Ranovus has delivered a 6.4Tbps co-packaged optics solution fo MediaTek’s next generation ASIC design platform.
Ranovus says its Odin CPO 3.0 reduces power consumption, footprint, and cost of the system by 50% compared to existing solutions. The solution enables a 6.4Tbps high-radix optical interconnect for AI/ML SoC and Ethernet applications.
- Ranovus’ monolithic Electro-Photonic Integrated Circuit (EPIC) is a single chip that includes 100Gbps TIAs, Drivers, Silicon Photonics Modulaters and Photo detectors.
- Odin CPO 3.0 includes optical features that enables passive fiber and laser die attach on the EPIC die at scale.
- Ranovus Odin IP cores are available for development of a new category of Application Specific Optical Engines (ASOE) for high capacity AI/ML workloads.
“Working together with MediaTek to realize this next-genera`on CPO plaaorm has helped usher in a new era for high-density op`cal interconnect in the AI/ML and Ethernet ecosystem,” said Hojjat Salemi, Chief Business Development Officer at Ranovus. “This plaaorm will play a cri`cal role in accelera`ng data movement in scale up/scale out AI/ML SoCs and Ethernet.”
