xMEMS Labs, a start-up based in Santa Clara, California, introduced ots XMC-2400 µCooling chip, an active micro-cooling solution designed for ultramobile devices and AI applications.
The all-silicon chip, which measures 1 millimeter in thickness, offers active, fan-based cooling for smartphones, tablets, and other compact devices. The XMC-2400 is notable for its compact size—96% smaller and lighter than traditional active-cooling alternatives—while being capable of moving significant volumes of air to maintain optimal device temperatures.
The new device is based on xMEMS’ piezoMEMS technology, which also powers their widely adopted micro speakers. The XMC-2400 chip is expected to be sampled to customers in early 2025, with demonstrations scheduled for September 2024. The new µCooling solution promises to redefine thermal management in mobile devices, making it an essential component for the next generation of high-performance, AI-driven devices.
- Product: XMC-2400 µCooling chip
- Size: 1 mm thick, 9.26 x 7.6 x 1.08 mm overall dimensions
- Capabilities: Active micro-cooling for mobile devices, AI applications
- Availability: Sampling begins Q1 2025
“Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, CEO and Co-Founder of xMEMS.
