OpNext Delivers Multiplexer for 100G Coherent Transponders

Opnext introduced an ultra-high speed Surface Mount Technology (SMT) multiplexer Integrated Circuit (IC) for 100Gbps applications.


The SiGe (Silicon Germanium) 0.13nm chip was designed in-house to be used inside Opnext's coherent 40 Gbps and 100 Gbps transponder modules and subsystems.


Opnext said its 128 Gbps multiplexer IC transmits the data in 32 Gbps lanes suitable for transmission using the DP-QPSK modulation scheme, as documented in the OIF 100G Ultra Long Haul DWDM Framework, for 100GbE and OTU4 transmission in the Wide Area Network (WAN). The multiplexer IC employs Ball Grid Array (BGA) technology to allow standard SMT manufacturing processes. This enables higher density transponder designs with ICs mounted directly onto the Printed Circuit Boards (PCBs).
http://www.opnext.com