Co-packaged optics (CPO) were a hot topic at #OFC23 in San Diego.
In this video, Hamid Abzadeh, Chairman and CEO of Ranovus, discusses the advantages of co-package optics in module applications with direct drive technology. Co-package optics enable a significant reduction in power consumption for pluggable applications, as demonstrated by Ranovus' Odin platform. The co-package optics version of the Odin platform has a power consumption of 5 pico joules per bit (5pJ/bit), including the lasers, which is significantly lower than the re-timed version. This reduction in power consumption makes the technology ideal for AI and machine learning interconnect, which is a scalable function that could be networked through multiple GPUs and CPUs.
Abzadeh also talks about the interoperability and networkability of co-package optics technology. Renovus' Odin platform is integrated with AMD Xilinx and can be interconnected with standard-based modules, as demonstrated by the 800 gig OSFP module from a third party. Furthermore, Ranovus' own module is also interconnected with the third-party module to show the power consumption and differences between the two.
Odin is built using GlobalFoundries' Fotonix monolithic RF/CMOS silicon photonics (SiPh) platform.
