Vertiv announced a new 360AI portfolio of high-density data center infrastructure solutions to support the higher cooling and power requirements of the accelerated computing IT stack.
The new Vertiv 360AI suite is supports the power and cooling needs of artificial intelligence (AI) workloads of varying scales. This suite encompasses a range of products and services including power supplies, cooling systems, enclosures, lifecycle services, and digital management tools.
The company says its suite is versatile, catering to a wide range of applications from AI test pilots and edge inferencing to large-scale AI data centers. The initial offerings are capable of handling up to 100kW per rack. Vertiv 360AI employs a variety of cooling strategies such as air-to-liquid, liquid-to-air, liquid-to-liquid, and liquid-to-refrigerant cooling to ensure optimal performance across different scenarios.
An important feature of Vertiv 360AI is its modular approach, which includes prefabricated IT, cooling, and power modules. These can be integrated and scaled according to specific needs, providing a flexible foundation for both current and future infrastructure demands. For environments lacking chilled water facilities, Vertiv 360AI solutions can incorporate indoor split chillers, offering a refrigerant-based liquid cooling option.
In addition to AI-specific solutions, Vertiv also presents an extensive selection of cooling and power technologies suited for high-performance computing (HPC) environments. This includes rear door heat exchangers, direct-to-chip liquid cooling, coolant distribution units (CDUs), free-cooling chillers, and modular data center solutions based on chilled water systems. Power infrastructure components such as uninterruptible power supplies (UPS) with lithium-ion batteries, busbar systems, switchgear, and battery energy storage systems (BESS) are also available to support microgrid applications, ensuring a comprehensive ecosystem for AI and HPC workloads.
