting in an end-to-end direct modulation electrical-to-optical link utilizing PAM4 modulation.The electrical-to-optical link incorporates a wide bandwidth photodetector (PD) and Modulator, supporting the end-to-end 224Gbps data transfer."We are thrilled to have achieved the successful integration...