Marvell is demonstrating a 3D Silicon Photonics Engine designed for next-generation AI clusters and cloud data centers. The new device packs 32 channels of 200G electrical and optical interfaces for connecting next-generation AI clusters and cloud data centers at multi-terabit speeds.
The 200 Gbps device delivers 2x the bandwidth, 2x the input / output (I/O) bandwidth density, and 30% lower power per bit compared to comparable devices with 100 Gbps electrical and optical interfaces.
“Advances in optical interconnect technology are necessary to realize the promise of AI and accelerated infrastructure,” said Dr. Loi Nguyen, executive vice president and general manager of Cloud Optics at Marvell. “Our 3D SiPho engine is designed to enable higher bandwidth, higher I/O density, and lower power optical interconnects that scale cloud service providers’ infrastructure to meet the growing bandwidth needs of emerging AI services and applications.”
