IBM announced significant advances in its path to integrate electrical and optical devices on the same piece of silicon. The new CMOS Integrated Silicon Nanophotonics, which is the result of a decade of development at IBM's global Research laboratories, promises over 10X improvement in integration density than is feasible with current manufacturing techniques.
IBM said it anticipates that Silicon Nanophotonics will dramatically increase the speed and performance between chips. In addition to combining electrical and optical devices on a single chip, the new IBM technology can be produced on the front-end of a standard CMOS manufacturing line. Transistors can share the same silicon layer with silicon nanophotonics devices. To make this approach possible, IBM researchers have developed a suite of integrated ultra-compact active and passive silicon nanophotonics devices that are all scaled down to the diffraction limit -- the smallest size that dielectric optics can afford. This makes possible the integration of modulators, germanium photodetectors and ultra-compact wavelength-division multiplexers with high-performance analog and digital CMOS circuitry.
"The development of the Silicon Nanophotonics technology brings the vision of on-chip optical interconnections much closer to reality," said Dr. T.C. Chen, vice president, Science and Technology, IBM Research. "With optical communications embedded into the processor chips, the prospect of building power-efficient computer systems with performance at the Exaflop level is one step closer to reality."
"Our CMOS Integrated Nanophotonics breakthrough promises unprecedented increases in silicon chip function and performance via ubiquitous low-power optical communications between racks, modules, chips or even within a single chip itself," said Dr. Yurii A. Vlasov, Manager of the Silicon Nanophotonics Department at IBM Research. "The next step in this advancement is to establishing manufacturability of this process in a commercial foundry using IBM deeply scaled CMOS processes."
IBM has been pursuing an ambitious Exascale computing program, which is aimed at developing a supercomputer that can perform one million trillion calculations—or an Exaflop—in a single second. This development is seen as a milestone along this path.
http://www.research.ibm.com/photonics
IBM said it anticipates that Silicon Nanophotonics will dramatically increase the speed and performance between chips. In addition to combining electrical and optical devices on a single chip, the new IBM technology can be produced on the front-end of a standard CMOS manufacturing line. Transistors can share the same silicon layer with silicon nanophotonics devices. To make this approach possible, IBM researchers have developed a suite of integrated ultra-compact active and passive silicon nanophotonics devices that are all scaled down to the diffraction limit -- the smallest size that dielectric optics can afford. This makes possible the integration of modulators, germanium photodetectors and ultra-compact wavelength-division multiplexers with high-performance analog and digital CMOS circuitry.
"The development of the Silicon Nanophotonics technology brings the vision of on-chip optical interconnections much closer to reality," said Dr. T.C. Chen, vice president, Science and Technology, IBM Research. "With optical communications embedded into the processor chips, the prospect of building power-efficient computer systems with performance at the Exaflop level is one step closer to reality."
"Our CMOS Integrated Nanophotonics breakthrough promises unprecedented increases in silicon chip function and performance via ubiquitous low-power optical communications between racks, modules, chips or even within a single chip itself," said Dr. Yurii A. Vlasov, Manager of the Silicon Nanophotonics Department at IBM Research. "The next step in this advancement is to establishing manufacturability of this process in a commercial foundry using IBM deeply scaled CMOS processes."
IBM has been pursuing an ambitious Exascale computing program, which is aimed at developing a supercomputer that can perform one million trillion calculations—or an Exaflop—in a single second. This development is seen as a milestone along this path.
http://www.research.ibm.com/photonics
- In March 2010, IBM announced a Germanium Avalanche Photodetector working at 40 Gbps with CMOS compatible voltages as low as 1.5V. This was the last piece of the puzzle that completes the prior development of the “nanophotonics toolbox�? of devices necessary to build the on-chip interconnects.
- In March 2008, IBM scientists announced the world’s tiniest nanophotonic switch for "directing traffic" in on-chip optical communications, ensuring that optical messages can be efficiently routed.
- December 2007, IBM scientists announced the development of an ultra-compact silicon electro-optic modulator, which converts electrical signals into the light pulses, a prerequisite for enabling on-chip optical communications.
- December 2006, IBM scientists demonstrated silicon nanophotonic delay line that was used to buffer over a byte of information encoded in optical pulses - a requirement for building optical buffers for on-chip optical communications.
launched its LTE service in the San Francisco Bay Area, offering plans starting at $55 per month including taxes and regulatory fees. Initially, METROPCS is providing Samsung Craft LTE handset with unlimited talk, text and enhanced entertainment and web browsing features.
as part of a network infrastructure upgrade to support its high throughput computing (HTC) requirements and a data environment that exceeds 15 petabytes (15 million gigabytes) per year.
The LTE network in Finland will use two frequencies: 1.8 GHz and 2.6 GHz. In the first phase, only modems for the 2.6 GHz band will be available, although the carrier expects multiple modems operating in both frequencies by spring 2011.
which is initially focusing on offering cloud-managed networking solutions for small and medium-sized businesses. Walden Venture Capital and Javelin Venture Partners are joining PARC as investors in the company.
