Intel breaks ground on its new fab in Ohio

Intel held a groundbreaking ceremony attended by President Biden to mark the beginning of construction on two advanced chipmaking facilities in Ohio. 

Intel also announced the first phase of funding for its Ohio Semiconductor Education and Research Program. During this first phase, Intel is providing $17.7 million for eight proposals from leading institutions and collaborators in Ohio to develop semiconductor-focused education and workforce programs.

“Today marks a pivotal moment in the journey to build a more geographically balanced and resilient semiconductor supply chain. The establishment of the Silicon Heartland is testament to the power of government incentives to unlock private investment, create thousands of high-paying jobs, and benefit U.S. economic and national security. We would not be here today without the support of leaders in the administration, Congress and the state of Ohio, who share a vision to help restore the United States to its rightful place as a leader in advanced chipmaking,” stated Pat Gelsinger, Intel CEO.

https://www.intel.com/content/www/us/en/newsroom/news/intel-announces-next-us-site-landmark-investment-ohio.html#gs.c25ibm

Intel expands its manufacturing plans

Sunday, January 23, 2022  Intel, Silicon  

Intel will invest more than $20 billion in the construction of two new fabs in Ohio. The initial phase of the project is expected to create 3,000 Intel jobs and 7,000 construction jobs over the course of the build. Air Products, Applied Materials, LAM Research and Ultra Clean Technology will establish a physical presence in the region. Initial production is targetted for 2025.Today’s investment marks another significant way Intel is leading the effort...

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