Taiwan-based Accton Technology introduced a series of 800G-optimized products that can provide Ethernet-based fabric and Virtual Output Queue (VoQ) based fabric for AI/ML workloads.
The announcement includes a 2RU 51.2 Tbps Ethernet-based fabric system with 64x800G ports, a 4RU 51.2 Tbps Ethernet-based fabric system with 128x400G ports, and a VoQ-based fabric Distributed Disaggregated Chassis (DDC) architecture with a 128x800G Network Cloud Fabric (NCF) engine.
Accton said its 51.2 Tbps Broadcom StrataXGS Tomahawk 5 series-based system with 64x800G or 128x400G ports provides a high-radix, deployment-friendly Ethernet-fabric. The 2RU system design is packed in a compact form factor with power and fan tray redundancy to achieve five-nines high availability and a wide environmental operating range for data center cloud applications.
Accton’s Broadcom StrataDNX Jericho3-AI and StrataDNX Ramon3 systems are designed to form a VoQ-based fabric DDC Network Cloud Cluster that is optimized to support AI/ML applications. The Broadcom Jericho3-AI based Network Cloud Packet Forwarder (NCP) supports a 14.4 Tbps full-duplex switching and features 18x800G OSFP network interface ports and 20x800G OSFP fabric interface ports. The Broadcom Ramon3-based Network Cloud Fabric (NCF) engine supports a 51.2 Tbps switching capacity. The cell-based switching eliminates the Ethernet overhead and can effectively load balance all fabric links to build an efficient and high-availability DDC cluster.
With Accton’s 6RU, dual-Ramon3, 128x800G (dual-51.2 Tbps) fabric port switch and 2RU, Jericho3-AI, 18x800G (14.4 Tbps leaf) Ethernet network interface port switch, customers can build a 32K-GPU 800G/400G AI/ML cluster with a two-stage DDC network architecture to enable 400G GPU clusters now and migrate to 800G GPU clusters later with a software upgrade without replacing the switches. This provides excellent cost saving and investment protection that reduces capital spending while providing the flexibility for customers to “pay as you grow” without large upfront cost to enable AI and ML applications.
Michael K.T. Lee, Sr. Vice President of Research and Development Center, at Accton said, “Broadcom’s Tomahawk 5 and Roman3/Jericho3-AI form the building blocks of Accton’s 800G-optimized products for next-generation AI/ML clusters. We are proud of Accton's engineers who have excelled in the innovative design and development of these groundbreaking 800G systems. The significant increase in radix and throughput offered by the 800G AI fabric together with the reduced power consumption delivers a performance that will push the boundaries of efficiency in AI clusters.”