Specifically, a Notice of Proposed Rulemaking adopted by the FCC today proposes that wireless broadband providers have equal access to television broadcast frequencies that could become available in spectrum auctions. The Notice seeks comment on establishing new allocations for both fixed and mobile wireless services in the TV broadcast bands.
The growth was due in large part to Chinese operators beginning to aggressively invest in their packet core networks after exhausting initial capacity, and, in the case of China Unicom, also preparing for the introduction of a highly popular smartphone, the iPhone 4.
vehicle in its corporate vehicle fleet -- a Ford E250 van deployed in San Leandro, California. This milestone is part of a $565 million planned investment announced in March 2009 to replace approximately 15,000 fleet vehicles with alternative-fuel models through 2018. Currently, the AT&T corporate fleet includes more than 75,900 vehicles.
Upon its completion, the network wavelength capacity will be upgraded from 10G to 40G, which will enable China Mobile to offer more ultra-broadband services and bring an enriched service experience to its subscribers. Financial terms were not disclosed.
a wholesale mobile broadband operator in Poland, has selected Huawei to deploy a commercial LTE TDD network. The contract covers Huawei's end-to-end LTE TDD/EPC (Evolved Packet Core) solution. The network will become operational in early 2011. Huawei said this represents the world's first commercial LTE TDD deployment.
its SRX1400 security gateway designed for small to mid-size enterprise, service provider and mobile operator data centers. The SRX1400 delivers security at scale against a variety of attacks and unauthorized access on critical infrastructure, including the internet connection on the Gi interface, roaming exchanges and signaling networks. The platform, which features separate control and data planes, combines carrier-class resiliency with advanced inspection and protection capabilities developed specifically for mobile networks and applications.
to further develop telecommunications infrastructure in Hungary. The money will be used to co-finance the development of Magyar Telekom's mobile networks -- 3G and LTE, and fixed line telecoms infrastructure (Next Generation Access, copper, cable) over the period 2010 -- 2013. 
Ericsson will support more than 3,000 radio base stations and approximately 8 million AXIS subscribers.
Broadband take up continues to grow in the EU with 25.6 subscriptions for every 100 citizens (23.9 one year earlier). Between July 2009 and July 2010, the number of broadband lines throughout the EU grew by 8%, compared to an 11% growth of a year before. As of July 2010 there were around 128 million fixed broadband lines in the EU, with 9 million new lines added since July 2009. There are approximately 220 million households in the EU. The growth rates are slowing as the markets mature and reach saturation. The report also notes an early trend in fixed-to-mobile broadband substitution in countries such as Finland and Sweden. 
http://www.chinamobileltd.com/
The companies are offering a ChipSet Support Package (CSSP) that enables SoftAtHome Operating Platform (SOP) to rapidly be deployed on the latest Lantiq XWAY XRX-100 family generation. The CSSP represents a set of drivers adapted to the SoftAtHome Hardware Abstraction Layer and will be made available to Lantiq's licensees providing home gateways to service providers worldwide. It enables home gateway manufacturers to accelerate porting of SOP on their devices. Service providers can thus accelerate time-to-market for delivering advanced triple- play and digital home services to their residential customers.
introduced a cloud-based "Infrastructure as a Service" that allows corporate customers to purchase CPU power at short notice and on an hourly basis. The service is free for T-Systems customers during the pilot phase (November 2010 through February 2011). 
released its "GENUS" integrated cellular-satellite smartphone. The handheld device connects to the AT&T cellular network for primary ground-based wireless connectivity, and gains satellite access connectivity through the power of TerreStar-1, the world's largest commercial communications satellite, which acts as a cell tower in the sky. It features a sleek design, internal antenna and the Windows Mobile 6.5 operating system. Users with a line of sight to the southern sky can gain access to expanded voice and data roaming coverage in the United States, Puerto Rico, U.S. Virgin Islands and in territorial waters. Multimedia features include Windows Mobile Media Player; 2.0-megapixel camera; camcorder format (H.263 simple profile); video and audio playback features and digital voice recording.
Financial terms were not disclosed. Tellabs has also hired key Zeugma personnel and will create a new research and development office in Vancouver to focus on developing Tellabs Mobile Solutions. 
Tellabs Mobile Solutions add intelligence to the wireless networks, so service providers can cut costs while delivering better user experiences on the mobile Internet.
launched the TV advertising campaign for its upcoming, "Lightning Fast" 4G LTE service.
Most recently, Roese served as the Chief Technology Officer at Nortel Networks, responsible for the company's overall R&D strategy and execution, and directing research across all product portfolios. Roese has also held senior positions at Broadcom Corporation, Enterasys Networks and Cabletron. He will be based in Huawei's North America R&D headquarters in Santa Clara, California.
