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Many optical components used in data centers, such as transceivers, incorporate free-space gaps in their designs. These gaps enable effective coupling from the laser to the Photonic Integrated Circuit (PIC) and from the PIC to the optical fiber, however, because liquids (including immersion liquids) have a different index of refraction than air, when a traditional optical component is immersed in fluid, the light path is significantly altered, rendering these devices effectively unusable for liquid cooling.
DustPhotonics’ transmit Carmel-8-IMC chip supports an optical assembly with no free-space optics. Inside the chip, lasers are butt-coupled to the PIC and the fiber is also attached directly to the PIC, thus enabling transceiver designs that can be used for both immersion and air cooling.
Ronnen Lovinger, CEO from Dust Photonics, explains:
- The application of immersion cooling for power management in next-generation data centers.
- Dust Photonics' PICs are ready for integration into cutting-edge transceivers for this immersion cooling application
- A live demonstration of their product in collaboration with Amphenol
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Dust Photonics raises US$24 million in Series B
